JP2009241153A5 - - Google Patents

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Publication number
JP2009241153A5
JP2009241153A5 JP2009079697A JP2009079697A JP2009241153A5 JP 2009241153 A5 JP2009241153 A5 JP 2009241153A5 JP 2009079697 A JP2009079697 A JP 2009079697A JP 2009079697 A JP2009079697 A JP 2009079697A JP 2009241153 A5 JP2009241153 A5 JP 2009241153A5
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JP
Japan
Prior art keywords
laser beam
hole
component
forming
pulse width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009079697A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009241153A (ja
JP5404128B2 (ja
JP2009241153A6 (ja
Filing date
Publication date
Priority claimed from EP08006084A external-priority patent/EP2105240B1/de
Application filed filed Critical
Publication of JP2009241153A publication Critical patent/JP2009241153A/ja
Publication of JP2009241153A6 publication Critical patent/JP2009241153A6/ja
Publication of JP2009241153A5 publication Critical patent/JP2009241153A5/ja
Application granted granted Critical
Publication of JP5404128B2 publication Critical patent/JP5404128B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009079697A 2008-03-28 2009-03-27 孔の製造方法 Expired - Fee Related JP5404128B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08006084A EP2105240B1 (de) 2008-03-28 2008-03-28 Verfahren zur Fertigung einer Bohrung
EP08006084.1 2008-03-28

Publications (4)

Publication Number Publication Date
JP2009241153A JP2009241153A (ja) 2009-10-22
JP2009241153A6 JP2009241153A6 (ja) 2010-01-07
JP2009241153A5 true JP2009241153A5 (https=) 2012-03-22
JP5404128B2 JP5404128B2 (ja) 2014-01-29

Family

ID=39691227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009079697A Expired - Fee Related JP5404128B2 (ja) 2008-03-28 2009-03-27 孔の製造方法

Country Status (6)

Country Link
US (1) US9597751B2 (https=)
EP (1) EP2105240B1 (https=)
JP (1) JP5404128B2 (https=)
CN (1) CN101543939B (https=)
AT (1) ATE527081T1 (https=)
RU (1) RU2490105C2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2292372B1 (de) * 2009-08-17 2012-10-03 Siemens Aktiengesellschaft Verfahren zur Herstellung eines Lochs unter Verwendung verschiedener Laserstellungen
EP2712700A1 (de) * 2010-05-04 2014-04-02 Siemens Aktiengesellschaft Laserbohren ohne Gratbildung
US20150352671A1 (en) * 2014-06-09 2015-12-10 GM Global Technology Operations LLC Laser cutting same side slug removal
CN106536123A (zh) * 2014-11-10 2017-03-22 西门子公司 利用激光在工件上加工冷却孔的方法和装置
CN105269158B (zh) * 2015-11-20 2017-04-19 西安交通大学 一种带热障涂层涡轮叶片冷却孔的高能激光分步加工方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59002985D1 (de) 1989-07-14 1993-11-11 Maho Ag Verfahren und Vorrichtung zum Herstellen von Hohlräumen in Werkstücken mittels Laserstrahls.
SU1691017A1 (ru) 1989-08-15 1991-11-15 Всесоюзный научно-исследовательский технологический институт энергетического машиностроения Способ лазерной резки
RU1812033C (ru) 1990-06-04 1993-04-30 Рославльский завод алмазного инструмента Способ получени отверстий в алмазных волоках
JP2000141069A (ja) 1998-11-10 2000-05-23 Toshiba Corp タービン翼およびその冷却孔加工方法
US6229113B1 (en) * 1999-07-19 2001-05-08 United Technologies Corporation Method and apparatus for producing a laser drilled hole in a structure
DE19960797C1 (de) 1999-12-16 2001-09-13 Mtu Aero Engines Gmbh Verfahren zum Herstellen einer Öffnung in einem metallischen Bauteil
US6420677B1 (en) 2000-12-20 2002-07-16 Chromalloy Gas Turbine Corporation Laser machining cooling holes in gas turbine components
EP1437191A1 (de) 2003-01-13 2004-07-14 Siemens Aktiengesellschaft Verfahren zur Erzeugung eines Lochs
JP2004243404A (ja) * 2003-02-17 2004-09-02 Internatl Business Mach Corp <Ibm> 穴形成方法および穴形成装置
EP2230041B1 (de) 2003-10-06 2016-02-10 Siemens Aktiengesellschaft Verfahren zur Herstellung eines Lochs
US7816625B2 (en) * 2003-10-06 2010-10-19 Siemens Aktiengesellschaft Method for the production of a hole and device
JP2005347415A (ja) 2004-06-01 2005-12-15 Miyachi Technos Corp 電気部品実装方法
JP2008502897A (ja) 2004-06-14 2008-01-31 オックスフォード バイオセンサーズ リミテッド マイクロバンド電極の製造方法
JP4821969B2 (ja) 2004-11-19 2011-11-24 大日本印刷株式会社 レーザーマーキングホログラム及びホログラムレーザーマーキング方法
EP1674193A1 (de) 2004-12-27 2006-06-28 Siemens Aktiengesellschaft Verfahren zur Herstellung eines Lochs
JP4490883B2 (ja) 2005-07-19 2010-06-30 株式会社レーザーシステム レーザ加工装置およびレーザ加工方法
NL1030195C2 (nl) * 2005-10-14 2007-04-17 Fico Bv Werkwijze en inrichting voor het met een scherpe hoek lasersnijden van dragers voor elektronische componenten.
EP1806203A1 (de) 2006-01-10 2007-07-11 Siemens Aktiengesellschaft Verfahren zur Herstellung eines Lochs
JP2007294743A (ja) 2006-04-26 2007-11-08 Hitachi Cable Ltd 光モジュール及びその製造方法
JP2008055456A (ja) 2006-08-30 2008-03-13 Sumitomo Electric Ind Ltd 半田付け方法および半田付け用レーザ装置
US7411989B2 (en) * 2006-12-13 2008-08-12 Coherent, Inc. Mechanically Q-switched CO2 laser
EP2292372B1 (de) * 2009-08-17 2012-10-03 Siemens Aktiengesellschaft Verfahren zur Herstellung eines Lochs unter Verwendung verschiedener Laserstellungen

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