JP5404128B2 - 孔の製造方法 - Google Patents

孔の製造方法 Download PDF

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Publication number
JP5404128B2
JP5404128B2 JP2009079697A JP2009079697A JP5404128B2 JP 5404128 B2 JP5404128 B2 JP 5404128B2 JP 2009079697 A JP2009079697 A JP 2009079697A JP 2009079697 A JP2009079697 A JP 2009079697A JP 5404128 B2 JP5404128 B2 JP 5404128B2
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Japan
Prior art keywords
laser beam
hole
hole wall
wall surface
cooling air
Prior art date
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Expired - Fee Related
Application number
JP2009079697A
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English (en)
Japanese (ja)
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JP2009241153A5 (https=
JP2009241153A (ja
JP2009241153A6 (ja
Inventor
ボルムス ハンス‐トーマス
ミュンツァー ヤン
ポドゴルスキ トーマス
ヴォルカース ルッツ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
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Filing date
Publication date
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Application granted granted Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/001—Turbines

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Turbine Rotor Nozzle Sealing (AREA)
JP2009079697A 2008-03-28 2009-03-27 孔の製造方法 Expired - Fee Related JP5404128B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08006084A EP2105240B1 (de) 2008-03-28 2008-03-28 Verfahren zur Fertigung einer Bohrung
EP08006084.1 2008-03-28

Publications (4)

Publication Number Publication Date
JP2009241153A JP2009241153A (ja) 2009-10-22
JP2009241153A6 JP2009241153A6 (ja) 2010-01-07
JP2009241153A5 JP2009241153A5 (https=) 2012-03-22
JP5404128B2 true JP5404128B2 (ja) 2014-01-29

Family

ID=39691227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009079697A Expired - Fee Related JP5404128B2 (ja) 2008-03-28 2009-03-27 孔の製造方法

Country Status (6)

Country Link
US (1) US9597751B2 (https=)
EP (1) EP2105240B1 (https=)
JP (1) JP5404128B2 (https=)
CN (1) CN101543939B (https=)
AT (1) ATE527081T1 (https=)
RU (1) RU2490105C2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2292372B1 (de) * 2009-08-17 2012-10-03 Siemens Aktiengesellschaft Verfahren zur Herstellung eines Lochs unter Verwendung verschiedener Laserstellungen
EP2712700A1 (de) * 2010-05-04 2014-04-02 Siemens Aktiengesellschaft Laserbohren ohne Gratbildung
US20150352671A1 (en) * 2014-06-09 2015-12-10 GM Global Technology Operations LLC Laser cutting same side slug removal
CN106536123A (zh) * 2014-11-10 2017-03-22 西门子公司 利用激光在工件上加工冷却孔的方法和装置
CN105269158B (zh) * 2015-11-20 2017-04-19 西安交通大学 一种带热障涂层涡轮叶片冷却孔的高能激光分步加工方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59002985D1 (de) 1989-07-14 1993-11-11 Maho Ag Verfahren und Vorrichtung zum Herstellen von Hohlräumen in Werkstücken mittels Laserstrahls.
SU1691017A1 (ru) 1989-08-15 1991-11-15 Всесоюзный научно-исследовательский технологический институт энергетического машиностроения Способ лазерной резки
RU1812033C (ru) 1990-06-04 1993-04-30 Рославльский завод алмазного инструмента Способ получени отверстий в алмазных волоках
JP2000141069A (ja) 1998-11-10 2000-05-23 Toshiba Corp タービン翼およびその冷却孔加工方法
US6229113B1 (en) * 1999-07-19 2001-05-08 United Technologies Corporation Method and apparatus for producing a laser drilled hole in a structure
DE19960797C1 (de) 1999-12-16 2001-09-13 Mtu Aero Engines Gmbh Verfahren zum Herstellen einer Öffnung in einem metallischen Bauteil
US6420677B1 (en) 2000-12-20 2002-07-16 Chromalloy Gas Turbine Corporation Laser machining cooling holes in gas turbine components
EP1437191A1 (de) 2003-01-13 2004-07-14 Siemens Aktiengesellschaft Verfahren zur Erzeugung eines Lochs
JP2004243404A (ja) * 2003-02-17 2004-09-02 Internatl Business Mach Corp <Ibm> 穴形成方法および穴形成装置
EP2230041B1 (de) 2003-10-06 2016-02-10 Siemens Aktiengesellschaft Verfahren zur Herstellung eines Lochs
US7816625B2 (en) * 2003-10-06 2010-10-19 Siemens Aktiengesellschaft Method for the production of a hole and device
JP2005347415A (ja) 2004-06-01 2005-12-15 Miyachi Technos Corp 電気部品実装方法
JP2008502897A (ja) 2004-06-14 2008-01-31 オックスフォード バイオセンサーズ リミテッド マイクロバンド電極の製造方法
JP4821969B2 (ja) 2004-11-19 2011-11-24 大日本印刷株式会社 レーザーマーキングホログラム及びホログラムレーザーマーキング方法
EP1674193A1 (de) 2004-12-27 2006-06-28 Siemens Aktiengesellschaft Verfahren zur Herstellung eines Lochs
JP4490883B2 (ja) 2005-07-19 2010-06-30 株式会社レーザーシステム レーザ加工装置およびレーザ加工方法
NL1030195C2 (nl) * 2005-10-14 2007-04-17 Fico Bv Werkwijze en inrichting voor het met een scherpe hoek lasersnijden van dragers voor elektronische componenten.
EP1806203A1 (de) 2006-01-10 2007-07-11 Siemens Aktiengesellschaft Verfahren zur Herstellung eines Lochs
JP2007294743A (ja) 2006-04-26 2007-11-08 Hitachi Cable Ltd 光モジュール及びその製造方法
JP2008055456A (ja) 2006-08-30 2008-03-13 Sumitomo Electric Ind Ltd 半田付け方法および半田付け用レーザ装置
US7411989B2 (en) * 2006-12-13 2008-08-12 Coherent, Inc. Mechanically Q-switched CO2 laser
EP2292372B1 (de) * 2009-08-17 2012-10-03 Siemens Aktiengesellschaft Verfahren zur Herstellung eines Lochs unter Verwendung verschiedener Laserstellungen

Also Published As

Publication number Publication date
US20090283508A1 (en) 2009-11-19
EP2105240B1 (de) 2011-10-05
CN101543939A (zh) 2009-09-30
JP2009241153A (ja) 2009-10-22
RU2009111329A (ru) 2010-10-10
RU2490105C2 (ru) 2013-08-20
EP2105240A1 (de) 2009-09-30
CN101543939B (zh) 2014-12-31
ATE527081T1 (de) 2011-10-15
US9597751B2 (en) 2017-03-21

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