CN106536123A - 利用激光在工件上加工冷却孔的方法和装置 - Google Patents

利用激光在工件上加工冷却孔的方法和装置 Download PDF

Info

Publication number
CN106536123A
CN106536123A CN201480080696.1A CN201480080696A CN106536123A CN 106536123 A CN106536123 A CN 106536123A CN 201480080696 A CN201480080696 A CN 201480080696A CN 106536123 A CN106536123 A CN 106536123A
Authority
CN
China
Prior art keywords
hole
machining
workpiece
laser pulse
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480080696.1A
Other languages
English (en)
Inventor
李红涛
贝克·托马斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of CN106536123A publication Critical patent/CN106536123A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/001—Turbines

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

一种利用激光在工件上加工冷却孔的方法，所述冷却孔(10)包括型孔部(11)，该方法包括以下步骤：依据所述型孔部的几何参数向工件(20)上待加工所述型孔部的位置的粗加工部位发射第一激光脉冲，去除所述工件在所述粗加工部位(11A)的材料，完成所述型孔部的粗加工；依据所述型孔部的几何参数向所述型孔部粗加工部位以外的加工余量部位发射第二激光脉冲，去除所述工件在所述加工余量部位(11B)的材料余量，完成所述型孔部的精加工；所述第一激光脉冲的能量大于第二激光脉冲的能量；还公开了一种利用激光在工件上加工冷却孔的装置，在工件上加工冷却孔的系统以及一种机器可读的存储介质。

Description

PCT国内申请，说明书已公开。

Claims (10)

  1. PCT国内申请，权利要求书已公开。
CN201480080696.1A 2014-11-10 2014-11-10 利用激光在工件上加工冷却孔的方法和装置 Pending CN106536123A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/090738 WO2016074135A1 (zh) 2014-11-10 2014-11-10 利用激光在工件上加工冷却孔的方法和装置

Publications (1)

Publication Number Publication Date
CN106536123A true CN106536123A (zh) 2017-03-22

Family

ID=55953541

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480080696.1A Pending CN106536123A (zh) 2014-11-10 2014-11-10 利用激光在工件上加工冷却孔的方法和装置

Country Status (4)

Country Link
US (1) US11117222B2 (zh)
EP (1) EP3219431A4 (zh)
CN (1) CN106536123A (zh)
WO (1) WO2016074135A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109732202B (zh) * 2019-02-26 2021-01-15 江苏大学 一种深微孔超快激光旋切加工方法
CN114799541A (zh) * 2021-01-19 2022-07-29 深圳市大族数控科技股份有限公司 基于超快激光的多轴微盲孔加工方法和系统
CN113146074A (zh) * 2021-02-25 2021-07-23 贵阳航发精密铸造有限公司 一种涡轮叶片上的气膜孔的加工方法
US20230193772A1 (en) * 2021-12-21 2023-06-22 Raytheon Technologies Corporation Fabrication of cooling holes using laser machining and ultrasonic machining

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6420677B1 (en) * 2000-12-20 2002-07-16 Chromalloy Gas Turbine Corporation Laser machining cooling holes in gas turbine components
US6744010B1 (en) * 1991-08-22 2004-06-01 United Technologies Corporation Laser drilled holes for film cooling
US20040200807A1 (en) * 2003-04-14 2004-10-14 Meyer Tool, Inc. Complex hole shaping
DE102004034721A1 (de) * 2004-07-17 2006-02-16 Alstom Technology Ltd Verfahren zum Ausbilden einer Bohrung
US20070025852A1 (en) * 2005-07-26 2007-02-01 Snecma Cooling channel formed in a wall
CN101119826A (zh) * 2005-01-14 2008-02-06 西门子公司 制造孔的方法和设备
CN101332559A (zh) * 2008-07-18 2008-12-31 西安交通大学 无重铸层微深孔的激光复合加工及修形方法
EP2428646A1 (de) * 2005-04-12 2012-03-14 Siemens Aktiengesellschaft Bauteil mit Filmkühlloch
US20130020294A1 (en) * 2011-07-19 2013-01-24 Pratt & Whitney Canada Corp. Laser drilling methods of shallow-angled holes
CN103990910A (zh) * 2014-05-20 2014-08-20 西安交通大学 一种带热障涂层涡轮叶片气膜冷却孔的制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59802893D1 (de) * 1998-03-23 2002-03-14 Alstom Nichtkreisförmige Kühlbohrung und Verfahren zur Herstellung derselben
US6864459B2 (en) 2001-02-08 2005-03-08 The Regents Of The University Of California High precision, rapid laser hole drilling
US6809291B1 (en) 2002-08-30 2004-10-26 Southeastern Universities Research Assn., Inc. Process for laser machining and surface treatment
WO2005044508A1 (de) * 2003-10-06 2005-05-19 Siemens Aktiengesellschaft Verfahren zur herstellung eines lochs und vorrichtung
EP2105240B1 (de) * 2008-03-28 2011-10-05 Siemens Aktiengesellschaft Verfahren zur Fertigung einer Bohrung
US8964801B2 (en) 2009-06-11 2015-02-24 Esi-Pyrophotonics Lasers, Inc. Method and system for stable and tunable high power pulsed laser system
EP2286955B1 (de) 2009-08-17 2012-06-13 Siemens Aktiengesellschaft Verfahren zur Herstellung eines Lochs unter Verwendung verschiedener Laserstellungen
US20110132883A1 (en) * 2009-12-07 2011-06-09 Panasonic Corporation Methods for precise laser micromachining
US20120102959A1 (en) * 2010-10-29 2012-05-03 John Howard Starkweather Substrate with shaped cooling holes and methods of manufacture
US9696035B2 (en) 2010-10-29 2017-07-04 General Electric Company Method of forming a cooling hole by laser drilling
CA2849183C (en) * 2013-05-01 2016-12-06 General Electric Company Substrate with shaped cooling holes and methods of manufacture

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6744010B1 (en) * 1991-08-22 2004-06-01 United Technologies Corporation Laser drilled holes for film cooling
US6420677B1 (en) * 2000-12-20 2002-07-16 Chromalloy Gas Turbine Corporation Laser machining cooling holes in gas turbine components
US20040200807A1 (en) * 2003-04-14 2004-10-14 Meyer Tool, Inc. Complex hole shaping
DE102004034721A1 (de) * 2004-07-17 2006-02-16 Alstom Technology Ltd Verfahren zum Ausbilden einer Bohrung
CN101119826A (zh) * 2005-01-14 2008-02-06 西门子公司 制造孔的方法和设备
EP2428646A1 (de) * 2005-04-12 2012-03-14 Siemens Aktiengesellschaft Bauteil mit Filmkühlloch
US20070025852A1 (en) * 2005-07-26 2007-02-01 Snecma Cooling channel formed in a wall
CN101332559A (zh) * 2008-07-18 2008-12-31 西安交通大学 无重铸层微深孔的激光复合加工及修形方法
US20130020294A1 (en) * 2011-07-19 2013-01-24 Pratt & Whitney Canada Corp. Laser drilling methods of shallow-angled holes
CN103990910A (zh) * 2014-05-20 2014-08-20 西安交通大学 一种带热障涂层涡轮叶片气膜冷却孔的制备方法

Also Published As

Publication number Publication date
US20170232559A1 (en) 2017-08-17
EP3219431A1 (en) 2017-09-20
EP3219431A4 (en) 2018-07-11
US11117222B2 (en) 2021-09-14
WO2016074135A1 (zh) 2016-05-19

Similar Documents

Publication Publication Date Title
JP7221002B2 (ja) ハイブリッド物品を準備するための方法
CN106681276B (zh) 机床
CN106536123A (zh) 利用激光在工件上加工冷却孔的方法和装置
KR102238862B1 (ko) 삼차원 형상 조형물의 제조 방법
US20130026144A1 (en) Method and system of laser processing for piercing
CA2694064A1 (en) Method of producing effusion holes
US20160082545A1 (en) Nc program generating device and nc program generating method
JP5861494B2 (ja) レーザ加工装置およびレーザ加工方法
CN112008262A (zh) 一种环形旋转激光智能化加工异型孔方法
CN108705692B (zh) 大口径kdp晶体元件表面激光损伤的微铣削修复工艺方法
EP3075485B1 (en) Laser machining method and laser machining machines
CN111375903A (zh) 一种激光加工小孔的方法
WO2015080179A1 (ja) レーザ切断加工方法及び装置並びに自動プログラミング装置
CN109466057A (zh) 消除打印拉丝的方法、fdm打印装置、存储介质和处理器
RU2771152C1 (ru) Способ изготовления пустотелых крупноразмерных компонентов турбомашины
JP4994700B2 (ja) 塗布装置、レーザ加工装置および塗布制御装置
US9517506B2 (en) Laser assisted casting of cooling hole and related system
WO2015170639A1 (ja) レーザ加工機、複合加工システム、複合加工機、及び、加工原点補正方法
US9597751B2 (en) Method for producing a hole with side-delimiting flanks in a component
JP2016022512A (ja) レーザ切断加工方法及び装置
JP2017113849A (ja) 数値制御工作機械
CN113070589B (zh) 激光切割方法、装置和计算机可读存储介质
US9636745B2 (en) Laser assisted casting of surface texture and related system
JP2017159389A (ja) エンドミルを用いた穴加工方法
JP2022503913A (ja) 工作物の材料を除去するレーザ加工方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20170322

RJ01 Rejection of invention patent application after publication