JP2010213144A5 - - Google Patents

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Publication number
JP2010213144A5
JP2010213144A5 JP2009059078A JP2009059078A JP2010213144A5 JP 2010213144 A5 JP2010213144 A5 JP 2010213144A5 JP 2009059078 A JP2009059078 A JP 2009059078A JP 2009059078 A JP2009059078 A JP 2009059078A JP 2010213144 A5 JP2010213144 A5 JP 2010213144A5
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JP
Japan
Prior art keywords
piezoelectric substrate
acoustic wave
wave device
surface acoustic
irradiating
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Application number
JP2009059078A
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English (en)
Japanese (ja)
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JP5338396B2 (ja
JP2010213144A (ja
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Priority to JP2009059078A priority Critical patent/JP5338396B2/ja
Priority claimed from JP2009059078A external-priority patent/JP5338396B2/ja
Publication of JP2010213144A publication Critical patent/JP2010213144A/ja
Publication of JP2010213144A5 publication Critical patent/JP2010213144A5/ja
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Publication of JP5338396B2 publication Critical patent/JP5338396B2/ja
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JP2009059078A 2009-03-12 2009-03-12 弾性表面波デバイスの製造方法 Active JP5338396B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009059078A JP5338396B2 (ja) 2009-03-12 2009-03-12 弾性表面波デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009059078A JP5338396B2 (ja) 2009-03-12 2009-03-12 弾性表面波デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2010213144A JP2010213144A (ja) 2010-09-24
JP2010213144A5 true JP2010213144A5 (https=) 2012-04-12
JP5338396B2 JP5338396B2 (ja) 2013-11-13

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ID=42972837

Family Applications (1)

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JP2009059078A Active JP5338396B2 (ja) 2009-03-12 2009-03-12 弾性表面波デバイスの製造方法

Country Status (1)

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JP (1) JP5338396B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0827386B2 (ja) 1986-09-22 1996-03-21 三菱マテリアル株式会社 レ−ザ−加圧溶接装置
JP2550437Y2 (ja) 1988-03-26 1997-10-15 株式会社島津製作所 核燃料棒の端栓溶接装置に用いるシール装置
JP3117778B2 (ja) 1992-03-13 2000-12-18 日本ニユクリア・フユエル株式会社 管の封緘溶接方法及び装置
JP5882154B2 (ja) * 2012-07-19 2016-03-09 太陽誘電株式会社 弾性波デバイスの製造方法
JP6362327B2 (ja) * 2013-12-26 2018-07-25 太陽誘電株式会社 弾性波デバイスおよびその製造方法
JP2018026673A (ja) * 2016-08-09 2018-02-15 株式会社ディスコ ウエーハの加工方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002009583A (ja) * 2000-06-26 2002-01-11 Matsushita Electric Ind Co Ltd 圧電デバイス及びその製造方法
JP2003115734A (ja) * 2001-10-09 2003-04-18 Matsushita Electric Ind Co Ltd 弾性表面波装置とその製造方法
JP3917405B2 (ja) * 2001-10-31 2007-05-23 株式会社東芝 電子部品装置の製造方法
JP4692024B2 (ja) * 2005-03-04 2011-06-01 パナソニック株式会社 弾性表面波デバイス
EP1892831B1 (en) * 2005-06-16 2012-08-29 Murata Manufacturing Co., Ltd. Piezoelectric device and manufacturing method thereof
JP2007130768A (ja) * 2005-11-08 2007-05-31 Seiko Epson Corp 水晶基板の切断方法
JP2007158212A (ja) * 2005-12-08 2007-06-21 Matsushita Electric Ind Co Ltd 電子部品とその切断方法
EP2159916B1 (en) * 2007-02-28 2018-07-11 Murata Manufacturing Co. Ltd. Branching filter and its manufacturing method
JP4906557B2 (ja) * 2007-03-28 2012-03-28 京セラ株式会社 弾性表面波装置の製造方法
KR101484296B1 (ko) * 2007-06-26 2015-01-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 기판의 제작방법

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