WO2013168634A8 - 転写方法及び熱ナノインプリント装置 - Google Patents

転写方法及び熱ナノインプリント装置 Download PDF

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Publication number
WO2013168634A8
WO2013168634A8 PCT/JP2013/062590 JP2013062590W WO2013168634A8 WO 2013168634 A8 WO2013168634 A8 WO 2013168634A8 JP 2013062590 W JP2013062590 W JP 2013062590W WO 2013168634 A8 WO2013168634 A8 WO 2013168634A8
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WO
WIPO (PCT)
Prior art keywords
mask layer
processed
film
transfer method
thermal nanoimprint
Prior art date
Application number
PCT/JP2013/062590
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English (en)
French (fr)
Other versions
WO2013168634A1 (ja
Inventor
尚希 細見
潤 古池
布士人 山口
Original Assignee
旭化成イーマテリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旭化成イーマテリアルズ株式会社 filed Critical 旭化成イーマテリアルズ株式会社
Priority to EP13787905.2A priority Critical patent/EP2848391B1/en
Priority to IN2313MUN2014 priority patent/IN2014MN02313A/en
Priority to KR1020147029872A priority patent/KR101531143B1/ko
Priority to KR1020157007666A priority patent/KR101881200B1/ko
Priority to US14/399,788 priority patent/US20150111005A1/en
Priority to CN201380024210.8A priority patent/CN104271332B/zh
Priority to JP2013531813A priority patent/JP5560377B2/ja
Publication of WO2013168634A1 publication Critical patent/WO2013168634A1/ja
Publication of WO2013168634A8 publication Critical patent/WO2013168634A8/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B29C59/046—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts for layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2033/00—Use of polymers of unsaturated acids or derivatives thereof as moulding material
    • B29K2033/04—Polymers of esters
    • B29K2033/08—Polymers of acrylic acid esters, e.g. PMA, i.e. polymethylacrylate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0005—Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Laminated Bodies (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

　一方の表面にナノスケールの凹凸構造（１１）が形成されたカバーフィルム（１０）と、凹凸構造（１１）の凹部内部に設けられた第２のマスク層（１２）と、凹凸構造（１１）及び第２のマスク層（１２）を覆うように設けられた第１のマスク層（１３）と、を具備する微細パタン形成用フィルム（ＩＩ）を使用し、被処理体（２０）上に第１のマスク層（１３）及び第２のマスク層（１２）を転写付与する。ここで、微細パタン形成用フィルム（ＩＩ）を、第１のマスク層（１３）が設けれた表面を被処理体（２０）の表面に向けて押圧し、第１のマスク層（１３）にエネルギー線を照射し、次いで、カバーフィルム（１０）を、第２のマスク層（１２）及び第１のマスク層（１３）より分離する。ここで、押圧とエネルギー線照射とはそれぞれ独立で行う。第２のマスク層（１２）及び第１のマスク層（１３）を用いて被処理体をエッチングする。
PCT/JP2013/062590 2012-05-08 2013-04-30 転写方法及び熱ナノインプリント装置 WO2013168634A1 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
EP13787905.2A EP2848391B1 (en) 2012-05-08 2013-04-30 Transfer method and thermal nanoimprint device
IN2313MUN2014 IN2014MN02313A (ja) 2012-05-08 2013-04-30
KR1020147029872A KR101531143B1 (ko) 2012-05-08 2013-04-30 전사 방법 및 열 나노임프린트 장치
KR1020157007666A KR101881200B1 (ko) 2012-05-08 2013-04-30 전사 방법 및 열 나노임프린트 장치
US14/399,788 US20150111005A1 (en) 2012-05-08 2013-04-30 Transfer method and thermal nanoimprinting apparatus
CN201380024210.8A CN104271332B (zh) 2012-05-08 2013-04-30 转印方法及热纳米压印装置
JP2013531813A JP5560377B2 (ja) 2012-05-08 2013-04-30 転写方法及び熱ナノインプリント装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012106937 2012-05-08
JP2012-106937 2012-05-08
JP2012-135005 2012-06-14
JP2012135005 2012-06-14

Publications (2)

Publication Number Publication Date
WO2013168634A1 WO2013168634A1 (ja) 2013-11-14
WO2013168634A8 true WO2013168634A8 (ja) 2014-01-16

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PCT/JP2013/062590 WO2013168634A1 (ja) 2012-05-08 2013-04-30 転写方法及び熱ナノインプリント装置

Country Status (9)

Country Link
US (1) US20150111005A1 (ja)
EP (2) EP2979845A1 (ja)
JP (2) JP5560377B2 (ja)
KR (2) KR101531143B1 (ja)
CN (2) CN104271332B (ja)
IN (1) IN2014MN02313A (ja)
MY (1) MY171653A (ja)
TW (2) TWI495558B (ja)
WO (1) WO2013168634A1 (ja)

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Also Published As

Publication number Publication date
JP5560377B2 (ja) 2014-07-23
KR101881200B1 (ko) 2018-07-24
JP6162640B2 (ja) 2017-07-12
EP2848391A1 (en) 2015-03-18
KR101531143B1 (ko) 2015-06-23
CN104271332B (zh) 2016-04-13
TWI495558B (zh) 2015-08-11
CN104865792A (zh) 2015-08-26
KR20140144716A (ko) 2014-12-19
EP2979845A1 (en) 2016-02-03
EP2848391B1 (en) 2018-09-19
TW201408469A (zh) 2014-03-01
TW201505818A (zh) 2015-02-16
TWI598211B (zh) 2017-09-11
MY171653A (en) 2019-10-22
JP2014187376A (ja) 2014-10-02
CN104271332A (zh) 2015-01-07
JPWO2013168634A1 (ja) 2016-01-07
EP2848391A4 (en) 2015-04-29
KR20150041161A (ko) 2015-04-15
WO2013168634A1 (ja) 2013-11-14
IN2014MN02313A (ja) 2015-08-07
US20150111005A1 (en) 2015-04-23

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