DE102004040068B4 - Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks - Google Patents

Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks Download PDF

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Publication number
DE102004040068B4
DE102004040068B4 DE102004040068.7A DE102004040068A DE102004040068B4 DE 102004040068 B4 DE102004040068 B4 DE 102004040068B4 DE 102004040068 A DE102004040068 A DE 102004040068A DE 102004040068 B4 DE102004040068 B4 DE 102004040068B4
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DE
Germany
Prior art keywords
laser
process step
hole
cross
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE102004040068.7A
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German (de)
English (en)
Other versions
DE102004040068A1 (de
Inventor
Dr. Metka Uwe
Thomas Prill
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Mechanics Ltd filed Critical Via Mechanics Ltd
Priority to DE102004040068.7A priority Critical patent/DE102004040068B4/de
Priority to CN2005800192392A priority patent/CN1997482B/zh
Priority to PCT/EP2005/053716 priority patent/WO2006018372A1/de
Priority to JP2007526445A priority patent/JP4695140B2/ja
Priority to HK07109178.8A priority patent/HK1101278B/xx
Priority to KR1020067025790A priority patent/KR101289755B1/ko
Publication of DE102004040068A1 publication Critical patent/DE102004040068A1/de
Application granted granted Critical
Publication of DE102004040068B4 publication Critical patent/DE102004040068B4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/386—Removing material by boring or cutting by boring of blind holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
DE102004040068.7A 2004-08-18 2004-08-18 Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks Expired - Lifetime DE102004040068B4 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE102004040068.7A DE102004040068B4 (de) 2004-08-18 2004-08-18 Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks
CN2005800192392A CN1997482B (zh) 2004-08-18 2005-07-29 用于多层结构的工件激光钻孔的方法
PCT/EP2005/053716 WO2006018372A1 (de) 2004-08-18 2005-07-29 Verfahren zum laserbohren eines mehrschichtig aufgebauten werkstücks
JP2007526445A JP4695140B2 (ja) 2004-08-18 2005-07-29 多層構成の被加工品のレーザ穿孔方法
HK07109178.8A HK1101278B (en) 2004-08-18 2005-07-29 Method for laser drilling a multilayer workpiece
KR1020067025790A KR101289755B1 (ko) 2004-08-18 2005-07-29 다층 구성의 피가공품의 레이저 드릴링 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102004040068.7A DE102004040068B4 (de) 2004-08-18 2004-08-18 Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks

Publications (2)

Publication Number Publication Date
DE102004040068A1 DE102004040068A1 (de) 2006-04-13
DE102004040068B4 true DE102004040068B4 (de) 2018-01-04

Family

ID=35219456

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102004040068.7A Expired - Lifetime DE102004040068B4 (de) 2004-08-18 2004-08-18 Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks

Country Status (5)

Country Link
JP (1) JP4695140B2 (https=)
KR (1) KR101289755B1 (https=)
CN (1) CN1997482B (https=)
DE (1) DE102004040068B4 (https=)
WO (1) WO2006018372A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008027130A1 (de) * 2008-05-29 2009-12-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur trennenden Bearbeitung von Werkstücken mit einem Laserstrahl
CN101610643B (zh) * 2009-07-14 2010-12-01 华中科技大学 一种激光加工盲孔的方法
KR20120086688A (ko) * 2009-10-13 2012-08-03 미쓰비시 마테리알 가부시키가이샤 전극판의 통기공 형성 방법
DE102009044316B4 (de) * 2009-10-22 2015-04-30 Ewag Ag Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens
DE102010034143A1 (de) * 2010-08-12 2012-02-16 Thomas Hofmann Träger für elektronische und elektrische Bauelemente
WO2013002503A2 (ko) * 2011-06-29 2013-01-03 (주)큐엠씨 발광 다이오드의 제조 방법 및 장치
JP2013146780A (ja) * 2012-01-23 2013-08-01 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のレーザ加工方法
CN103974543B (zh) * 2014-03-18 2016-08-17 西安交通大学 一种基于激光加工的多层柔性电路板微小孔加工工艺
KR102216675B1 (ko) 2014-06-12 2021-02-18 삼성디스플레이 주식회사 디스플레이 패널의 리페어 장치 및 디스플레이 패널의 리페어 방법
GB2529153A (en) * 2014-08-06 2016-02-17 Bae Systems Plc Substrate manufacture
KR101789185B1 (ko) * 2016-02-05 2017-10-23 주식회사 이오테크닉스 레이저 빔의 경사각을 이용한 레이저 가공방법
US9852997B2 (en) * 2016-03-25 2017-12-26 Applied Materials, Inc. Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
CN106695136B (zh) * 2017-01-12 2017-09-29 广东工业大学 一种多层印刷电路板的激光打孔方法及使用其的系统
DE102017108437B4 (de) * 2017-04-20 2020-07-09 Gottfried Wilhelm Leibniz Universität Hannover Elektrische Schaltungsstruktur und Verfahren zu deren Herstellung
WO2018226687A1 (en) * 2017-06-07 2018-12-13 Kci Licensing, Inc. Methods for manufacturing and assembling dual material tissue interface for negative-pressure therapy
JP2019107789A (ja) * 2017-12-15 2019-07-04 株式会社小糸製作所 樹脂成形品および車両用部品
CN112692454A (zh) * 2020-12-17 2021-04-23 华清创智光电科技(清远)有限公司 一种双头激光光路系统及其加工pcb板盲孔的方法
CN115348730A (zh) * 2021-05-12 2022-11-15 无锡深南电路有限公司 一种线路板钻孔方法、制备方法以及线路板
CN117300394B (zh) * 2023-11-28 2024-02-23 武汉铱科赛科技有限公司 一种激光盲孔钻孔方法、设备、装置及系统

Citations (8)

* Cited by examiner, † Cited by third party
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US5126532A (en) * 1989-01-10 1992-06-30 Canon Kabushiki Kaisha Apparatus and method of boring using laser
US6119335A (en) * 1997-12-02 2000-09-19 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing multi-layer printed circuit board
WO2001041969A2 (en) * 1999-12-07 2001-06-14 Electro Scientific Industries, Inc. Switchable wavelength laser-based etched circuit board processing system
WO2001074529A2 (en) * 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces
EP1169893B1 (de) * 1999-03-16 2002-11-27 Siemens Aktiengesellschaft Verfahren zum einbringen von durchkontaktierungslöchern in ein beidseitig mit metallschichten versehenes, elektrisch isolierendes basismaterial
DE10125397A1 (de) * 2001-05-23 2002-12-19 Siemens Dematic Ag Verfahren zum Bohren von Mikrolöchern mit einem Laserstrahl
DE10201476A1 (de) * 2002-01-16 2003-07-31 Siemens Ag Laserbearbeitungsvorrichtung
DE10251480A1 (de) * 2002-11-05 2004-05-19 Siemens Ag Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungssubstrat

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Publication number Priority date Publication date Assignee Title
US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
JP4373596B2 (ja) * 2000-10-06 2009-11-25 日立ビアメカニクス株式会社 プリント基板の加工方法
JP4734723B2 (ja) * 2001-01-31 2011-07-27 凸版印刷株式会社 同軸ビアホールを用いた多層配線基板の製造方法
JP2003320470A (ja) * 2002-05-02 2003-11-11 Quantum Design Japan Inc 赤外線レーザアシストによる紫外線レーザ加工方法および加工装置
JP3720034B2 (ja) * 2003-05-26 2005-11-24 住友重機械工業株式会社 穴あけ加工方法
TW200518869A (en) * 2003-10-06 2005-06-16 Shinko Electric Ind Co Method for forming via-hole in resin layer

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126532A (en) * 1989-01-10 1992-06-30 Canon Kabushiki Kaisha Apparatus and method of boring using laser
US6119335A (en) * 1997-12-02 2000-09-19 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing multi-layer printed circuit board
EP1169893B1 (de) * 1999-03-16 2002-11-27 Siemens Aktiengesellschaft Verfahren zum einbringen von durchkontaktierungslöchern in ein beidseitig mit metallschichten versehenes, elektrisch isolierendes basismaterial
WO2001041969A2 (en) * 1999-12-07 2001-06-14 Electro Scientific Industries, Inc. Switchable wavelength laser-based etched circuit board processing system
WO2001074529A2 (en) * 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces
DE10125397A1 (de) * 2001-05-23 2002-12-19 Siemens Dematic Ag Verfahren zum Bohren von Mikrolöchern mit einem Laserstrahl
DE10201476A1 (de) * 2002-01-16 2003-07-31 Siemens Ag Laserbearbeitungsvorrichtung
DE10251480A1 (de) * 2002-11-05 2004-05-19 Siemens Ag Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungssubstrat

Also Published As

Publication number Publication date
KR101289755B1 (ko) 2013-07-26
CN1997482B (zh) 2011-01-05
HK1101278A1 (en) 2007-10-12
JP4695140B2 (ja) 2011-06-08
CN1997482A (zh) 2007-07-11
WO2006018372A1 (de) 2006-02-23
DE102004040068A1 (de) 2006-04-13
JP2008510311A (ja) 2008-04-03
KR20070043708A (ko) 2007-04-25

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