KR101289755B1 - 다층 구성의 피가공품의 레이저 드릴링 방법 - Google Patents

다층 구성의 피가공품의 레이저 드릴링 방법 Download PDF

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Publication number
KR101289755B1
KR101289755B1 KR1020067025790A KR20067025790A KR101289755B1 KR 101289755 B1 KR101289755 B1 KR 101289755B1 KR 1020067025790 A KR1020067025790 A KR 1020067025790A KR 20067025790 A KR20067025790 A KR 20067025790A KR 101289755 B1 KR101289755 B1 KR 101289755B1
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South Korea
Prior art keywords
laser
layer
layers
hole
drilling
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Expired - Lifetime
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KR1020067025790A
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Korean (ko)
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KR20070043708A (ko
Inventor
토마스 프릴
우베 멧카
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히다치 비아 메카닉스 가부시키가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/386—Removing material by boring or cutting by boring of blind holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
KR1020067025790A 2004-08-18 2005-07-29 다층 구성의 피가공품의 레이저 드릴링 방법 Expired - Lifetime KR101289755B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004040068.7 2004-08-18
DE102004040068.7A DE102004040068B4 (de) 2004-08-18 2004-08-18 Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks
PCT/EP2005/053716 WO2006018372A1 (de) 2004-08-18 2005-07-29 Verfahren zum laserbohren eines mehrschichtig aufgebauten werkstücks

Publications (2)

Publication Number Publication Date
KR20070043708A KR20070043708A (ko) 2007-04-25
KR101289755B1 true KR101289755B1 (ko) 2013-07-26

Family

ID=35219456

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067025790A Expired - Lifetime KR101289755B1 (ko) 2004-08-18 2005-07-29 다층 구성의 피가공품의 레이저 드릴링 방법

Country Status (5)

Country Link
JP (1) JP4695140B2 (https=)
KR (1) KR101289755B1 (https=)
CN (1) CN1997482B (https=)
DE (1) DE102004040068B4 (https=)
WO (1) WO2006018372A1 (https=)

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DE102008027130A1 (de) * 2008-05-29 2009-12-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur trennenden Bearbeitung von Werkstücken mit einem Laserstrahl
CN101610643B (zh) * 2009-07-14 2010-12-01 华中科技大学 一种激光加工盲孔的方法
KR20120086688A (ko) * 2009-10-13 2012-08-03 미쓰비시 마테리알 가부시키가이샤 전극판의 통기공 형성 방법
DE102009044316B4 (de) * 2009-10-22 2015-04-30 Ewag Ag Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens
DE102010034143A1 (de) * 2010-08-12 2012-02-16 Thomas Hofmann Träger für elektronische und elektrische Bauelemente
WO2013002503A2 (ko) * 2011-06-29 2013-01-03 (주)큐엠씨 발광 다이오드의 제조 방법 및 장치
JP2013146780A (ja) * 2012-01-23 2013-08-01 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のレーザ加工方法
CN103974543B (zh) * 2014-03-18 2016-08-17 西安交通大学 一种基于激光加工的多层柔性电路板微小孔加工工艺
KR102216675B1 (ko) 2014-06-12 2021-02-18 삼성디스플레이 주식회사 디스플레이 패널의 리페어 장치 및 디스플레이 패널의 리페어 방법
GB2529153A (en) * 2014-08-06 2016-02-17 Bae Systems Plc Substrate manufacture
KR101789185B1 (ko) * 2016-02-05 2017-10-23 주식회사 이오테크닉스 레이저 빔의 경사각을 이용한 레이저 가공방법
US9852997B2 (en) * 2016-03-25 2017-12-26 Applied Materials, Inc. Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
CN106695136B (zh) * 2017-01-12 2017-09-29 广东工业大学 一种多层印刷电路板的激光打孔方法及使用其的系统
DE102017108437B4 (de) * 2017-04-20 2020-07-09 Gottfried Wilhelm Leibniz Universität Hannover Elektrische Schaltungsstruktur und Verfahren zu deren Herstellung
WO2018226687A1 (en) * 2017-06-07 2018-12-13 Kci Licensing, Inc. Methods for manufacturing and assembling dual material tissue interface for negative-pressure therapy
JP2019107789A (ja) * 2017-12-15 2019-07-04 株式会社小糸製作所 樹脂成形品および車両用部品
CN112692454A (zh) * 2020-12-17 2021-04-23 华清创智光电科技(清远)有限公司 一种双头激光光路系统及其加工pcb板盲孔的方法
CN115348730A (zh) * 2021-05-12 2022-11-15 无锡深南电路有限公司 一种线路板钻孔方法、制备方法以及线路板
CN117300394B (zh) * 2023-11-28 2024-02-23 武汉铱科赛科技有限公司 一种激光盲孔钻孔方法、设备、装置及系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126532A (en) 1989-01-10 1992-06-30 Canon Kabushiki Kaisha Apparatus and method of boring using laser
KR100258287B1 (ko) * 1994-07-18 2000-06-01 레인하트 죠셉 엘. 다층 타겟에 경유로를 형성하는 방법과 자외선 레이저 시스템(Ultraviolet laser system and method for forming vias in multi-layered targets)
EP1169893A1 (de) * 1999-03-16 2002-01-09 Siemens Aktiengesellschaft Verfahren zum einbringen von durchkontaktierungslöchern in ein beidseitig mit metallschichten versehenes, elektrisch isolierendes basismaterial
JP2002232143A (ja) * 2001-01-31 2002-08-16 Toppan Printing Co Ltd 同軸ビアホールおよびその製造方法ならびにこれを用いた多層配線基板およびその製造方法

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FI982568A7 (fi) * 1997-12-02 1999-06-03 Samsung Electro Mech Menetelmä monikerroksisen painetun piirilevyn valmistamiseksi
KR100670841B1 (ko) * 1999-12-07 2007-01-18 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 스위칭가능 파장 레이저 기반의 에칭 회로 기판 처리 시스템
WO2001074529A2 (en) * 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces
JP4373596B2 (ja) * 2000-10-06 2009-11-25 日立ビアメカニクス株式会社 プリント基板の加工方法
DE10125397B4 (de) * 2001-05-23 2005-03-03 Siemens Ag Verfahren zum Bohren von Mikrolöchern mit einem Laserstrahl
DE10201476B4 (de) * 2002-01-16 2005-02-24 Siemens Ag Laserbearbeitungsvorrichtung
JP2003320470A (ja) * 2002-05-02 2003-11-11 Quantum Design Japan Inc 赤外線レーザアシストによる紫外線レーザ加工方法および加工装置
DE10251480B4 (de) * 2002-11-05 2008-01-24 Hitachi Via Mechanics, Ltd., Ebina Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem elektrischen Schaltungssubstrat
JP3720034B2 (ja) * 2003-05-26 2005-11-24 住友重機械工業株式会社 穴あけ加工方法
TW200518869A (en) * 2003-10-06 2005-06-16 Shinko Electric Ind Co Method for forming via-hole in resin layer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126532A (en) 1989-01-10 1992-06-30 Canon Kabushiki Kaisha Apparatus and method of boring using laser
KR100258287B1 (ko) * 1994-07-18 2000-06-01 레인하트 죠셉 엘. 다층 타겟에 경유로를 형성하는 방법과 자외선 레이저 시스템(Ultraviolet laser system and method for forming vias in multi-layered targets)
EP1169893A1 (de) * 1999-03-16 2002-01-09 Siemens Aktiengesellschaft Verfahren zum einbringen von durchkontaktierungslöchern in ein beidseitig mit metallschichten versehenes, elektrisch isolierendes basismaterial
JP2002232143A (ja) * 2001-01-31 2002-08-16 Toppan Printing Co Ltd 同軸ビアホールおよびその製造方法ならびにこれを用いた多層配線基板およびその製造方法

Also Published As

Publication number Publication date
CN1997482B (zh) 2011-01-05
DE102004040068B4 (de) 2018-01-04
HK1101278A1 (en) 2007-10-12
JP4695140B2 (ja) 2011-06-08
CN1997482A (zh) 2007-07-11
WO2006018372A1 (de) 2006-02-23
DE102004040068A1 (de) 2006-04-13
JP2008510311A (ja) 2008-04-03
KR20070043708A (ko) 2007-04-25

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