JP4695140B2 - 多層構成の被加工品のレーザ穿孔方法 - Google Patents
多層構成の被加工品のレーザ穿孔方法 Download PDFInfo
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- JP4695140B2 JP4695140B2 JP2007526445A JP2007526445A JP4695140B2 JP 4695140 B2 JP4695140 B2 JP 4695140B2 JP 2007526445 A JP2007526445 A JP 2007526445A JP 2007526445 A JP2007526445 A JP 2007526445A JP 4695140 B2 JP4695140 B2 JP 4695140B2
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- laser
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- laser beam
- laser output
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/386—Removing material by boring or cutting by boring of blind holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Description
本発明では、多層構成の被加工品150,250にレーザによって孔153,253をあける以下のような方法を提供する。すなわち、第1のレーザ出力111によって、形成すべき孔153,253の断面の部分領域390内で第1の層152,252を除去し、該断面内に第1の層152,252の一部が残るようにする。第2のレーザ出力によって、形成すべき孔153,253の断面395全体で第2の層151,251を除去し、該第2の層151,251の除去時に、第1の層152,252の残った一部も同時に除去する。定義された境界線370に沿って第1の層152,252のきれいな材料除去を行うためには、孔周縁に沿って部分的に材料除去を行う。有利には、第1の金属層152,252を除去するためにUVレーザビーム111を使用し、誘電体の第2の層151,251を除去するためにIRレーザビームを使用する。
Claims (8)
- 多層構成の被加工品に、所定の断面を有する孔(153,253)のレーザ穿孔を行う方法であって、
該被加工品は第1の金属層および少なくとも1つの第2の金属層(152,252)とそのつど2つの金属層(152,252)間に配置された誘電体層(151,251)を有する多層構成の回路基板(150,250)である形式の方法において、
・第1のレーザ出力(111)を使用して、形成すべき孔(153,253)の断面の部分領域(390)内で第1の層(152,252)を完全に除去し、かつ該断面の周縁(370)に沿って該第1の層(152,252)の材料を除去して溝を形成し、
・第2のレーザ出力を使用して、スポットサイズを形成すべき該孔(153,253)の直径と同じにし、該孔の断面(395)内全体で第2の層(151,251)を切削し、該第2の層(151,251)の除去と同時に、該第1の層(152,252)の前記部分領域(390)を除いた残りの部分を一緒に除去することを特徴とする方法。 - 前記第1のレーザ出力は、可視スペクトル領域または近紫外線スペクトル領域にあるレーザビーム(111)を含む、請求項1記載の方法。
- 前記第1のレーザ出力を固体レーザ(110)によって、倍周式および/またはダイオードポンピング式の固体レーザによって生成する、請求項2記載の方法。
- 前記第2のレーザ出力は、赤外線スペクトル領域にあるレーザビームを有する、請求項1から3までのいずれか1項記載の方法。
- 前記第1のレーザ出力(111)および/または第2のレーザ出力は、パルスレーザ放射を含む、請求項1から4までのいずれか1項記載の方法。
- 前記第1の層(152,252)の部分領域(390)を、トレパニングによって除去する、請求項1から5までのいずれか1項記載の方法。
- 前記第2の層(151,251)をトレパニングまたはパンチングによって除去する、請求項1から6までのいずれか1項記載の方法。
- 前記部分領域(390)は、孔の中心点(M)と孔の周縁(A)との間に存在する、請求項1から7までのいずれか1項記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004040068.7 | 2004-08-18 | ||
DE102004040068.7A DE102004040068B4 (de) | 2004-08-18 | 2004-08-18 | Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks |
PCT/EP2005/053716 WO2006018372A1 (de) | 2004-08-18 | 2005-07-29 | Verfahren zum laserbohren eines mehrschichtig aufgebauten werkstücks |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008510311A JP2008510311A (ja) | 2008-04-03 |
JP2008510311A5 JP2008510311A5 (ja) | 2010-12-24 |
JP4695140B2 true JP4695140B2 (ja) | 2011-06-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007526445A Active JP4695140B2 (ja) | 2004-08-18 | 2005-07-29 | 多層構成の被加工品のレーザ穿孔方法 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP4695140B2 (ja) |
KR (1) | KR101289755B1 (ja) |
CN (1) | CN1997482B (ja) |
DE (1) | DE102004040068B4 (ja) |
HK (1) | HK1101278A1 (ja) |
WO (1) | WO2006018372A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008027130A1 (de) * | 2008-05-29 | 2009-12-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur trennenden Bearbeitung von Werkstücken mit einem Laserstrahl |
CN101610643B (zh) * | 2009-07-14 | 2010-12-01 | 华中科技大学 | 一种激光加工盲孔的方法 |
CN102473632A (zh) * | 2009-10-13 | 2012-05-23 | 三菱综合材料株式会社 | 电极板的通气孔形成方法 |
DE102009044316B4 (de) * | 2009-10-22 | 2015-04-30 | Ewag Ag | Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens |
DE102010034143A1 (de) * | 2010-08-12 | 2012-02-16 | Thomas Hofmann | Träger für elektronische und elektrische Bauelemente |
WO2013002503A2 (ko) * | 2011-06-29 | 2013-01-03 | (주)큐엠씨 | 발광 다이오드의 제조 방법 및 장치 |
JP2013146780A (ja) * | 2012-01-23 | 2013-08-01 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板のレーザ加工方法 |
CN103974543B (zh) * | 2014-03-18 | 2016-08-17 | 西安交通大学 | 一种基于激光加工的多层柔性电路板微小孔加工工艺 |
KR102216675B1 (ko) | 2014-06-12 | 2021-02-18 | 삼성디스플레이 주식회사 | 디스플레이 패널의 리페어 장치 및 디스플레이 패널의 리페어 방법 |
GB2529153A (en) * | 2014-08-06 | 2016-02-17 | Bae Systems Plc | Substrate manufacture |
KR101789185B1 (ko) * | 2016-02-05 | 2017-10-23 | 주식회사 이오테크닉스 | 레이저 빔의 경사각을 이용한 레이저 가공방법 |
US9852997B2 (en) * | 2016-03-25 | 2017-12-26 | Applied Materials, Inc. | Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process |
CN106695136B (zh) * | 2017-01-12 | 2017-09-29 | 广东工业大学 | 一种多层印刷电路板的激光打孔方法及使用其的系统 |
DE102017108437B4 (de) * | 2017-04-20 | 2020-07-09 | Gottfried Wilhelm Leibniz Universität Hannover | Elektrische Schaltungsstruktur und Verfahren zu deren Herstellung |
WO2018226687A1 (en) * | 2017-06-07 | 2018-12-13 | Kci Licensing, Inc. | Methods for manufacturing and assembling dual material tissue interface for negative-pressure therapy |
JP2019107789A (ja) * | 2017-12-15 | 2019-07-04 | 株式会社小糸製作所 | 樹脂成形品および車両用部品 |
CN117300394B (zh) * | 2023-11-28 | 2024-02-23 | 武汉铱科赛科技有限公司 | 一种激光盲孔钻孔方法、设备、装置及系统 |
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2004
- 2004-08-18 DE DE102004040068.7A patent/DE102004040068B4/de active Active
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2005
- 2005-07-29 CN CN2005800192392A patent/CN1997482B/zh active Active
- 2005-07-29 KR KR1020067025790A patent/KR101289755B1/ko active IP Right Grant
- 2005-07-29 WO PCT/EP2005/053716 patent/WO2006018372A1/de active Application Filing
- 2005-07-29 JP JP2007526445A patent/JP4695140B2/ja active Active
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2007
- 2007-08-23 HK HK07109178.8A patent/HK1101278A1/xx not_active IP Right Cessation
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JP2002118344A (ja) * | 2000-10-06 | 2002-04-19 | Hitachi Via Mechanics Ltd | プリント基板の加工方法および装置 |
JP2002232143A (ja) * | 2001-01-31 | 2002-08-16 | Toppan Printing Co Ltd | 同軸ビアホールおよびその製造方法ならびにこれを用いた多層配線基板およびその製造方法 |
JP2003320470A (ja) * | 2002-05-02 | 2003-11-11 | Quantum Design Japan Inc | 赤外線レーザアシストによる紫外線レーザ加工方法および加工装置 |
JP2004344961A (ja) * | 2003-05-26 | 2004-12-09 | Sumitomo Heavy Ind Ltd | 穴あけ加工方法 |
WO2005034595A1 (ja) * | 2003-10-06 | 2005-04-14 | Shinko Electric Industries Co., Ltd. | 樹脂層へのビアホールの形成方法 |
Also Published As
Publication number | Publication date |
---|---|
DE102004040068A1 (de) | 2006-04-13 |
CN1997482B (zh) | 2011-01-05 |
DE102004040068B4 (de) | 2018-01-04 |
CN1997482A (zh) | 2007-07-11 |
JP2008510311A (ja) | 2008-04-03 |
WO2006018372A1 (de) | 2006-02-23 |
HK1101278A1 (en) | 2007-10-12 |
KR20070043708A (ko) | 2007-04-25 |
KR101289755B1 (ko) | 2013-07-26 |
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