Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/38—Removing material by boring or cutting
  • B23K26/382—Removing material by boring or cutting by boring
  • B23K26/386—Removing material by boring or cutting by boring of blind holes
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
  • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
  • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
  • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
  • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
  • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
  • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/38—Removing material by boring or cutting
  • B23K26/382—Removing material by boring or cutting by boring
  • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0011—Working of insulating substrates or insulating layers
  • H05K3/0017—Etching of the substrate by chemical or physical means
  • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
  • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
  • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
  • H05K2203/107—Using laser light
  • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths

Definitions

• the invention relates to a method for laser drilling a hole having a predetermined cross-sectional area in a Gir ⁇ layered structured workpiece, particularly in a more ⁇ ply constructed circuit substrate having a first and at least a second metal layer and having in each case arranged between two metal layers Dielektrikumss ⁇ chicht.
• blind holes may be drilled plates, in which a plurality of metallic Schich ⁇ th through interlayer dielectric layers are not electrically conductively separated from each other, for example in multi-layer wire.
• a problem when drilling holes in multilayer printed circuit boards is that the erosion behavior of metallic and dielectric layers is very different, so that an effective drilling process can not be carried out with only a single laser beam with specific laser parameters.
• the metalli ⁇ rule layers are removed locally with a laser beam in the ultraviolet (UV) spectral range.
• the dielectric intermediate layer is removed by means of an IR laser beam, which is usually generated by a CO 2 laser.
• IR laser beam which is usually generated by a CO 2 laser.
• Combination laser processing machines which have two different laser light sources, a UV laser light source, for example, a frequency-multiplied Nd: YAG laser and an IR laser light source, in particular a CO 2 laser.
• the laser beam is focused on the metal layer on a diameter für ⁇ , which is substantially smaller than the diameter of the hole to be drilled.
• the laser beam is then guided by means of a two movably mounted mirrors deflection unit on a circular path along the edge of the hole to be drilled, so that the metalli ⁇ cal layer is removed along this circular line.
• the one generated from the metal layer jumps
• the trepanning process can also be performed with different radii or the laser beam can be guided on a spiral path within the cross-sectional area of the hole to be drilled.
• the problem of pure laser drilling of multilayer electronic circuit substrates is that the laser power of conventional UV laser light sources clearly is lower than that of CO 2 laser light sources. This has the consequence that the process step of removing the metal ⁇ layer is significantly slower than the subsequent process ⁇ step of drilling the dielectric layer.
• loading tunes the speed at which the metallic layer large ⁇ be drilled th, the speed of the entire Bohrpro ⁇ zesses and thus the throughput, ie the maximum number of holes that can be drilled per unit time.
• the object underlying the invention is to provide a method for laser drilling a hole in a Kischich ⁇ tig constructed workpiece, which allows a fast drilling of metallic layers and thus insire velvet allows a high drilling speed.
• the invention is based on the finding that even with an incomplete removal of the first layer, the remaining part is automatically removed during the removal of the second layer. Since the first layer is only partially removed by means of the first laser output, this first step is significantly faster in the entire hole area as compared with full-surface removal of the first layer. Thus, the method according to the invention for laser drilling leads in particular to a significantly higher drilling speed, if due to the different erosion behavior of the materials of the two layers Complete removal of the first layer takes longer than a removal of the second layer.
• the invention is suitable both for drilling blind or blind holes as well as for drilling through holes and is thus universally applicable in the field of laser drilling of multi-layer GmbHungssubstra ⁇ th. It should be noted that must be removed from the bottom view of the laser beam bearbei ⁇ Tenden metal layer after herotromm ⁇ handy drilling when drilling through holes, since this layer is underneath no further dielectric layer more.
• the first layer is removed ⁇ zusharm by the first laser output Lich along the edge of the cross-sectional area material.
• the first layer are formed of a trail or a groove hole to be drilled along the edge, which before Trains t ⁇ until half extends a near-surface region of the first layer toward the second layer or only inner ⁇ .
• Such a structure which has the effect of perforation, ensures a cleanly defined hole edge upon complete removal of the first layer by the second laser output, so that holes of high quality can be produced.
• the first laser output comprises a laser ⁇ beam in the visible or in the near ultraviolet Spektralbe ⁇ rich. Since short-wave laser radiation is relatively weakly reflected on metallic layers in comparison with infrared laser radiation, UV radiation is suitable in particular for the removal of metallic materials. In this case, the thermal load of the workpiece is significantly reduced in comparison to the thermal load by IR radiation, since by means of UV radiation, the atomic bonds or the metallic bonds between the individual atoms or molecules in the metal layer can be broken directly.
• the first laser output is generated by a solid ⁇ body laser, in particular by a frequency-multiplied laser.
• the active laser medium is, for example, Nd: YAG, Nd: YVO 4 or Nd: YLF, which can generate laser radiation with a fundamental wavelength of 1064 nm.
• the pumping of the solid-state laser is preferably carried out using semiconductor diodes. These can be arranged around the active laser medium, so that a corresponding solid state laser can be realized in a compact design, without an external pump light source is required.
• the laser light source additionally has an optically non-linear medium for frequency multiplication.
• Such optically non-linear media which are well known in laser technology, can be positioned both inside and outside the resonator.
• the second laser output is generated in the IR spectral range.
• the corresponding laser radiation before ⁇ Trains t generated by a CO 2 laser, and allows for the high available laser power a fast removal of a dielectric second layer.
• the use of pulsed laser radiation according to claim 6 has the advantage that the material removal as a result of a cooling time between the laser pulses causes a comparatively low thermal load on the workpiece to be drilled.
• the portion of the first layer is removed by trepaning, wherein the laser beam is guided at the edge of the portion.
• a structure is generated which extends to a depth toward the second layer.
• ⁇ which normally pops out by itself from the hole area.
• the first laser output can additionally be guided with one or a plurality of circulations around the edge of the partial region or also be directed onto the inner region of the slice, so that the circular disc produced due to the high energy input with high reliability is removed from the hole area.
• the second layer is removed by trepaning or puncturing.
• care must be taken that the second laser output is first directed directly onto the second layer in the region of the exposed hole within the hole cross-sectional area. This ensures that the energy input directly onto the second layer removes the remaining part of the first layer before the second laser output is directed onto the area of the hole cross-sectional area, which area has not yet been removed by the first laser output.
• the laser beam is directed with one or a plurality of successive pulses to the same point of the workpiece to be drilled.
• the spot size of the second laser output on the workpiece to be adapted to different hole diameter.
• the portion is hiss the hole center and the edge of the hole. Starting from a first laser beam initially directed at the center of the hole, this enables a fast approach of the laser beam to the edge of the hole. Since a deflection unit carrying the laser beam and always having a certain mechanical inertia therefore only has to perform a relatively short movement overall, the two processing steps, namely the formation of a passage along the edge of the hole and the removal of the first layer within the division, can be carried out quickly.
• the portion is preferably a circular area having a diameter that is half as large as the diameter of the entire hole.
• the traverse ⁇ away of the first laser output around the partial area only half as large as a traverse around the entire hole, wohinge- gene to be removed surface of the first layer a four ⁇ tel corresponding to the area of the total hole cross-section.
• the energy input per area to be removed is correspondingly greater, so that a reliable removal of the cut-out lid of the first layer is ensured even when the partial area is circulated once with the first laser output.
• the entire drilling process can be a result of the short total travel of the first laser output to the first layer quickly Runaway ⁇ are leads.
• Figure 1 shows a laser processing machine for drilling Lö ⁇ chern
• Figure 2 is a cross-sectional view of a drilled blind hole
• Figure 3 shows the traversing movements of the first laser output according to a preferred embodiment of the invention.
• the laser processing machine 100 illustrated in Figure 1 comprises a laser light source 110, laser beam 111 which lie in a crisps ultravio ⁇ spectral range emitted.
• the laser light source 110 is a diode-pumped solid-state laser, in particular a Nd: YLF laser, which is optically pumped through semiconductor diodes arranged around the active laser medium.
• the UV laser radiation 111 is generated in a known manner by frequency multiplication by means of an optically non-linear crystal.
• the laser beam 111 strikes a deflection unit 130, which is conventionally constructed with galvo mirrors.
• the laser beam deflected by the deflection unit 130 is directed onto the substrate 150 to be processed via an imaging optical system 140, for example an F-theta optical system as a processing laser beam 141.
• the substrate 150 comprises a dielectric layer 151, which is covered by a metallic layer 152 on the upper side and underside, respectively.
• the metallic layers are structured in a manner not shown to form interconnects.
• micro holes 153 are drilled, the walls of which can be metallized in a known manner.
• the processing laser beam 141 is centered in each case by means of a jump movement 155 on a drilling position 154 and then with a spot size F set via the imaging optics 140 in the region the drilling position 154 in a circular motion, so that in each case a micro hole is generated.
• the generation of the micro hole 153 is explained below tert of Figure 3 erläu ⁇ .
• Different layers are usually processed in under ⁇ different laser processing machines.
• a laser processing machine with a UV laser light source is provided
• a laser processing machine with an IR laser light source is provided.
• FIG. 2 shows, in a cross-sectional view, a microhole 253 drilled in a multilayer substrate 250.
• the microhole 253 is a blind hole in which only the upper metallic layer 252 and the dielectric intermediate layer 251 have been removed. By a subsequent metallization of the blind hole 253, the two metallic layers 252 can be electrically connected to one another.
• FIG. 3 shows the movements of the processing laser beam 141 directed onto the upper metallic layer 252, which emerges from that in the UV laser beam 111.
• the laser beam initially starts from the center M of the microhole 253 to be drilled on a circular path 360 with very low UV laser power ren to a point a at the edge of the procedural to be drilled micro hole 253 ⁇ .
• the laser light source 110 controls in such a manner is ⁇ that a non-pulsed so-called.
• cw laser beam Conti ous wave laser beam
• the power of the UV laser beam 111 is set.
• the laser beam is then guided on the outer track 370 along the edge of the microhole 253 to be drilled.
• the laser beam is guided in one revolution or usually in several successive circulations along the outer web 370. This movement along the outer panel 370 occurs until a circular lid produced in the upper metallic layer 252 is removed.
• the laser beam is traversed again at low laser power in the cw mode toward the center M along the second half circle 380.
• the deflection unit 130 is directed by means of a Sprungbe ⁇ movement to the center of a next to be drilled micro-hole.
• a pulsed UV laser beam is guided from the center of the microhole 153 to be drilled at full power along the first semicircle 360 to the point A. Thereafter, the laser beam is guided along the outer web 370 again on a complete circular path to the point A.
• the groove structure produced along the outer web 370 leads to material removal, preferably as far as the dielectric layer 251.
• the desired material removal on the outer web 370 can be achieved. Are in any case it must be ensured that the remaining in the hole region metallic layer 252 during the removal of the Darun ⁇ ter underlying dielectric layer 251 is fully hereinafter with removed.
• the UV laser beam is guided along the second half circle 380 again with full laser power towards the center point M. If the material removal along the two semi-circles 360 and is carried out 380 already up to the dielectric layer 251, the extended ⁇ generated thereby cut lid in the top metal layer 252 having a diameter corresponding to the distance between the point A and the point M is jump out on your own.
• the UV laser beam can also be guided on further circular paths with a smaller radius in order to ensure reliable removal of the upper metallic layer within partial area 390.
• the substrate 150 is transferred to another laser processing machine having a CO 2 laser light source.
• the IR laser beam thus generated is then directed onto the substrate 250 concentrically with the center M with a spot size F corresponding to the diameter of the microhole 153 to be drilled.
• the groove structure previously produced by the movement of the UV laser beam along the outer web 370 now has the effect that the upper metallic layer 252 is removed from the dielectric layer 251 along a clean break edge which runs along the outer web 370.
• the material removal of the dielectric layer 251 takes place in a known manner by means of an IR laser beam.
• the first process step ie the material removal by means of the UV laser beam 111
• the first process step is opposite to the conventional one described above Process significantly faster, in which the first process step, the complete removal of the metal layer 252 within the entire hole area encompassed. Since the removal of material from the dielectric layer 251 with the IR laser beam can be carried out much faster in comparison to the first process step (the available laser power in the IR spectral range is significantly greater than in the UV spectral range), the entire drilling process is opposite the previous drilling significantly faster.
• the two process steps can also be carried out with a single, a so-called combination drilling machine, which has both a UV laser light source and an IR laser light source.
• the invention cansver ⁇ course also be used for drilling workpieces, which not only two, but in principle belie ⁇ big many metallic layers, each two adjacent metallic layers by an electric insulating dielectric layer are separated from each other.
• multi-layer workpieces thus arbitrarily deep blind holes can be produced, in each case the metalli ⁇ cal layer is removed with the method explained with reference to FIG 3.
• the invention provides a method for laser drilling a
• Hole 153, 253 in a multi-layer workpiece 150, 250 wherein by means of a first laser output 111 within a portion 390 of the cross-sectional area of the hole to be drilled 153, 253, a first layer 152, 252 is removed, so that within the cross-sectional area a portion of the first layer 152, 252 remains.
• a second Laserausga- be is the wear across the entire cross-sectional area 395 to be drilled hole 153, 253 a second layer 151, 251 to ⁇ , simultaneously removed the remaining portion of the first layer 152, 252 during the removal of the second layer 151, 251 becomes.
• a clean material removal of the first layer 152, 252 along a defined boundary line 370 is achieved by a partial material removal along the edge of the hole.
• a metalli ⁇ 's first layer 152, 252 is a UV laser beam 111 and for removing a dielectric second layer 151, 251, an IR laser beam used.

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• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Engineering & Computer Science (AREA)
• Plasma & Fusion (AREA)
• Mechanical Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Laser Beam Processing (AREA)

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• 2004
  • 2004-08-18 DE DE102004040068.7A patent/DE102004040068B4/de not_active Expired - Lifetime
• 2005
  • 2005-07-29 JP JP2007526445A patent/JP4695140B2/ja not_active Expired - Lifetime
  • 2005-07-29 CN CN2005800192392A patent/CN1997482B/zh not_active Expired - Lifetime
  • 2005-07-29 WO PCT/EP2005/053716 patent/WO2006018372A1/de not_active Ceased
  • 2005-07-29 KR KR1020067025790A patent/KR101289755B1/ko not_active Expired - Lifetime

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