CN1997482B - 用于多层结构的工件激光钻孔的方法 - Google Patents

用于多层结构的工件激光钻孔的方法 Download PDF

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Publication number
CN1997482B
CN1997482B CN2005800192392A CN200580019239A CN1997482B CN 1997482 B CN1997482 B CN 1997482B CN 2005800192392 A CN2005800192392 A CN 2005800192392A CN 200580019239 A CN200580019239 A CN 200580019239A CN 1997482 B CN1997482 B CN 1997482B
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CN
China
Prior art keywords
laser
metal layer
layer
laser beam
perforation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2005800192392A
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English (en)
Chinese (zh)
Other versions
CN1997482A (zh
Inventor
T·普里尔
U·梅特卡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of CN1997482A publication Critical patent/CN1997482A/zh
Application granted granted Critical
Publication of CN1997482B publication Critical patent/CN1997482B/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/386—Removing material by boring or cutting by boring of blind holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
CN2005800192392A 2004-08-18 2005-07-29 用于多层结构的工件激光钻孔的方法 Expired - Lifetime CN1997482B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004040068.7 2004-08-18
DE102004040068.7A DE102004040068B4 (de) 2004-08-18 2004-08-18 Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks
PCT/EP2005/053716 WO2006018372A1 (de) 2004-08-18 2005-07-29 Verfahren zum laserbohren eines mehrschichtig aufgebauten werkstücks

Publications (2)

Publication Number Publication Date
CN1997482A CN1997482A (zh) 2007-07-11
CN1997482B true CN1997482B (zh) 2011-01-05

Family

ID=35219456

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005800192392A Expired - Lifetime CN1997482B (zh) 2004-08-18 2005-07-29 用于多层结构的工件激光钻孔的方法

Country Status (5)

Country Link
JP (1) JP4695140B2 (https=)
KR (1) KR101289755B1 (https=)
CN (1) CN1997482B (https=)
DE (1) DE102004040068B4 (https=)
WO (1) WO2006018372A1 (https=)

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DE102008027130A1 (de) * 2008-05-29 2009-12-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur trennenden Bearbeitung von Werkstücken mit einem Laserstrahl
CN101610643B (zh) * 2009-07-14 2010-12-01 华中科技大学 一种激光加工盲孔的方法
KR20120086688A (ko) * 2009-10-13 2012-08-03 미쓰비시 마테리알 가부시키가이샤 전극판의 통기공 형성 방법
DE102009044316B4 (de) * 2009-10-22 2015-04-30 Ewag Ag Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens
DE102010034143A1 (de) * 2010-08-12 2012-02-16 Thomas Hofmann Träger für elektronische und elektrische Bauelemente
WO2013002503A2 (ko) * 2011-06-29 2013-01-03 (주)큐엠씨 발광 다이오드의 제조 방법 및 장치
JP2013146780A (ja) * 2012-01-23 2013-08-01 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のレーザ加工方法
CN103974543B (zh) * 2014-03-18 2016-08-17 西安交通大学 一种基于激光加工的多层柔性电路板微小孔加工工艺
KR102216675B1 (ko) 2014-06-12 2021-02-18 삼성디스플레이 주식회사 디스플레이 패널의 리페어 장치 및 디스플레이 패널의 리페어 방법
GB2529153A (en) * 2014-08-06 2016-02-17 Bae Systems Plc Substrate manufacture
KR101789185B1 (ko) * 2016-02-05 2017-10-23 주식회사 이오테크닉스 레이저 빔의 경사각을 이용한 레이저 가공방법
US9852997B2 (en) * 2016-03-25 2017-12-26 Applied Materials, Inc. Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
CN106695136B (zh) * 2017-01-12 2017-09-29 广东工业大学 一种多层印刷电路板的激光打孔方法及使用其的系统
DE102017108437B4 (de) * 2017-04-20 2020-07-09 Gottfried Wilhelm Leibniz Universität Hannover Elektrische Schaltungsstruktur und Verfahren zu deren Herstellung
WO2018226687A1 (en) * 2017-06-07 2018-12-13 Kci Licensing, Inc. Methods for manufacturing and assembling dual material tissue interface for negative-pressure therapy
JP2019107789A (ja) * 2017-12-15 2019-07-04 株式会社小糸製作所 樹脂成形品および車両用部品
CN112692454A (zh) * 2020-12-17 2021-04-23 华清创智光电科技(清远)有限公司 一种双头激光光路系统及其加工pcb板盲孔的方法
CN115348730A (zh) * 2021-05-12 2022-11-15 无锡深南电路有限公司 一种线路板钻孔方法、制备方法以及线路板
CN117300394B (zh) * 2023-11-28 2024-02-23 武汉铱科赛科技有限公司 一种激光盲孔钻孔方法、设备、装置及系统

Citations (1)

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US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets

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US5126532A (en) * 1989-01-10 1992-06-30 Canon Kabushiki Kaisha Apparatus and method of boring using laser
FI982568A7 (fi) * 1997-12-02 1999-06-03 Samsung Electro Mech Menetelmä monikerroksisen painetun piirilevyn valmistamiseksi
WO2000056129A1 (de) * 1999-03-16 2000-09-21 Siemens Aktiengesellschaft Verfahren zum einbringen von durchkontaktierungslöchern in ein beidseitig mit metallschichten versehenes, elektrisch isolierendes basismaterial
KR100670841B1 (ko) * 1999-12-07 2007-01-18 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 스위칭가능 파장 레이저 기반의 에칭 회로 기판 처리 시스템
WO2001074529A2 (en) * 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces
JP4373596B2 (ja) * 2000-10-06 2009-11-25 日立ビアメカニクス株式会社 プリント基板の加工方法
JP4734723B2 (ja) * 2001-01-31 2011-07-27 凸版印刷株式会社 同軸ビアホールを用いた多層配線基板の製造方法
DE10125397B4 (de) * 2001-05-23 2005-03-03 Siemens Ag Verfahren zum Bohren von Mikrolöchern mit einem Laserstrahl
DE10201476B4 (de) * 2002-01-16 2005-02-24 Siemens Ag Laserbearbeitungsvorrichtung
JP2003320470A (ja) * 2002-05-02 2003-11-11 Quantum Design Japan Inc 赤外線レーザアシストによる紫外線レーザ加工方法および加工装置
DE10251480B4 (de) * 2002-11-05 2008-01-24 Hitachi Via Mechanics, Ltd., Ebina Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem elektrischen Schaltungssubstrat
JP3720034B2 (ja) * 2003-05-26 2005-11-24 住友重機械工業株式会社 穴あけ加工方法
TW200518869A (en) * 2003-10-06 2005-06-16 Shinko Electric Ind Co Method for forming via-hole in resin layer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets

Also Published As

Publication number Publication date
KR101289755B1 (ko) 2013-07-26
DE102004040068B4 (de) 2018-01-04
HK1101278A1 (en) 2007-10-12
JP4695140B2 (ja) 2011-06-08
CN1997482A (zh) 2007-07-11
WO2006018372A1 (de) 2006-02-23
DE102004040068A1 (de) 2006-04-13
JP2008510311A (ja) 2008-04-03
KR20070043708A (ko) 2007-04-25

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