JP4692276B2 - 支持機構及び支持機構を使ったマスクステージ - Google Patents

支持機構及び支持機構を使ったマスクステージ Download PDF

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Publication number
JP4692276B2
JP4692276B2 JP2005378598A JP2005378598A JP4692276B2 JP 4692276 B2 JP4692276 B2 JP 4692276B2 JP 2005378598 A JP2005378598 A JP 2005378598A JP 2005378598 A JP2005378598 A JP 2005378598A JP 4692276 B2 JP4692276 B2 JP 4692276B2
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JP
Japan
Prior art keywords
mask
support
displacement
fixed
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005378598A
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English (en)
Japanese (ja)
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JP2007178819A (ja
Inventor
米太 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ushio Denki KK
Original Assignee
Ushio Denki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Denki KK filed Critical Ushio Denki KK
Priority to JP2005378598A priority Critical patent/JP4692276B2/ja
Priority to TW095134631A priority patent/TWI391985B/zh
Priority to KR1020060101924A priority patent/KR101025086B1/ko
Priority to CN2006101727127A priority patent/CN1991593B/zh
Publication of JP2007178819A publication Critical patent/JP2007178819A/ja
Application granted granted Critical
Publication of JP4692276B2 publication Critical patent/JP4692276B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2005378598A 2005-12-28 2005-12-28 支持機構及び支持機構を使ったマスクステージ Expired - Fee Related JP4692276B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005378598A JP4692276B2 (ja) 2005-12-28 2005-12-28 支持機構及び支持機構を使ったマスクステージ
TW095134631A TWI391985B (zh) 2005-12-28 2006-09-19 A support mechanism and a mask stage using the support mechanism
KR1020060101924A KR101025086B1 (ko) 2005-12-28 2006-10-19 지지기구 및 지지기구를 사용한 마스크 스테이지
CN2006101727127A CN1991593B (zh) 2005-12-28 2006-12-28 支持机构及使用支持机构的掩模载台

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005378598A JP4692276B2 (ja) 2005-12-28 2005-12-28 支持機構及び支持機構を使ったマスクステージ

Publications (2)

Publication Number Publication Date
JP2007178819A JP2007178819A (ja) 2007-07-12
JP4692276B2 true JP4692276B2 (ja) 2011-06-01

Family

ID=38213924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005378598A Expired - Fee Related JP4692276B2 (ja) 2005-12-28 2005-12-28 支持機構及び支持機構を使ったマスクステージ

Country Status (4)

Country Link
JP (1) JP4692276B2 (zh)
KR (1) KR101025086B1 (zh)
CN (1) CN1991593B (zh)
TW (1) TWI391985B (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4495752B2 (ja) * 2007-11-06 2010-07-07 東京エレクトロン株式会社 基板処理装置及び塗布装置
EP2110455A1 (en) * 2008-04-18 2009-10-21 Applied Materials, Inc. Mask support, mask assembly, and assembly comprising a mask support and a mask
KR100971323B1 (ko) 2008-08-21 2010-07-20 주식회사 동부하이텍 노광공정에서 레티클의 회전량 및 시프트량의 다중보정을 위한 레티클 스테이지 및 이를 이용한 다중보정방법
JP5117456B2 (ja) * 2009-07-29 2013-01-16 株式会社日立ハイテクノロジーズ 露光装置
NL2006190A (en) 2010-03-11 2011-09-13 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP5677025B2 (ja) * 2010-10-22 2015-02-25 株式会社トプコン 載置ステージ
KR101228622B1 (ko) * 2012-10-15 2013-02-01 마이다스시스템주식회사 마스크 얼라이너용 스테이지 레벨링장치
KR101456661B1 (ko) * 2013-01-23 2014-11-12 안성룡 수평 유지 장치
CN203117640U (zh) * 2013-03-19 2013-08-07 深圳市华星光电技术有限公司 曝光机的玻璃基板支撑机构
CN103268057B (zh) * 2013-04-28 2014-12-17 京东方科技集团股份有限公司 掩模系统、掩模方法、曝光系统和曝光方法
KR102254042B1 (ko) * 2013-08-12 2021-05-21 어플라이드 머티리얼즈 이스라엘 리미티드 마스크를 마스크 홀더에 부착하기 위한 시스템 및 방법
CN104570592B (zh) * 2013-10-11 2019-04-30 上海微电子装备（集团）股份有限公司 一种大掩模版整形装置和方法
CN104749902B (zh) * 2013-12-31 2017-02-15 上海微电子装备有限公司 掩模板面型整形装置
CN106415814B (zh) * 2014-05-03 2019-10-11 株式会社半导体能源研究所 薄膜状部件支撑设备
CN106575086B (zh) * 2014-08-01 2018-05-18 株式会社村田制作所 直写型曝光装置
CN105108674A (zh) * 2015-08-03 2015-12-02 合肥鑫晟光电科技有限公司 支撑吸附组件、支撑装置及其操作方法
CN109841536A (zh) * 2017-11-29 2019-06-04 长鑫存储技术有限公司 边缘补偿系统、晶圆载台系统及晶圆安装方法
CN111830789B (zh) * 2019-04-17 2021-07-02 上海微电子装备（集团）股份有限公司 平衡质量装置及光刻设备
CN112647046B (zh) * 2020-11-18 2022-05-17 昆山工研院新型平板显示技术中心有限公司 蒸镀装置及蒸镀方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139330A (ja) * 1985-12-13 1987-06-23 Toshiba Mach Co Ltd 被処理材の固定方法および装置
JPH07192984A (ja) * 1993-12-27 1995-07-28 Toshiba Mach Co Ltd 薄板固定装置
JPH11214295A (ja) * 1998-01-23 1999-08-06 Nikon Corp 露光装置、露光条件決定方法及び露光方法、並びにデバイス製造方法
JP2001332480A (ja) * 2000-05-24 2001-11-30 Canon Inc 原版チャック、該原版チャックを備えた露光装置および半導体デバイス製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2748127B2 (ja) * 1988-09-02 1998-05-06 キヤノン株式会社 ウエハ保持方法
US5253012A (en) * 1990-10-05 1993-10-12 Canon Kabushiki Kaisha Substrate holding apparatus for vertically holding a substrate in an exposure apparatus
JPH04162610A (ja) * 1990-10-26 1992-06-08 Canon Inc マスク保持装置
JP3244894B2 (ja) * 1993-11-30 2002-01-07 キヤノン株式会社 マスク保持方法、マスク及びマスクチャック、ならびにこれを用いた露光装置とデバイス製造方法
EP0677787B1 (en) * 1994-03-15 1998-10-21 Canon Kabushiki Kaisha Mask and mask supporting mechanism
JP3940823B2 (ja) * 1994-12-26 2007-07-04 株式会社ニコン ステージ装置及びその制御方法
US5854819A (en) * 1996-02-07 1998-12-29 Canon Kabushiki Kaisha Mask supporting device and correction method therefor, and exposure apparatus and device producing method utilizing the same
JPH09281717A (ja) * 1996-04-10 1997-10-31 Ushio Inc マスクステージの位置決め機構
KR20010009997A (ko) * 1999-07-15 2001-02-05 김영환 레티클 스테이지
JP4122922B2 (ja) * 2002-10-18 2008-07-23 ウシオ電機株式会社 平面ステージ装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139330A (ja) * 1985-12-13 1987-06-23 Toshiba Mach Co Ltd 被処理材の固定方法および装置
JPH07192984A (ja) * 1993-12-27 1995-07-28 Toshiba Mach Co Ltd 薄板固定装置
JPH11214295A (ja) * 1998-01-23 1999-08-06 Nikon Corp 露光装置、露光条件決定方法及び露光方法、並びにデバイス製造方法
JP2001332480A (ja) * 2000-05-24 2001-11-30 Canon Inc 原版チャック、該原版チャックを備えた露光装置および半導体デバイス製造方法

Also Published As

Publication number Publication date
KR101025086B1 (ko) 2011-03-25
CN1991593B (zh) 2011-12-07
CN1991593A (zh) 2007-07-04
TW200725696A (en) 2007-07-01
TWI391985B (zh) 2013-04-01
KR20070070048A (ko) 2007-07-03
JP2007178819A (ja) 2007-07-12

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