JP4691667B2 - ウェハ用のチャックと、それを使用するウェハの研磨加工方法 - Google Patents

ウェハ用のチャックと、それを使用するウェハの研磨加工方法 Download PDF

Info

Publication number
JP4691667B2
JP4691667B2 JP2004299590A JP2004299590A JP4691667B2 JP 4691667 B2 JP4691667 B2 JP 4691667B2 JP 2004299590 A JP2004299590 A JP 2004299590A JP 2004299590 A JP2004299590 A JP 2004299590A JP 4691667 B2 JP4691667 B2 JP 4691667B2
Authority
JP
Japan
Prior art keywords
wafer
chuck
groove
gap
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004299590A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006114643A5 (enExample
JP2006114643A (ja
Inventor
貴志 吉田
慎一 村上
洋之 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBS KINMEI CO., LTD.
Mimasu Semiconductor Industry Co Ltd
Original Assignee
BBS KINMEI CO., LTD.
Mimasu Semiconductor Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBS KINMEI CO., LTD., Mimasu Semiconductor Industry Co Ltd filed Critical BBS KINMEI CO., LTD.
Priority to JP2004299590A priority Critical patent/JP4691667B2/ja
Priority to US11/241,928 priority patent/US20060084371A1/en
Priority to TW094135623A priority patent/TW200620527A/zh
Publication of JP2006114643A publication Critical patent/JP2006114643A/ja
Publication of JP2006114643A5 publication Critical patent/JP2006114643A5/ja
Application granted granted Critical
Publication of JP4691667B2 publication Critical patent/JP4691667B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Jigs For Machine Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2004299590A 2004-10-14 2004-10-14 ウェハ用のチャックと、それを使用するウェハの研磨加工方法 Expired - Lifetime JP4691667B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004299590A JP4691667B2 (ja) 2004-10-14 2004-10-14 ウェハ用のチャックと、それを使用するウェハの研磨加工方法
US11/241,928 US20060084371A1 (en) 2004-10-14 2005-10-04 Wafer chuck
TW094135623A TW200620527A (en) 2004-10-14 2005-10-13 Wafer chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004299590A JP4691667B2 (ja) 2004-10-14 2004-10-14 ウェハ用のチャックと、それを使用するウェハの研磨加工方法

Publications (3)

Publication Number Publication Date
JP2006114643A JP2006114643A (ja) 2006-04-27
JP2006114643A5 JP2006114643A5 (enExample) 2007-10-04
JP4691667B2 true JP4691667B2 (ja) 2011-06-01

Family

ID=36181388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004299590A Expired - Lifetime JP4691667B2 (ja) 2004-10-14 2004-10-14 ウェハ用のチャックと、それを使用するウェハの研磨加工方法

Country Status (3)

Country Link
US (1) US20060084371A1 (enExample)
JP (1) JP4691667B2 (enExample)
TW (1) TW200620527A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070292245A1 (en) * 2006-05-25 2007-12-20 Nikon Corporation Stage assembly with secure device holder
US7559825B2 (en) 2006-12-21 2009-07-14 Memc Electronic Materials, Inc. Method of polishing a semiconductor wafer
CN102962743B (zh) * 2012-11-28 2015-06-24 天津市环欧半导体材料技术有限公司 一种可加工非标硅片的倒角机
CN103600243B (zh) * 2013-11-04 2015-12-02 上海应用技术学院 一种齿轮泵齿轮孔的镗床用夹具
CN105598836B (zh) * 2016-01-29 2018-06-26 苏州普维迪工业自动化有限公司 应用于五金钳类工具磨削的夹持装置及其方法
KR101844965B1 (ko) * 2017-09-11 2018-04-03 주식회사 기홍메가텍 원통형 부품 가공용 클램핑 장치
CN108436731A (zh) * 2018-05-09 2018-08-24 海宁鼎合工程技术开发有限公司 一种用于钢材精加工的抛光装置及其使用方法
JP7146457B2 (ja) * 2018-05-31 2022-10-04 日東電工株式会社 粘着テープ剥離方法および粘着テープ剥離装置
CN110752175A (zh) * 2019-09-19 2020-02-04 上海提牛机电设备有限公司 一种晶圆托片机构
CN110936039B (zh) * 2019-12-19 2021-09-03 北京航天控制仪器研究所 一种激光加工自动定位夹紧工装装置
CN114633191A (zh) * 2022-01-17 2022-06-17 深圳赛贝尔自动化设备有限公司 晶圆周抛机及其校正定位方法
CN118507410B (zh) * 2024-05-14 2025-10-28 江南大学 半导体加工用定位装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3653854A (en) * 1969-09-29 1972-04-04 Toyoda Machine Works Ltd Digitally controlled grinding machines
US5485644A (en) * 1993-03-18 1996-01-23 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus
JP3202898B2 (ja) * 1994-08-08 2001-08-27 東京エレクトロン株式会社 搬送装置、搬送方法、洗浄装置及び洗浄方法
JPH0917762A (ja) * 1995-06-29 1997-01-17 Tokyo Electron Ltd 処理装置
US5853496A (en) * 1995-08-08 1998-12-29 Tokyo Electron Limited Transfer machine, transfer method, cleaning machine, and cleaning method
JP2000315665A (ja) * 1999-04-29 2000-11-14 Ebara Corp 研磨方法及び装置
JPH10173033A (ja) * 1996-12-10 1998-06-26 Sony Corp ウェーハ保持機構
JP3578194B2 (ja) * 1997-03-18 2004-10-20 株式会社東京精密 ウェーハ位置決め方法及び装置
US6368040B1 (en) * 1998-02-18 2002-04-09 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
JP3560011B2 (ja) * 1998-02-24 2004-09-02 東京エレクトロン株式会社 基板保持具
JP2000158337A (ja) * 1998-11-27 2000-06-13 Speedfam-Ipec Co Ltd 端面研磨装置におけるウエハチャック機構
US6543461B2 (en) * 1999-02-11 2003-04-08 Nova Measuring Instruments Ltd. Buffer system for a wafer handling system field of the invention
JP2000263405A (ja) * 1999-03-17 2000-09-26 Komatsu Electronic Metals Co Ltd 半導体ウェハのノッチ面取り面研磨方法および研磨装置
US6954585B2 (en) * 2002-12-03 2005-10-11 Tokyo Electron Limited Substrate processing method and apparatus

Also Published As

Publication number Publication date
TW200620527A (en) 2006-06-16
US20060084371A1 (en) 2006-04-20
JP2006114643A (ja) 2006-04-27

Similar Documents

Publication Publication Date Title
JP4691667B2 (ja) ウェハ用のチャックと、それを使用するウェハの研磨加工方法
CN102463535B (zh) 夹持装置
CN107851575B (zh) 平坦加工装置
JPH11291165A (ja) 研磨装置及び研磨方法
CN116551477A (zh) 一种用于丝杆类零件的强化研磨装置
US11565364B2 (en) Polishing device for welding tip
CN101062547B (zh) 透镜加工方法
CN103943446A (zh) 扫描头及运用此扫描头的扫描臂
CN101043977B (zh) 动力传输链用链销的磨削装置及动力传输链用链销的制造方法
KR100630381B1 (ko) 가공물 고정장치
JP5065739B2 (ja) 光学素子の面取り加工方法、面取り加工装置
JP5850527B2 (ja) 切削加工に用いられる取付具、切削加工装置、および切削加工方法
CN106466715A (zh) 加工涡旋的方法和涡旋加工装置
CN209207002U (zh) 夹紧机构
CN114178931A (zh) 蓝宝石晶片v型notch槽的倒角加工定位装置及方法
JPH10175144A (ja) 薄板円板状ワークの両面研削装置
CN211490609U (zh) Cnc精加工用夹具
CN118456192B (zh) 一种非标曲面眼镜片抛光设备
JP2023079004A (ja) 研磨装置
KR20160087538A (ko) 기판 연마장치 및 기판 코너 연마방법
KR102854941B1 (ko) 단부면 가공 장치
KR102321504B1 (ko) 로봇 가공용 지그의 구조
CN222609283U (zh) 翻转定位装置
JPH08323597A (ja) 板材の面取り方法およびその装置
CN214080835U (zh) 一种瓷砖抛光装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070821

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070821

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20091130

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100928

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101117

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110118

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110128

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140304

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4691667

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term