JP2006114643A5 - - Google Patents

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Publication number
JP2006114643A5
JP2006114643A5 JP2004299590A JP2004299590A JP2006114643A5 JP 2006114643 A5 JP2006114643 A5 JP 2006114643A5 JP 2004299590 A JP2004299590 A JP 2004299590A JP 2004299590 A JP2004299590 A JP 2004299590A JP 2006114643 A5 JP2006114643 A5 JP 2006114643A5
Authority
JP
Japan
Prior art keywords
wafer
wafer chuck
groove
chuck according
holding members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004299590A
Other languages
English (en)
Japanese (ja)
Other versions
JP4691667B2 (ja
JP2006114643A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004299590A priority Critical patent/JP4691667B2/ja
Priority claimed from JP2004299590A external-priority patent/JP4691667B2/ja
Priority to US11/241,928 priority patent/US20060084371A1/en
Priority to TW094135623A priority patent/TW200620527A/zh
Publication of JP2006114643A publication Critical patent/JP2006114643A/ja
Publication of JP2006114643A5 publication Critical patent/JP2006114643A5/ja
Application granted granted Critical
Publication of JP4691667B2 publication Critical patent/JP4691667B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2004299590A 2004-10-14 2004-10-14 ウェハ用のチャックと、それを使用するウェハの研磨加工方法 Expired - Lifetime JP4691667B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004299590A JP4691667B2 (ja) 2004-10-14 2004-10-14 ウェハ用のチャックと、それを使用するウェハの研磨加工方法
US11/241,928 US20060084371A1 (en) 2004-10-14 2005-10-04 Wafer chuck
TW094135623A TW200620527A (en) 2004-10-14 2005-10-13 Wafer chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004299590A JP4691667B2 (ja) 2004-10-14 2004-10-14 ウェハ用のチャックと、それを使用するウェハの研磨加工方法

Publications (3)

Publication Number Publication Date
JP2006114643A JP2006114643A (ja) 2006-04-27
JP2006114643A5 true JP2006114643A5 (enExample) 2007-10-04
JP4691667B2 JP4691667B2 (ja) 2011-06-01

Family

ID=36181388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004299590A Expired - Lifetime JP4691667B2 (ja) 2004-10-14 2004-10-14 ウェハ用のチャックと、それを使用するウェハの研磨加工方法

Country Status (3)

Country Link
US (1) US20060084371A1 (enExample)
JP (1) JP4691667B2 (enExample)
TW (1) TW200620527A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070292245A1 (en) * 2006-05-25 2007-12-20 Nikon Corporation Stage assembly with secure device holder
US7559825B2 (en) 2006-12-21 2009-07-14 Memc Electronic Materials, Inc. Method of polishing a semiconductor wafer
CN102962743B (zh) * 2012-11-28 2015-06-24 天津市环欧半导体材料技术有限公司 一种可加工非标硅片的倒角机
CN103600243B (zh) * 2013-11-04 2015-12-02 上海应用技术学院 一种齿轮泵齿轮孔的镗床用夹具
CN105598836B (zh) * 2016-01-29 2018-06-26 苏州普维迪工业自动化有限公司 应用于五金钳类工具磨削的夹持装置及其方法
KR101844965B1 (ko) * 2017-09-11 2018-04-03 주식회사 기홍메가텍 원통형 부품 가공용 클램핑 장치
CN108436731A (zh) * 2018-05-09 2018-08-24 海宁鼎合工程技术开发有限公司 一种用于钢材精加工的抛光装置及其使用方法
JP7146457B2 (ja) * 2018-05-31 2022-10-04 日東電工株式会社 粘着テープ剥離方法および粘着テープ剥離装置
CN110752175A (zh) * 2019-09-19 2020-02-04 上海提牛机电设备有限公司 一种晶圆托片机构
CN110936039B (zh) * 2019-12-19 2021-09-03 北京航天控制仪器研究所 一种激光加工自动定位夹紧工装装置
CN114633191A (zh) * 2022-01-17 2022-06-17 深圳赛贝尔自动化设备有限公司 晶圆周抛机及其校正定位方法
CN118507410B (zh) * 2024-05-14 2025-10-28 江南大学 半导体加工用定位装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3653854A (en) * 1969-09-29 1972-04-04 Toyoda Machine Works Ltd Digitally controlled grinding machines
US5485644A (en) * 1993-03-18 1996-01-23 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus
JP3202898B2 (ja) * 1994-08-08 2001-08-27 東京エレクトロン株式会社 搬送装置、搬送方法、洗浄装置及び洗浄方法
JPH0917762A (ja) * 1995-06-29 1997-01-17 Tokyo Electron Ltd 処理装置
US5853496A (en) * 1995-08-08 1998-12-29 Tokyo Electron Limited Transfer machine, transfer method, cleaning machine, and cleaning method
JP2000315665A (ja) * 1999-04-29 2000-11-14 Ebara Corp 研磨方法及び装置
JPH10173033A (ja) * 1996-12-10 1998-06-26 Sony Corp ウェーハ保持機構
JP3578194B2 (ja) * 1997-03-18 2004-10-20 株式会社東京精密 ウェーハ位置決め方法及び装置
US6368040B1 (en) * 1998-02-18 2002-04-09 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
JP3560011B2 (ja) * 1998-02-24 2004-09-02 東京エレクトロン株式会社 基板保持具
JP2000158337A (ja) * 1998-11-27 2000-06-13 Speedfam-Ipec Co Ltd 端面研磨装置におけるウエハチャック機構
US6543461B2 (en) * 1999-02-11 2003-04-08 Nova Measuring Instruments Ltd. Buffer system for a wafer handling system field of the invention
JP2000263405A (ja) * 1999-03-17 2000-09-26 Komatsu Electronic Metals Co Ltd 半導体ウェハのノッチ面取り面研磨方法および研磨装置
US6954585B2 (en) * 2002-12-03 2005-10-11 Tokyo Electron Limited Substrate processing method and apparatus

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