TW200620527A - Wafer chuck - Google Patents

Wafer chuck

Info

Publication number
TW200620527A
TW200620527A TW094135623A TW94135623A TW200620527A TW 200620527 A TW200620527 A TW 200620527A TW 094135623 A TW094135623 A TW 094135623A TW 94135623 A TW94135623 A TW 94135623A TW 200620527 A TW200620527 A TW 200620527A
Authority
TW
Taiwan
Prior art keywords
wafer chuck
holding members
holding
wafer
driving
Prior art date
Application number
TW094135623A
Other languages
English (en)
Chinese (zh)
Inventor
Takashi Yoshida
Shinichi Murakami
Hiroyuki Itou
Original Assignee
Bbs Kinmei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbs Kinmei Co Ltd filed Critical Bbs Kinmei Co Ltd
Publication of TW200620527A publication Critical patent/TW200620527A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Jigs For Machine Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW094135623A 2004-10-14 2005-10-13 Wafer chuck TW200620527A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004299590A JP4691667B2 (ja) 2004-10-14 2004-10-14 ウェハ用のチャックと、それを使用するウェハの研磨加工方法

Publications (1)

Publication Number Publication Date
TW200620527A true TW200620527A (en) 2006-06-16

Family

ID=36181388

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094135623A TW200620527A (en) 2004-10-14 2005-10-13 Wafer chuck

Country Status (3)

Country Link
US (1) US20060084371A1 (enExample)
JP (1) JP4691667B2 (enExample)
TW (1) TW200620527A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070292245A1 (en) * 2006-05-25 2007-12-20 Nikon Corporation Stage assembly with secure device holder
US7559825B2 (en) 2006-12-21 2009-07-14 Memc Electronic Materials, Inc. Method of polishing a semiconductor wafer
CN102962743B (zh) * 2012-11-28 2015-06-24 天津市环欧半导体材料技术有限公司 一种可加工非标硅片的倒角机
CN103600243B (zh) * 2013-11-04 2015-12-02 上海应用技术学院 一种齿轮泵齿轮孔的镗床用夹具
CN105598836B (zh) * 2016-01-29 2018-06-26 苏州普维迪工业自动化有限公司 应用于五金钳类工具磨削的夹持装置及其方法
KR101844965B1 (ko) * 2017-09-11 2018-04-03 주식회사 기홍메가텍 원통형 부품 가공용 클램핑 장치
CN108436731A (zh) * 2018-05-09 2018-08-24 海宁鼎合工程技术开发有限公司 一种用于钢材精加工的抛光装置及其使用方法
JP7146457B2 (ja) * 2018-05-31 2022-10-04 日東電工株式会社 粘着テープ剥離方法および粘着テープ剥離装置
CN110752175A (zh) * 2019-09-19 2020-02-04 上海提牛机电设备有限公司 一种晶圆托片机构
CN110936039B (zh) * 2019-12-19 2021-09-03 北京航天控制仪器研究所 一种激光加工自动定位夹紧工装装置
CN114633191A (zh) * 2022-01-17 2022-06-17 深圳赛贝尔自动化设备有限公司 晶圆周抛机及其校正定位方法
CN118507410B (zh) * 2024-05-14 2025-10-28 江南大学 半导体加工用定位装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3653854A (en) * 1969-09-29 1972-04-04 Toyoda Machine Works Ltd Digitally controlled grinding machines
US5485644A (en) * 1993-03-18 1996-01-23 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus
JP3202898B2 (ja) * 1994-08-08 2001-08-27 東京エレクトロン株式会社 搬送装置、搬送方法、洗浄装置及び洗浄方法
JPH0917762A (ja) * 1995-06-29 1997-01-17 Tokyo Electron Ltd 処理装置
US5853496A (en) * 1995-08-08 1998-12-29 Tokyo Electron Limited Transfer machine, transfer method, cleaning machine, and cleaning method
JP2000315665A (ja) * 1999-04-29 2000-11-14 Ebara Corp 研磨方法及び装置
JPH10173033A (ja) * 1996-12-10 1998-06-26 Sony Corp ウェーハ保持機構
JP3578194B2 (ja) * 1997-03-18 2004-10-20 株式会社東京精密 ウェーハ位置決め方法及び装置
US6368040B1 (en) * 1998-02-18 2002-04-09 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
JP3560011B2 (ja) * 1998-02-24 2004-09-02 東京エレクトロン株式会社 基板保持具
JP2000158337A (ja) * 1998-11-27 2000-06-13 Speedfam-Ipec Co Ltd 端面研磨装置におけるウエハチャック機構
US6543461B2 (en) * 1999-02-11 2003-04-08 Nova Measuring Instruments Ltd. Buffer system for a wafer handling system field of the invention
JP2000263405A (ja) * 1999-03-17 2000-09-26 Komatsu Electronic Metals Co Ltd 半導体ウェハのノッチ面取り面研磨方法および研磨装置
US6954585B2 (en) * 2002-12-03 2005-10-11 Tokyo Electron Limited Substrate processing method and apparatus

Also Published As

Publication number Publication date
US20060084371A1 (en) 2006-04-20
JP4691667B2 (ja) 2011-06-01
JP2006114643A (ja) 2006-04-27

Similar Documents

Publication Publication Date Title
TW200620527A (en) Wafer chuck
AU2003299587A1 (en) Silicon carbide power mos field effect transistors and manufacturing methods
AU2002309506A1 (en) Semiconductor wafer lifting device and methods for implementing the same
AU2003273931A1 (en) Retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device
MY122784A (en) Abrasive article suitable for modifying a semiconductor wafer
TW200720383A (en) Polishing fluids and methods for CMP
ATE484551T1 (de) Oberflächenmodifizierte siliciumdioxid- titandioxid-mischoxide
NO20053696L (no) Belagte multifilamentinnretninger overtrukket med innesluttede partikler
AU2003227267A1 (en) Sealing bag with chuck
GB2424516B (en) Protecting thin semiconductor wafers during back-grinding in high-volume production
TW200738856A (en) Polishing composition and polishing method
AU2003291154A1 (en) Spring-loaded contour following end effectors for lapping/polishing
AU2003274895A1 (en) Metal polish composition, polishing method using the composition and method for producing wafer using the polishing method
AU2003275655A1 (en) Polishing slurry and polished substrate
AU2003210584A1 (en) Micro-electro-discharge machining utilizing semiconductor electrodes
AU2003221723A1 (en) Precision portable flange grinder
AU2003237767A1 (en) Single wafer fabrication of integrated micro-fluidic system
MY143042A (en) Polishing composition
DE60121070D1 (de) Schleifwerkzeug
BR0207620A (pt) Ferramenta de abrasão e extremidade de lixamento de combinação
AU2003296168A1 (en) Chuck device of container, transportation device with the same, and chuck claw for the transportation device
AU2003250921A1 (en) Holder for flat workpieces, in particular semiconductor wafers for mechanochemical polishing
AU2002231332A1 (en) Belt polishing device with double retainer ring
MXPA06000372A (es) Compuestos de silicio y su uso.
FI20020607A0 (fi) Kantoaineen hionta