JP2006114643A - ウェハ用のチャック - Google Patents
ウェハ用のチャック Download PDFInfo
- Publication number
- JP2006114643A JP2006114643A JP2004299590A JP2004299590A JP2006114643A JP 2006114643 A JP2006114643 A JP 2006114643A JP 2004299590 A JP2004299590 A JP 2004299590A JP 2004299590 A JP2004299590 A JP 2004299590A JP 2006114643 A JP2006114643 A JP 2006114643A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holding members
- groove
- chuck
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000005498 polishing Methods 0.000 claims description 14
- 239000002002 slurry Substances 0.000 abstract description 5
- 238000007517 polishing process Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 72
- 230000002093 peripheral effect Effects 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Jigs For Machine Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
【解決手段】ウェハWの外周を保持するクッション材より成る保持部材10、20と、保持部材10、20を一斉に閉じ方向に駆動するエヤシリンダよりなる駆動機構30とを一体に組み合わせる。ウェハの外周をV溝14aのある保持部材で保持することにより研磨加工中のスラリの影響を最少に抑える。
【選択図】図1
Description
Wo …中心
N…ノッチ
θ1 、θ2 …頂角
10、20…保持部材
14、22…クッション材
14a、22a…V溝
14b…ガイド溝
30…駆動機構
特許出願人 三益半導体工業株式会社
株式会社 ビービーエス金明
代理人 弁理士 松 田 忠 秋
Claims (5)
- ウェハの外周を径方向に押圧してウェハを保持する複数の保持部材と、該保持部材を一斉に閉じ方向に駆動する駆動機構とを備えてなるウェハ用のチャック。
- 前記保持部材は、それぞれクッション材を介してウェハを保持することを特徴とする請求項1記載のウェハ用のチャック。
- 前記クッション材は、ウェハの外周部を弾発的に狭持するV溝を形成することを特徴とする請求項2記載のウェハ用のチャック。
- 前記クッション材は、前記V溝より大きな頂角のガイド溝を前記V溝の開口方向に形成することを特徴とする請求項3記載のウェハ用のチャック。
- ウェハのV字状のオリエンテーション用のノッチの研磨加工用であることを特徴とする請求項1ないし請求項4のいずれか記載のウェハ用のチャック。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004299590A JP4691667B2 (ja) | 2004-10-14 | 2004-10-14 | ウェハ用のチャックと、それを使用するウェハの研磨加工方法 |
US11/241,928 US20060084371A1 (en) | 2004-10-14 | 2005-10-04 | Wafer chuck |
TW094135623A TW200620527A (en) | 2004-10-14 | 2005-10-13 | Wafer chuck |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004299590A JP4691667B2 (ja) | 2004-10-14 | 2004-10-14 | ウェハ用のチャックと、それを使用するウェハの研磨加工方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006114643A true JP2006114643A (ja) | 2006-04-27 |
JP2006114643A5 JP2006114643A5 (ja) | 2007-10-04 |
JP4691667B2 JP4691667B2 (ja) | 2011-06-01 |
Family
ID=36181388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004299590A Active JP4691667B2 (ja) | 2004-10-14 | 2004-10-14 | ウェハ用のチャックと、それを使用するウェハの研磨加工方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20060084371A1 (ja) |
JP (1) | JP4691667B2 (ja) |
TW (1) | TW200620527A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7559825B2 (en) | 2006-12-21 | 2009-07-14 | Memc Electronic Materials, Inc. | Method of polishing a semiconductor wafer |
KR101844965B1 (ko) * | 2017-09-11 | 2018-04-03 | 주식회사 기홍메가텍 | 원통형 부품 가공용 클램핑 장치 |
JP2019212671A (ja) * | 2018-05-31 | 2019-12-12 | 日東電工株式会社 | 粘着テープ剥離方法および粘着テープ剥離装置 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070292245A1 (en) * | 2006-05-25 | 2007-12-20 | Nikon Corporation | Stage assembly with secure device holder |
CN102962743B (zh) * | 2012-11-28 | 2015-06-24 | 天津市环欧半导体材料技术有限公司 | 一种可加工非标硅片的倒角机 |
CN103600243B (zh) * | 2013-11-04 | 2015-12-02 | 上海应用技术学院 | 一种齿轮泵齿轮孔的镗床用夹具 |
CN105598836B (zh) * | 2016-01-29 | 2018-06-26 | 苏州普维迪工业自动化有限公司 | 应用于五金钳类工具磨削的夹持装置及其方法 |
CN108436731A (zh) * | 2018-05-09 | 2018-08-24 | 海宁鼎合工程技术开发有限公司 | 一种用于钢材精加工的抛光装置及其使用方法 |
CN110752175A (zh) * | 2019-09-19 | 2020-02-04 | 上海提牛机电设备有限公司 | 一种晶圆托片机构 |
CN110936039B (zh) * | 2019-12-19 | 2021-09-03 | 北京航天控制仪器研究所 | 一种激光加工自动定位夹紧工装装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08107137A (ja) * | 1994-08-08 | 1996-04-23 | Tokyo Electron Ltd | 搬送装置、搬送方法、洗浄装置及び洗浄方法 |
JPH0917762A (ja) * | 1995-06-29 | 1997-01-17 | Tokyo Electron Ltd | 処理装置 |
JPH10173033A (ja) * | 1996-12-10 | 1998-06-26 | Sony Corp | ウェーハ保持機構 |
JP2000158337A (ja) * | 1998-11-27 | 2000-06-13 | Speedfam-Ipec Co Ltd | 端面研磨装置におけるウエハチャック機構 |
JP2000263405A (ja) * | 1999-03-17 | 2000-09-26 | Komatsu Electronic Metals Co Ltd | 半導体ウェハのノッチ面取り面研磨方法および研磨装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3653854A (en) * | 1969-09-29 | 1972-04-04 | Toyoda Machine Works Ltd | Digitally controlled grinding machines |
US5485644A (en) * | 1993-03-18 | 1996-01-23 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus |
US5853496A (en) * | 1995-08-08 | 1998-12-29 | Tokyo Electron Limited | Transfer machine, transfer method, cleaning machine, and cleaning method |
JP2000315665A (ja) * | 1999-04-29 | 2000-11-14 | Ebara Corp | 研磨方法及び装置 |
JP3578194B2 (ja) * | 1997-03-18 | 2004-10-20 | 株式会社東京精密 | ウェーハ位置決め方法及び装置 |
US6368040B1 (en) * | 1998-02-18 | 2002-04-09 | Tokyo Electron Limited | Apparatus for and method of transporting substrates to be processed |
JP3560011B2 (ja) * | 1998-02-24 | 2004-09-02 | 東京エレクトロン株式会社 | 基板保持具 |
US6543461B2 (en) * | 1999-02-11 | 2003-04-08 | Nova Measuring Instruments Ltd. | Buffer system for a wafer handling system field of the invention |
US6954585B2 (en) * | 2002-12-03 | 2005-10-11 | Tokyo Electron Limited | Substrate processing method and apparatus |
-
2004
- 2004-10-14 JP JP2004299590A patent/JP4691667B2/ja active Active
-
2005
- 2005-10-04 US US11/241,928 patent/US20060084371A1/en not_active Abandoned
- 2005-10-13 TW TW094135623A patent/TW200620527A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08107137A (ja) * | 1994-08-08 | 1996-04-23 | Tokyo Electron Ltd | 搬送装置、搬送方法、洗浄装置及び洗浄方法 |
JPH0917762A (ja) * | 1995-06-29 | 1997-01-17 | Tokyo Electron Ltd | 処理装置 |
JPH10173033A (ja) * | 1996-12-10 | 1998-06-26 | Sony Corp | ウェーハ保持機構 |
JP2000158337A (ja) * | 1998-11-27 | 2000-06-13 | Speedfam-Ipec Co Ltd | 端面研磨装置におけるウエハチャック機構 |
JP2000263405A (ja) * | 1999-03-17 | 2000-09-26 | Komatsu Electronic Metals Co Ltd | 半導体ウェハのノッチ面取り面研磨方法および研磨装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7559825B2 (en) | 2006-12-21 | 2009-07-14 | Memc Electronic Materials, Inc. | Method of polishing a semiconductor wafer |
KR101844965B1 (ko) * | 2017-09-11 | 2018-04-03 | 주식회사 기홍메가텍 | 원통형 부품 가공용 클램핑 장치 |
JP2019212671A (ja) * | 2018-05-31 | 2019-12-12 | 日東電工株式会社 | 粘着テープ剥離方法および粘着テープ剥離装置 |
JP7146457B2 (ja) | 2018-05-31 | 2022-10-04 | 日東電工株式会社 | 粘着テープ剥離方法および粘着テープ剥離装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4691667B2 (ja) | 2011-06-01 |
TW200620527A (en) | 2006-06-16 |
US20060084371A1 (en) | 2006-04-20 |
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