JP4691365B2 - 半導体装置用接着剤組成物および半導体装置用接着シート - Google Patents
半導体装置用接着剤組成物および半導体装置用接着シート Download PDFInfo
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- JP4691365B2 JP4691365B2 JP2005029858A JP2005029858A JP4691365B2 JP 4691365 B2 JP4691365 B2 JP 4691365B2 JP 2005029858 A JP2005029858 A JP 2005029858A JP 2005029858 A JP2005029858 A JP 2005029858A JP 4691365 B2 JP4691365 B2 JP 4691365B2
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- epoxy resin
- film
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| CNB2006100030271A CN100489048C (zh) | 2005-02-04 | 2006-01-26 | 半导体装置用粘接剂组合物及半导体装置用粘接片材 |
| TW095103025A TWI323275B (en) | 2005-02-04 | 2006-01-26 | Adhesive composition and adhesive sheet for semiconductor device |
| KR1020060009848A KR100727550B1 (ko) | 2005-02-04 | 2006-02-01 | 반도체 장치용 접착제 조성물 및 반도체 장치용 접착시트 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8008124B2 (en) | 2007-02-28 | 2011-08-30 | Sumitomo Bakelite Co., Ltd. | Adhesive film for semiconductor and semiconductor device using the adhesive film |
| JP4871204B2 (ja) * | 2007-05-08 | 2012-02-08 | 株式会社巴川製紙所 | 太陽電池用バックシート |
| JP5142603B2 (ja) * | 2007-06-27 | 2013-02-13 | 株式会社巴川製紙所 | 太陽電池用保護シート |
| JP2009091566A (ja) * | 2007-09-19 | 2009-04-30 | Toray Ind Inc | 接着剤組成物およびそれを用いた接着剤シート |
| JP5266696B2 (ja) * | 2007-09-19 | 2013-08-21 | 東レ株式会社 | 電子機器用接着剤組成物およびそれを用いた電子機器用接着剤シート |
| KR101471232B1 (ko) * | 2007-09-19 | 2014-12-09 | 도레이 카부시키가이샤 | 전자 부품용 접착제 조성물 및 이를 이용한 전자 부품용 접착제 시트 |
| KR100962936B1 (ko) * | 2007-12-20 | 2010-06-09 | 제일모직주식회사 | 반도체 조립용 접착 필름 조성물 및 접착 필름 |
| JP4806815B2 (ja) * | 2008-03-31 | 2011-11-02 | リンテック株式会社 | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
| JP2009242605A (ja) * | 2008-03-31 | 2009-10-22 | Lintec Corp | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
| JP4947316B2 (ja) * | 2008-08-15 | 2012-06-06 | 信越化学工業株式会社 | 基板の接合方法並びに３次元半導体装置 |
| JP4911143B2 (ja) * | 2008-08-15 | 2012-04-04 | 信越化学工業株式会社 | 高温耐性接着剤組成物、基板の接着方法、及び３次元半導体装置 |
| JP5368054B2 (ja) * | 2008-10-15 | 2013-12-18 | 日本メクトロン株式会社 | フレキシブル回路基板の製造方法及びフレキシブル回路基板 |
| JP5298913B2 (ja) * | 2009-02-12 | 2013-09-25 | 信越化学工業株式会社 | 接着剤組成物およびそれを用いた半導体ウエハ用保護シート |
| US8975161B2 (en) | 2010-07-13 | 2015-03-10 | Hitachi Chemical Company, Ltd. | Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing method |
| US8653190B2 (en) * | 2011-08-08 | 2014-02-18 | 3M Innovative Properties Company | Curable cyclic anhydride copolymer/silicone composition |
| CN102585744B (zh) * | 2012-02-21 | 2013-12-04 | 绵阳艾萨斯电子材料有限公司 | 粘合剂组合物及其制备方法与在丝网印刷中的应用 |
| CN105838303B (zh) * | 2016-03-31 | 2019-03-12 | 航天材料及工艺研究所 | 一种环氧树脂防水胶粘剂及制备方法 |
| JP6834758B2 (ja) * | 2017-05-02 | 2021-02-24 | 信越化学工業株式会社 | オルガノポリシロキサン変性オレフィン系共重合体の製造方法 |
| JP6526146B2 (ja) * | 2017-10-23 | 2019-06-05 | 藤森工業株式会社 | 接着性樹脂組成物、接着性樹脂成形体、及び接着性樹脂積層体 |
| KR102081078B1 (ko) * | 2018-07-02 | 2020-02-25 | 도레이첨단소재 주식회사 | 연성동박적층필름 및 이의 제조방법 |
| CN112080237B (zh) * | 2020-09-07 | 2022-05-31 | 江苏矽时代材料科技有限公司 | 一种环氧结构胶及其制备方法和应用 |
| CN112614804A (zh) * | 2020-11-30 | 2021-04-06 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | 加热吸盘组件以及芯片拼接装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000164607A (ja) * | 1998-11-24 | 2000-06-16 | Hitachi Chem Co Ltd | 電子部品用接着部材、電子部品用接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 |
| JP2001115127A (ja) * | 1999-10-19 | 2001-04-24 | Hitachi Chem Co Ltd | 導電性接着剤とそれを用いた配線板 |
| JP2001240838A (ja) * | 1999-12-21 | 2001-09-04 | Tomoegawa Paper Co Ltd | 半導体装置用接着剤組成物及び接着シート |
| JP2002241728A (ja) * | 2001-02-14 | 2002-08-28 | Tomoegawa Paper Co Ltd | 半導体装置用接着剤組成物および接着シート |
| JP2003206452A (ja) * | 2002-01-10 | 2003-07-22 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置 |
| JP2004018718A (ja) * | 2002-06-18 | 2004-01-22 | Mitsui Chemicals Inc | 半導体装置用接着剤組成物 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0619077B2 (ja) * | 1987-12-11 | 1994-03-16 | 住友ベークライト株式会社 | 導電性樹脂ペースト |
| JPH10176099A (ja) * | 1996-12-19 | 1998-06-30 | Toshiba Corp | エポキシ樹脂組成物、およびこれを用いた樹脂封止型半導体装置 |
-
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000164607A (ja) * | 1998-11-24 | 2000-06-16 | Hitachi Chem Co Ltd | 電子部品用接着部材、電子部品用接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 |
| JP2001115127A (ja) * | 1999-10-19 | 2001-04-24 | Hitachi Chem Co Ltd | 導電性接着剤とそれを用いた配線板 |
| JP2001240838A (ja) * | 1999-12-21 | 2001-09-04 | Tomoegawa Paper Co Ltd | 半導体装置用接着剤組成物及び接着シート |
| JP2002241728A (ja) * | 2001-02-14 | 2002-08-28 | Tomoegawa Paper Co Ltd | 半導体装置用接着剤組成物および接着シート |
| JP2003206452A (ja) * | 2002-01-10 | 2003-07-22 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置 |
| JP2004018718A (ja) * | 2002-06-18 | 2004-01-22 | Mitsui Chemicals Inc | 半導体装置用接着剤組成物 |
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| CN1821337A (zh) | 2006-08-23 |
| JP2006213872A (ja) | 2006-08-17 |
| CN100489048C (zh) | 2009-05-20 |
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