JP4686300B2 - デバイス支持構造体及びこれの製造方法 - Google Patents

デバイス支持構造体及びこれの製造方法 Download PDF

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Publication number
JP4686300B2
JP4686300B2 JP2005238111A JP2005238111A JP4686300B2 JP 4686300 B2 JP4686300 B2 JP 4686300B2 JP 2005238111 A JP2005238111 A JP 2005238111A JP 2005238111 A JP2005238111 A JP 2005238111A JP 4686300 B2 JP4686300 B2 JP 4686300B2
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JP
Japan
Prior art keywords
lead
free solder
support
connector
compressible film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005238111A
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English (en)
Japanese (ja)
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JP2006059814A (ja
JP2006059814A5 (https=
Inventor
ウィリアム・イー・ベルニエ
ティエン・イェン・チェン
マリー・エス・コール
デビッド・イー・アイヒシュタット
ムクタ・ジー・ファルーク
ジョン・エイ・フィッツシモンズ
ルイス・エス・ゴールドマン
ジョン・ユー・ニッカーボッカー
ターシャ・イー・ロペス
デビッド・ジェイ・ウェルシュ
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International Business Machines Corp
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International Business Machines Corp
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Publication of JP2006059814A5 publication Critical patent/JP2006059814A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07234—Using a reflow oven
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/245—Dispositions, e.g. layouts of outermost layers of multilayered bumps, e.g. bump coating being only on a part of a bump core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/283—Reinforcing structures, e.g. bump collars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
JP2005238111A 2004-08-20 2005-08-19 デバイス支持構造体及びこれの製造方法 Expired - Fee Related JP4686300B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/711,076 US7332821B2 (en) 2004-08-20 2004-08-20 Compressible films surrounding solder connectors
US10/711076 2004-08-20

Publications (3)

Publication Number Publication Date
JP2006059814A JP2006059814A (ja) 2006-03-02
JP2006059814A5 JP2006059814A5 (https=) 2008-07-10
JP4686300B2 true JP4686300B2 (ja) 2011-05-25

Family

ID=35910206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005238111A Expired - Fee Related JP4686300B2 (ja) 2004-08-20 2005-08-19 デバイス支持構造体及びこれの製造方法

Country Status (4)

Country Link
US (2) US7332821B2 (https=)
JP (1) JP4686300B2 (https=)
CN (1) CN100399560C (https=)
TW (1) TWI346518B (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7906364B2 (en) * 2004-11-29 2011-03-15 N-Trig Ltd. Methods for manufacturing a sensor assembly
US20070063344A1 (en) * 2005-09-22 2007-03-22 Chun-Hung Lin Chip package structure and bumping process
WO2007114111A1 (ja) * 2006-03-28 2007-10-11 Matsushita Electric Industrial Co., Ltd. 多層配線基板とその製造方法
US7727805B2 (en) * 2007-06-11 2010-06-01 Intel Corporation Reducing stress in a flip chip assembly
US20090108442A1 (en) * 2007-10-25 2009-04-30 International Business Machines Corporation Self-assembled stress relief interface
US8507325B2 (en) * 2010-01-28 2013-08-13 International Business Machines Corporation Co-axial restraint for connectors within flip-chip packages
FR2957748B1 (fr) * 2010-03-16 2012-09-07 St Microelectronics Grenoble 2 Composant electronique a montage en surface
US9082780B2 (en) * 2012-03-23 2015-07-14 Stats Chippac, Ltd. Semiconductor device and method of forming a robust fan-out package including vertical interconnects and mechanical support layer
US20140291834A1 (en) * 2013-03-27 2014-10-02 Micron Technology, Inc. Semiconductor devices and packages including conductive underfill material and related methods
US9711474B2 (en) * 2014-09-24 2017-07-18 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor package structure with polymeric layer and manufacturing method thereof
SG11201703125WA (en) * 2014-10-23 2017-05-30 Agency Science Tech & Res Method of bonding a first substrate and a second substrate
KR102458034B1 (ko) 2015-10-16 2022-10-25 삼성전자주식회사 반도체 패키지, 반도체 패키지의 제조방법, 및 반도체 모듈
US10597486B2 (en) 2016-11-02 2020-03-24 Seagate Technology Llc Encapsulant composition for use with electrical components in hard disk drives, and related electrical components and hard disk drives
US10163847B2 (en) * 2017-03-03 2018-12-25 Tdk Corporation Method for producing semiconductor package
CN108538726B (zh) * 2017-03-03 2022-08-26 Tdk株式会社 半导体芯片的制造方法
US12520425B2 (en) 2020-04-30 2026-01-06 Dujud Llc Three-dimensional circuits with flexible interconnects
EP4144192B1 (en) * 2020-04-30 2026-04-08 Dujud LLC Methods and processes for forming electrical circuitries on three-dimensional geometries

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5274913A (en) * 1991-10-25 1994-01-04 International Business Machines Corporation Method of fabricating a reworkable module
US5956605A (en) * 1996-09-20 1999-09-21 Micron Technology, Inc. Use of nitrides for flip-chip encapsulation
JPH10178121A (ja) * 1996-12-18 1998-06-30 Toshiba Corp 半導体パッケージ用金属ボール配設板、半導体装置及びその製造方法
JP2001510944A (ja) * 1997-07-21 2001-08-07 アギラ テクノロジーズ インコーポレイテッド 半導体フリップチップ・パッケージおよびその製造方法
JP3876953B2 (ja) * 1998-03-27 2007-02-07 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
US6100114A (en) * 1998-08-10 2000-08-08 International Business Machines Corporation Encapsulation of solder bumps and solder connections
US6281452B1 (en) * 1998-12-03 2001-08-28 International Business Machines Corporation Multi-level thin-film electronic packaging structure and related method
US6225206B1 (en) * 1999-05-10 2001-05-01 International Business Machines Corporation Flip chip C4 extension structure and process
JP2001007502A (ja) * 1999-06-23 2001-01-12 Sony Corp 電子部品パッケージの接続構造及び接続方法
JP2001127108A (ja) 1999-10-25 2001-05-11 Hitachi Ltd 半導体装置
US6700209B1 (en) * 1999-12-29 2004-03-02 Intel Corporation Partial underfill for flip-chip electronic packages
JP2001339012A (ja) * 2000-05-30 2001-12-07 Nec Kyushu Ltd 半導体装置およびその製造方法
US6680436B2 (en) * 2000-07-12 2004-01-20 Seagate Technology Llc Reflow encapsulant
US6573122B2 (en) * 2001-03-28 2003-06-03 International Rectifier Corporation Wafer level insulation underfill for die attach
JP2001313315A (ja) * 2001-04-25 2001-11-09 Hitachi Ltd 実装用半導体装置とその実装方法
US20020180029A1 (en) * 2001-04-25 2002-12-05 Hideki Higashitani Semiconductor device with intermediate connector
TW544826B (en) * 2001-05-18 2003-08-01 Nec Electronics Corp Flip-chip-type semiconductor device and manufacturing method thereof
JP3708478B2 (ja) * 2001-11-20 2005-10-19 松下電器産業株式会社 電子部品の実装方法
JP2003234362A (ja) * 2002-02-12 2003-08-22 Yokogawa Electric Corp 半導体装置
TW540123B (en) * 2002-06-14 2003-07-01 Siliconware Precision Industries Co Ltd Flip-chip semiconductor package with lead frame as chip carrier
JP2004103928A (ja) * 2002-09-11 2004-04-02 Fujitsu Ltd 基板及びハンダボールの形成方法及びその実装構造
US6921860B2 (en) * 2003-03-18 2005-07-26 Micron Technology, Inc. Microelectronic component assemblies having exposed contacts

Also Published As

Publication number Publication date
US7566649B2 (en) 2009-07-28
CN100399560C (zh) 2008-07-02
TWI346518B (en) 2011-08-01
JP2006059814A (ja) 2006-03-02
US20060040567A1 (en) 2006-02-23
US7332821B2 (en) 2008-02-19
US20080009101A1 (en) 2008-01-10
TW200618685A (en) 2006-06-01
CN1738042A (zh) 2006-02-22

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