JP4680030B2 - 減圧処理装置 - Google Patents

減圧処理装置 Download PDF

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Publication number
JP4680030B2
JP4680030B2 JP2005315534A JP2005315534A JP4680030B2 JP 4680030 B2 JP4680030 B2 JP 4680030B2 JP 2005315534 A JP2005315534 A JP 2005315534A JP 2005315534 A JP2005315534 A JP 2005315534A JP 4680030 B2 JP4680030 B2 JP 4680030B2
Authority
JP
Japan
Prior art keywords
box
main body
shaped main
decompression processing
exhaust pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2005315534A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007123645A (ja
Inventor
真治 高瀬
淳生 楫間
芳明 升
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2005315534A priority Critical patent/JP4680030B2/ja
Priority to TW095135829A priority patent/TW200729386A/zh
Priority to KR1020060104940A priority patent/KR100812009B1/ko
Priority to CNA2006101498490A priority patent/CN1958172A/zh
Publication of JP2007123645A publication Critical patent/JP2007123645A/ja
Application granted granted Critical
Publication of JP4680030B2 publication Critical patent/JP4680030B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Drying Of Solid Materials (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2005315534A 2005-10-31 2005-10-31 減圧処理装置 Active JP4680030B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005315534A JP4680030B2 (ja) 2005-10-31 2005-10-31 減圧処理装置
TW095135829A TW200729386A (en) 2005-10-31 2006-09-27 Pressure-reduced treatment apparatus
KR1020060104940A KR100812009B1 (ko) 2005-10-31 2006-10-27 감압처리장치
CNA2006101498490A CN1958172A (zh) 2005-10-31 2006-10-27 减压处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005315534A JP4680030B2 (ja) 2005-10-31 2005-10-31 減圧処理装置

Publications (2)

Publication Number Publication Date
JP2007123645A JP2007123645A (ja) 2007-05-17
JP4680030B2 true JP4680030B2 (ja) 2011-05-11

Family

ID=38070113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005315534A Active JP4680030B2 (ja) 2005-10-31 2005-10-31 減圧処理装置

Country Status (4)

Country Link
JP (1) JP4680030B2 (zh)
KR (1) KR100812009B1 (zh)
CN (1) CN1958172A (zh)
TW (1) TW200729386A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009266932A (ja) * 2008-04-23 2009-11-12 Dainippon Printing Co Ltd レジスト膜乾燥システム
CN109445251B (zh) * 2018-11-15 2020-06-30 武汉华星光电半导体显示技术有限公司 一种减压干燥设备
JP7378357B2 (ja) * 2020-06-17 2023-11-13 東京エレクトロン株式会社 基板処理装置およびガス供給配管のパージ方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267236A (ja) * 2000-03-22 2001-09-28 Tokyo Electron Ltd 処理装置および処理方法
JP2001345251A (ja) * 2000-06-01 2001-12-14 Tokyo Electron Ltd 薄膜形成装置および薄膜除去装置
JP2002313709A (ja) * 2001-04-17 2002-10-25 Tokyo Electron Ltd 基板の処理装置及び搬送アーム
JP2005142372A (ja) * 2003-11-06 2005-06-02 Tokyo Electron Ltd 基板処理装置及び基板処理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3776977B2 (ja) 1996-06-14 2006-05-24 大日本印刷株式会社 真空乾燥装置
JPH11253894A (ja) 1998-03-16 1999-09-21 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000056475A (ja) 1998-08-05 2000-02-25 Tokyo Electron Ltd 基板処理装置および基板処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267236A (ja) * 2000-03-22 2001-09-28 Tokyo Electron Ltd 処理装置および処理方法
JP2001345251A (ja) * 2000-06-01 2001-12-14 Tokyo Electron Ltd 薄膜形成装置および薄膜除去装置
JP2002313709A (ja) * 2001-04-17 2002-10-25 Tokyo Electron Ltd 基板の処理装置及び搬送アーム
JP2005142372A (ja) * 2003-11-06 2005-06-02 Tokyo Electron Ltd 基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
KR20070046726A (ko) 2007-05-03
CN1958172A (zh) 2007-05-09
KR100812009B1 (ko) 2008-03-10
TWI324808B (zh) 2010-05-11
JP2007123645A (ja) 2007-05-17
TW200729386A (en) 2007-08-01

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