KR100812009B1 - 감압처리장치 - Google Patents
감압처리장치 Download PDFInfo
- Publication number
- KR100812009B1 KR100812009B1 KR1020060104940A KR20060104940A KR100812009B1 KR 100812009 B1 KR100812009 B1 KR 100812009B1 KR 1020060104940 A KR1020060104940 A KR 1020060104940A KR 20060104940 A KR20060104940 A KR 20060104940A KR 100812009 B1 KR100812009 B1 KR 100812009B1
- Authority
- KR
- South Korea
- Prior art keywords
- box
- main body
- pressure reduction
- exhaust pipe
- shaped main
- Prior art date
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- General Engineering & Computer Science (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
- Drying Of Solid Materials (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (3)
- 내부를 감압처리 공간으로 하는 박스형상 본체와, 상기 박스형상 본체의 축선과 평행하게 좌우로 이간하여 배설된 2개의 메인 배기관과, 상기 메인 배기관으로부터 분기되어 상기 박스형상 본체를 따라 뻗는 서브 배기관과, 상기 서브 배기관의 앞쪽 끝에 설치된 흡인부를 구비한 감압처리장치로서,상기 흡인부는 상기 축선을 기준으로 하여 좌우대칭 위치에 배치되어 있고, 상기 박스형상 본체의 천정부에는 대기 개방용 포트가 설치되며, 상기 흡인부에는 가스 퍼지용 포트가 설치되어 있는 것을 특징으로 하는 감압처리장치.
- 삭제
- 제1항의 감압처리장치에 있어서, 상기 박스형상 본체는 상하방향으로 복수단 겹쳐서 배치되고, 각 박스형상 본체의 측면에는 피처리 기판을 출납하는 창부가 형성되며, 상기 창부는 셔터로 개폐되는 것을 특징으로 하는 감압처리장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005315534A JP4680030B2 (ja) | 2005-10-31 | 2005-10-31 | 減圧処理装置 |
JPJP-P-2005-00315534 | 2005-10-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070046726A KR20070046726A (ko) | 2007-05-03 |
KR100812009B1 true KR100812009B1 (ko) | 2008-03-10 |
Family
ID=38070113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060104940A KR100812009B1 (ko) | 2005-10-31 | 2006-10-27 | 감압처리장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4680030B2 (ko) |
KR (1) | KR100812009B1 (ko) |
CN (1) | CN1958172A (ko) |
TW (1) | TW200729386A (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009266932A (ja) * | 2008-04-23 | 2009-11-12 | Dainippon Printing Co Ltd | レジスト膜乾燥システム |
CN109445251B (zh) * | 2018-11-15 | 2020-06-30 | 武汉华星光电半导体显示技术有限公司 | 一种减压干燥设备 |
JP7378357B2 (ja) * | 2020-06-17 | 2023-11-13 | 東京エレクトロン株式会社 | 基板処理装置およびガス供給配管のパージ方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH102665A (ja) | 1996-06-14 | 1998-01-06 | Dainippon Printing Co Ltd | 真空乾燥装置 |
JPH11253894A (ja) | 1998-03-16 | 1999-09-21 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2000056475A (ja) | 1998-08-05 | 2000-02-25 | Tokyo Electron Ltd | 基板処理装置および基板処理方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3581292B2 (ja) * | 2000-03-22 | 2004-10-27 | 東京エレクトロン株式会社 | 処理装置および処理方法 |
JP2001345251A (ja) * | 2000-06-01 | 2001-12-14 | Tokyo Electron Ltd | 薄膜形成装置および薄膜除去装置 |
JP4025030B2 (ja) * | 2001-04-17 | 2007-12-19 | 東京エレクトロン株式会社 | 基板の処理装置及び搬送アーム |
JP2005142372A (ja) * | 2003-11-06 | 2005-06-02 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
-
2005
- 2005-10-31 JP JP2005315534A patent/JP4680030B2/ja active Active
-
2006
- 2006-09-27 TW TW095135829A patent/TW200729386A/zh unknown
- 2006-10-27 CN CNA2006101498490A patent/CN1958172A/zh active Pending
- 2006-10-27 KR KR1020060104940A patent/KR100812009B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH102665A (ja) | 1996-06-14 | 1998-01-06 | Dainippon Printing Co Ltd | 真空乾燥装置 |
JPH11253894A (ja) | 1998-03-16 | 1999-09-21 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2000056475A (ja) | 1998-08-05 | 2000-02-25 | Tokyo Electron Ltd | 基板処理装置および基板処理方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20070046726A (ko) | 2007-05-03 |
CN1958172A (zh) | 2007-05-09 |
TWI324808B (ko) | 2010-05-11 |
JP4680030B2 (ja) | 2011-05-11 |
JP2007123645A (ja) | 2007-05-17 |
TW200729386A (en) | 2007-08-01 |
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