TW200729386A - Pressure-reduced treatment apparatus - Google Patents

Pressure-reduced treatment apparatus

Info

Publication number
TW200729386A
TW200729386A TW095135829A TW95135829A TW200729386A TW 200729386 A TW200729386 A TW 200729386A TW 095135829 A TW095135829 A TW 095135829A TW 95135829 A TW95135829 A TW 95135829A TW 200729386 A TW200729386 A TW 200729386A
Authority
TW
Taiwan
Prior art keywords
suction parts
treatment apparatus
box
main body
exhaust pipes
Prior art date
Application number
TW095135829A
Other languages
English (en)
Other versions
TWI324808B (zh
Inventor
Atsuo Kajima
Shinji Takase
Yoshiaki Masu
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200729386A publication Critical patent/TW200729386A/zh
Application granted granted Critical
Publication of TWI324808B publication Critical patent/TWI324808B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Solid Materials (AREA)
  • Chemical Vapour Deposition (AREA)
TW095135829A 2005-10-31 2006-09-27 Pressure-reduced treatment apparatus TW200729386A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005315534A JP4680030B2 (ja) 2005-10-31 2005-10-31 減圧処理装置

Publications (2)

Publication Number Publication Date
TW200729386A true TW200729386A (en) 2007-08-01
TWI324808B TWI324808B (zh) 2010-05-11

Family

ID=38070113

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095135829A TW200729386A (en) 2005-10-31 2006-09-27 Pressure-reduced treatment apparatus

Country Status (4)

Country Link
JP (1) JP4680030B2 (zh)
KR (1) KR100812009B1 (zh)
CN (1) CN1958172A (zh)
TW (1) TW200729386A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009266932A (ja) * 2008-04-23 2009-11-12 Dainippon Printing Co Ltd レジスト膜乾燥システム
CN109445251B (zh) * 2018-11-15 2020-06-30 武汉华星光电半导体显示技术有限公司 一种减压干燥设备
JP7378357B2 (ja) 2020-06-17 2023-11-13 東京エレクトロン株式会社 基板処理装置およびガス供給配管のパージ方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3776977B2 (ja) 1996-06-14 2006-05-24 大日本印刷株式会社 真空乾燥装置
JPH11253894A (ja) 1998-03-16 1999-09-21 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000056475A (ja) 1998-08-05 2000-02-25 Tokyo Electron Ltd 基板処理装置および基板処理方法
JP3581292B2 (ja) * 2000-03-22 2004-10-27 東京エレクトロン株式会社 処理装置および処理方法
JP2001345251A (ja) * 2000-06-01 2001-12-14 Tokyo Electron Ltd 薄膜形成装置および薄膜除去装置
JP4025030B2 (ja) * 2001-04-17 2007-12-19 東京エレクトロン株式会社 基板の処理装置及び搬送アーム
JP2005142372A (ja) * 2003-11-06 2005-06-02 Tokyo Electron Ltd 基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
KR20070046726A (ko) 2007-05-03
CN1958172A (zh) 2007-05-09
JP4680030B2 (ja) 2011-05-11
TWI324808B (zh) 2010-05-11
JP2007123645A (ja) 2007-05-17
KR100812009B1 (ko) 2008-03-10

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