SG165221A1 - Substrate treating apparatus and method - Google Patents

Substrate treating apparatus and method

Info

Publication number
SG165221A1
SG165221A1 SG200906904-8A SG2009069048A SG165221A1 SG 165221 A1 SG165221 A1 SG 165221A1 SG 2009069048 A SG2009069048 A SG 2009069048A SG 165221 A1 SG165221 A1 SG 165221A1
Authority
SG
Singapore
Prior art keywords
pressure
substrate
vacuum
treating apparatus
maintained
Prior art date
Application number
SG200906904-8A
Inventor
Park Dong-Seok
Original Assignee
Psk Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Psk Inc filed Critical Psk Inc
Publication of SG165221A1 publication Critical patent/SG165221A1/en

Links

Abstract

Provided are a substrate treating apparatus and method, which vacuum-absorb a substrate. An inner space of a housing is maintained at a second pressure by a pipe maintained at a first pressure. The interior of a vacuum hole of a vacuum chuck is maintained at a third pressure. A substrate is vacuum-absorbed by a difference between the third pressure and the second pressure. A gas is supplied into a first line connected to the vacuum hole, or the first line communicates with the inner space of the housing to maintain the difference between the third pressure and the second pressure within a previously set range, thereby to unload the substrate. Therefore, the absorption between the substrate and the vacuum chuck can be increased, and also, a process speed can be improved. Fig.1
SG200906904-8A 2009-03-31 2009-10-14 Substrate treating apparatus and method SG165221A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090027371A KR101057118B1 (en) 2009-03-31 2009-03-31 Substrate Processing Apparatus and Method

Publications (1)

Publication Number Publication Date
SG165221A1 true SG165221A1 (en) 2010-10-28

Family

ID=43130190

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200906904-8A SG165221A1 (en) 2009-03-31 2009-10-14 Substrate treating apparatus and method

Country Status (3)

Country Link
KR (1) KR101057118B1 (en)
SG (1) SG165221A1 (en)
TW (1) TWI395288B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102232691B1 (en) * 2013-06-26 2021-03-29 삼성디스플레이 주식회사 Substrate processing apparatus, deposition apparatus comprising the same, processing method of substrate, and deposition method
KR102308929B1 (en) * 2016-04-08 2021-10-05 어플라이드 머티어리얼스, 인코포레이티드 vacuum chuck pressure control system
KR102004421B1 (en) * 2017-06-13 2019-07-29 삼성디스플레이 주식회사 Apparatus for processing substrate
KR102454462B1 (en) * 2017-11-09 2022-10-14 주식회사 미코세라믹스 Chuck plate, chuck structure having the chuck plate, and bonding apparatus having the chuck structure
KR102041044B1 (en) * 2018-04-30 2019-11-05 피에스케이홀딩스 주식회사 Unit for Supporting Substrate
KR102099105B1 (en) 2018-07-18 2020-05-15 세메스 주식회사 Method for treating a substrate and an apparatus for treating a substrate
CN113437000B (en) * 2021-05-26 2023-11-21 鄂尔多斯市骁龙半导体有限公司 Wafer bearing disc with high safety performance

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6896929B2 (en) * 2001-08-03 2005-05-24 Applied Materials, Inc. Susceptor shaft vacuum pumping
US20070076345A1 (en) * 2005-09-20 2007-04-05 Bang Won B Substrate placement determination using substrate backside pressure measurement

Also Published As

Publication number Publication date
KR20100109009A (en) 2010-10-08
KR101057118B1 (en) 2011-08-16
TWI395288B (en) 2013-05-01
TW201036099A (en) 2010-10-01

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