JP4678142B2 - 高透明性を有するポリ（アミド酸−イミド）共重合体の感光性樹脂組成物およびその硬化膜 - Google Patents

高透明性を有するポリ（アミド酸−イミド）共重合体の感光性樹脂組成物およびその硬化膜 Download PDF

Info

Publication number
JP4678142B2
JP4678142B2 JP2004154344A JP2004154344A JP4678142B2 JP 4678142 B2 JP4678142 B2 JP 4678142B2 JP 2004154344 A JP2004154344 A JP 2004154344A JP 2004154344 A JP2004154344 A JP 2004154344A JP 4678142 B2 JP4678142 B2 JP 4678142B2
Authority
JP
Japan
Prior art keywords
imide
poly
film
copolymer
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004154344A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005336243A5 (https=
JP2005336243A (ja
Inventor
匡俊 長谷川
雅一 加藤
貴康 仁平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Priority to JP2004154344A priority Critical patent/JP4678142B2/ja
Publication of JP2005336243A publication Critical patent/JP2005336243A/ja
Publication of JP2005336243A5 publication Critical patent/JP2005336243A5/ja
Application granted granted Critical
Publication of JP4678142B2 publication Critical patent/JP4678142B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2004154344A 2004-05-25 2004-05-25 高透明性を有するポリ（アミド酸−イミド）共重合体の感光性樹脂組成物およびその硬化膜 Expired - Lifetime JP4678142B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004154344A JP4678142B2 (ja) 2004-05-25 2004-05-25 高透明性を有するポリ（アミド酸−イミド）共重合体の感光性樹脂組成物およびその硬化膜

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004154344A JP4678142B2 (ja) 2004-05-25 2004-05-25 高透明性を有するポリ（アミド酸−イミド）共重合体の感光性樹脂組成物およびその硬化膜

Publications (3)

Publication Number Publication Date
JP2005336243A JP2005336243A (ja) 2005-12-08
JP2005336243A5 JP2005336243A5 (https=) 2007-07-05
JP4678142B2 true JP4678142B2 (ja) 2011-04-27

Family

ID=35490159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004154344A Expired - Lifetime JP4678142B2 (ja) 2004-05-25 2004-05-25 高透明性を有するポリ（アミド酸−イミド）共重合体の感光性樹脂組成物およびその硬化膜

Country Status (1)

Country Link
JP (1) JP4678142B2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9557446B2 (en) 2015-06-25 2017-01-31 Samsung Sdi Co., Ltd. Black photosensitive resin composition, photosensitive resin layer, and display device comprising the same
US10146129B2 (en) 2016-11-25 2018-12-04 Samsung Sdi Co., Ltd. Photosensitive resin composition, black pixel defining layer using the same and display device

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4788108B2 (ja) * 2004-05-25 2011-10-05 日産化学工業株式会社 低誘電率、低線熱膨張係数、高透明性、高ガラス転移温度を併せ持つポリイミドとその前駆体
JP5263464B2 (ja) * 2006-05-23 2013-08-14 日産化学工業株式会社 脂環式ポリイミド前駆体、ポジ型感光性樹脂組成物およびその硬化膜
US9267004B2 (en) 2008-07-22 2016-02-23 Kaneka Corporation Polyimide precursor composition and use thereof
CN104540883B (zh) * 2012-06-25 2017-07-04 可隆工业株式会社 聚酰胺‑酰亚胺共聚膜以及制备聚酰胺‑酰亚胺共聚物的方法
CN105492496B (zh) * 2013-06-27 2017-09-22 宇部兴产株式会社 聚酰亚胺前体和聚酰亚胺
KR101812580B1 (ko) * 2013-12-05 2017-12-27 제일모직 주식회사 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 이를 이용한 표시 소자
KR101980506B1 (ko) 2014-02-14 2019-05-20 아사히 가세이 가부시키가이샤 폴리이미드 전구체 및 그것을 함유하는 수지 조성물
TWI682969B (zh) 2014-10-23 2020-01-21 日商宇部興產股份有限公司 聚醯亞胺膜、聚醯亞胺前驅體及聚醯亞胺
CN107108886B (zh) 2014-10-23 2021-03-30 宇部兴产株式会社 聚酰亚胺前体、聚酰亚胺和聚酰亚胺膜
KR101809650B1 (ko) 2015-10-02 2017-12-15 주식회사 엘지화학 광배향막의 제조 방법
WO2018088543A1 (ja) 2016-11-11 2018-05-17 宇部興産株式会社 ポリイミドフィルムとハードコート層とを含む積層体
TWI772555B (zh) * 2018-11-14 2022-08-01 達邁科技股份有限公司 聚醯亞胺膜之製造方法
CN114174468B (zh) * 2019-09-19 2024-11-19 日产化学株式会社 液晶取向剂、液晶取向膜以及液晶显示元件
US20230242721A1 (en) 2020-07-02 2023-08-03 Sumitomo Chemical Company, Limited Optical Film
US20230272165A1 (en) 2020-07-02 2023-08-31 Sumitomo Chemical Company, Limited Optical Film
CN112062958B (zh) * 2020-08-20 2023-04-07 长春高琦聚酰亚胺材料有限公司 一种聚酰亚胺材料及其制备方法
WO2023286955A1 (ko) * 2021-07-14 2023-01-19 코오롱인더스트리 주식회사 선명도가 우수한 광학 필름 및 이를 포함하는 표시장치
CN115433358A (zh) * 2021-07-16 2022-12-06 山东圣泉新材料股份有限公司 聚酰胺-b-酰胺酸聚合物、正性光敏性组合物及其应用
TWI870812B (zh) * 2022-05-23 2025-01-21 日商旭化成股份有限公司 感光性樹脂組合物、以及使用其之聚醯亞胺硬化膜之製造方法及聚醯亞胺硬化膜
WO2025163837A1 (ja) * 2024-01-31 2025-08-07 株式会社レゾナック アンテナ用基板材料及びその製造方法
NL2038124B1 (en) * 2024-07-02 2026-01-16 Fujifilm Electronic Mat Europe N V Photosensitive polyimide precursor composition, cured film, laminate, method for producing cured film and semiconductor device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0755928B2 (ja) * 1985-11-06 1995-06-14 三井東圧化学株式会社 イミド環含有ジアミン類およびその製造方法
JPH0413724A (ja) * 1990-05-02 1992-01-17 Chisso Corp 可溶性ポリイミド、その製造法及び液晶配向膜用塗布液
JP3612832B2 (ja) * 1995-12-28 2005-01-19 Ｊｓｒ株式会社 イミド基含有ポリアミック酸の製造方法並びに液晶配向剤
JPH1160732A (ja) * 1997-08-27 1999-03-05 Hitachi Chem Co Ltd ポリイミド系樹脂及びこれを用いた光学用素子
JP2001215695A (ja) * 2000-02-02 2001-08-10 Toshiba Chem Corp 感光性樹脂組成物およびその製造方法
JP2001343747A (ja) * 2000-03-30 2001-12-14 Nissan Chem Ind Ltd ポジ型感光性ポリイミド樹脂組成物
JP3934335B2 (ja) * 2000-11-30 2007-06-20 セントラル硝子株式会社 ポリイミドおよびその製造方法
EP1431822A4 (en) * 2001-09-26 2005-01-05 Nissan Chemical Ind Ltd POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9557446B2 (en) 2015-06-25 2017-01-31 Samsung Sdi Co., Ltd. Black photosensitive resin composition, photosensitive resin layer, and display device comprising the same
US10146129B2 (en) 2016-11-25 2018-12-04 Samsung Sdi Co., Ltd. Photosensitive resin composition, black pixel defining layer using the same and display device

Also Published As

Publication number Publication date
JP2005336243A (ja) 2005-12-08

Similar Documents

Publication Publication Date Title
JP4678142B2 (ja) 高透明性を有するポリ（アミド酸−イミド）共重合体の感光性樹脂組成物およびその硬化膜
JP5593548B2 (ja) ポリイミド系重合体とこれらの共重合体、並びにこれを含むポジ型感光性樹脂組成物
TWI491987B (zh) A negative photosensitive resin composition, a hardened embossed pattern, and a semiconductor device
CN101014643B (zh) 聚酰亚胺化合物和挠性电路板
TWI720018B (zh) 樹脂及感光性樹脂組成物、以及樹脂之製造方法
JP4969751B2 (ja) イミド−ベンゾオキサゾール系重縮合物及びその製造方法
JP4815690B2 (ja) ポリイミド、ポリイミド前駆体及びこれらの製造方法
JPWO2018087990A1 (ja) ジアミン化合物、それを用いた耐熱性樹脂および樹脂組成物
JP4639697B2 (ja) イミド基含有ジアミン、該イミド基含有ポリイミド前駆体、該前駆体を含有してなるポジ型感光性樹脂組成物、ポジ型パターンの製造方法及び電子部品
JP2007169585A (ja) 低線熱膨張係数を有するポリエステルイミドおよびその前駆体、ならびにこれらの製造方法
JP4663720B2 (ja) ポジ型感光性樹脂組成物およびパターン形成方法
JP4788108B2 (ja) 低誘電率、低線熱膨張係数、高透明性、高ガラス転移温度を併せ持つポリイミドとその前駆体
JP4858678B2 (ja) エステル基含有ポリ（イミド−アゾメチン）共重合体、エステル基含有ポリ（アミド酸−アゾメチン）共重合体及びポジ型感光性樹脂組成物
JP2010134116A (ja) ポジ型感光性樹脂組成物
TWI426093B (zh) 聚亞醯胺系聚合物、共聚物及包含該聚合物之正型光阻劑
JP2008280261A (ja) ヒドロキシアミド基を有するポリイミド、その前駆体、これらを用いた感光性樹脂組成物、およびこれらの硬化物
JP4811553B2 (ja) ポリ（イミド−アゾメチン）共重合体、ポリ（アミド酸−アゾメチン）共重合体及びポジ型感光性樹脂組成物
JP6240471B2 (ja) 反応現像画像形成法
JP4998679B2 (ja) ポリイミド前駆体共重合体、それを含むワニスおよびポジ型感光性樹脂組成物、ポリイミド共重合体、それを含む半導体素子の保護膜、ポリイミド共重合体含有膜の微細パターンの製造方法
JP2006071783A (ja) 感光性樹脂組成物及びそれを用いた微細パターンの製造方法
JP5263464B2 (ja) 脂環式ポリイミド前駆体、ポジ型感光性樹脂組成物およびその硬化膜
US7635551B2 (en) Poly (imide-azomethine) copolymer, poly (amic acid-azomethine) copolymer, and positive photosensitive resin composition
WO2022175169A1 (en) Polyimides having low dielectric loss
JP5053650B2 (ja) ポリイミド共重合体、ポジ型感光性樹脂組成物、およびパターン形成方法
EP4294855A1 (en) Polyimides having low dielectric loss

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070521

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070521

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20091028

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20091104

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091229

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20091229

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100210

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100210

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20100601

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100827

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20100913

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110105

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110118

R151 Written notification of patent or utility model registration

Ref document number: 4678142

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140210

Year of fee payment: 3

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

EXPY Cancellation because of completion of term