JP4676671B2 - 熱伝導性シリコーンエラストマー組成物 - Google Patents

熱伝導性シリコーンエラストマー組成物 Download PDF

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Publication number
JP4676671B2
JP4676671B2 JP2002337566A JP2002337566A JP4676671B2 JP 4676671 B2 JP4676671 B2 JP 4676671B2 JP 2002337566 A JP2002337566 A JP 2002337566A JP 2002337566 A JP2002337566 A JP 2002337566A JP 4676671 B2 JP4676671 B2 JP 4676671B2
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JP
Japan
Prior art keywords
group
component
thermally conductive
composition
weight
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2002337566A
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English (en)
Japanese (ja)
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JP2004168920A (ja
Inventor
裕規 石川
和己 中吉
涼登 島
勝利 峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to JP2002337566A priority Critical patent/JP4676671B2/ja
Priority to AU2003260954A priority patent/AU2003260954A1/en
Priority to PCT/JP2003/011457 priority patent/WO2004046233A1/en
Priority to TW092128292A priority patent/TW200416258A/zh
Publication of JP2004168920A publication Critical patent/JP2004168920A/ja
Application granted granted Critical
Publication of JP4676671B2 publication Critical patent/JP4676671B2/ja
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2002337566A 2002-11-21 2002-11-21 熱伝導性シリコーンエラストマー組成物 Expired - Fee Related JP4676671B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002337566A JP4676671B2 (ja) 2002-11-21 2002-11-21 熱伝導性シリコーンエラストマー組成物
AU2003260954A AU2003260954A1 (en) 2002-11-21 2003-09-08 Thermally-conductive silicone elastomer composition
PCT/JP2003/011457 WO2004046233A1 (en) 2002-11-21 2003-09-08 Thermally-conductive silicone elastomer composition
TW092128292A TW200416258A (en) 2002-11-21 2003-10-13 Thermally-conductive silicone elastomer composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002337566A JP4676671B2 (ja) 2002-11-21 2002-11-21 熱伝導性シリコーンエラストマー組成物

Publications (2)

Publication Number Publication Date
JP2004168920A JP2004168920A (ja) 2004-06-17
JP4676671B2 true JP4676671B2 (ja) 2011-04-27

Family

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Family Applications (1)

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JP2002337566A Expired - Fee Related JP4676671B2 (ja) 2002-11-21 2002-11-21 熱伝導性シリコーンエラストマー組成物

Country Status (4)

Country Link
JP (1) JP4676671B2 (zh)
AU (1) AU2003260954A1 (zh)
TW (1) TW200416258A (zh)
WO (1) WO2004046233A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023160907A1 (en) * 2022-02-22 2023-08-31 Wacker Chemie Ag Thermally conductive silicone composition and method for producing thermally conductive cured product using the composition

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8317861B2 (en) 2001-04-11 2012-11-27 Helix Medical, Llc Antimicrobial indwelling voice prosthesis
US7393547B2 (en) 2001-04-11 2008-07-01 Helix Medical, Llc Antimicrobial elastomer composition and method for making
US7520897B2 (en) 2001-04-11 2009-04-21 Helix Medical, Llc Medical devices having antimicrobial properties
JP4803365B2 (ja) * 2006-02-22 2011-10-26 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性シリコーン成形体及びその製造方法
JP5565758B2 (ja) * 2011-06-29 2014-08-06 信越化学工業株式会社 硬化性でグリース状の熱伝導性シリコーン組成物および半導体装置
JP6059472B2 (ja) * 2012-09-07 2017-01-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および光半導体装置
WO2014088115A1 (ja) * 2012-12-07 2014-06-12 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および光半導体装置
JP6572634B2 (ja) * 2015-06-09 2019-09-11 信越化学工業株式会社 付加硬化性シリコーンゴム組成物及び硬化物
JP6679870B2 (ja) * 2015-10-05 2020-04-15 三菱マテリアル株式会社 放熱シート
GB201603107D0 (en) 2016-02-23 2016-04-06 Dow Corning Low temperature cure silicone elastomer
US10844196B2 (en) 2016-10-26 2020-11-24 Shin-Etsu Chemical Co., Ltd. Thermally-conductive silicone composition
WO2018079215A1 (ja) * 2016-10-31 2018-05-03 東レ・ダウコーニング株式会社 １液硬化型熱伝導性シリコーングリース組成物及び電子・電装部品
JP6943028B2 (ja) * 2017-06-15 2021-09-29 信越化学工業株式会社 熱伝導性シリコーン組成物
WO2019155846A1 (ja) * 2018-02-09 2019-08-15 信越化学工業株式会社 熱伝導性シリコーン組成物、硬化物、半導体装置、及び半導体装置の製造方法
CN109486191A (zh) * 2018-09-04 2019-03-19 苏州泰吉诺新材料科技有限公司 一种室温固化的高性能导热电磁屏蔽材料及其生产工艺
CN115637050A (zh) * 2021-07-20 2023-01-24 中蓝晨光化工研究设计院有限公司 一种导热硅氧烷组合物
JP2023111110A (ja) * 2022-01-31 2023-08-10 信越化学工業株式会社 熱伝導性付加硬化型シリコーン組成物、及びその硬化物
CN115746362B (zh) * 2022-09-09 2023-07-14 东莞市零度导热材料有限公司 一种吸波导热片及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07150048A (ja) * 1993-10-06 1995-06-13 Toray Dow Corning Silicone Co Ltd 導電性シリコーンゴム組成物
JPH08319425A (ja) * 1995-05-25 1996-12-03 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JPH08325457A (ja) * 1995-05-29 1996-12-10 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JPH09111124A (ja) * 1995-10-17 1997-04-28 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴムおよびその組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58219259A (ja) * 1982-06-14 1983-12-20 Toray Silicone Co Ltd 熱伝導性シリコ−ンゴム組成物
JP2623380B2 (ja) * 1991-06-03 1997-06-25 信越化学工業株式会社 熱伝導性に優れたシリコーン組成物
ES2113023T3 (es) * 1993-10-06 1998-04-16 Dow Corning Toray Silicone Composiciones organosiloxanos electroconductoras cargadas de plata.

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07150048A (ja) * 1993-10-06 1995-06-13 Toray Dow Corning Silicone Co Ltd 導電性シリコーンゴム組成物
JPH08319425A (ja) * 1995-05-25 1996-12-03 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JPH08325457A (ja) * 1995-05-29 1996-12-10 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JPH09111124A (ja) * 1995-10-17 1997-04-28 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴムおよびその組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023160907A1 (en) * 2022-02-22 2023-08-31 Wacker Chemie Ag Thermally conductive silicone composition and method for producing thermally conductive cured product using the composition

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WO2004046233A1 (en) 2004-06-03
TW200416258A (en) 2004-09-01
AU2003260954A1 (en) 2004-06-15
JP2004168920A (ja) 2004-06-17

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