AU2003260954A1 - Thermally-conductive silicone elastomer composition - Google Patents

Thermally-conductive silicone elastomer composition

Info

Publication number
AU2003260954A1
AU2003260954A1 AU2003260954A AU2003260954A AU2003260954A1 AU 2003260954 A1 AU2003260954 A1 AU 2003260954A1 AU 2003260954 A AU2003260954 A AU 2003260954A AU 2003260954 A AU2003260954 A AU 2003260954A AU 2003260954 A1 AU2003260954 A1 AU 2003260954A1
Authority
AU
Australia
Prior art keywords
thermally
elastomer composition
silicone elastomer
conductive silicone
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003260954A
Inventor
Hiroki Ishikawa
Katsutoshi Mine
Kazumi Nakayoshi
Ryoto Shima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Publication of AU2003260954A1 publication Critical patent/AU2003260954A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AU2003260954A 2002-11-21 2003-09-08 Thermally-conductive silicone elastomer composition Abandoned AU2003260954A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-337566 2002-11-21
JP2002337566A JP4676671B2 (en) 2002-11-21 2002-11-21 Thermally conductive silicone elastomer composition
PCT/JP2003/011457 WO2004046233A1 (en) 2002-11-21 2003-09-08 Thermally-conductive silicone elastomer composition

Publications (1)

Publication Number Publication Date
AU2003260954A1 true AU2003260954A1 (en) 2004-06-15

Family

ID=32321846

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003260954A Abandoned AU2003260954A1 (en) 2002-11-21 2003-09-08 Thermally-conductive silicone elastomer composition

Country Status (4)

Country Link
JP (1) JP4676671B2 (en)
AU (1) AU2003260954A1 (en)
TW (1) TW200416258A (en)
WO (1) WO2004046233A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7393547B2 (en) 2001-04-11 2008-07-01 Helix Medical, Llc Antimicrobial elastomer composition and method for making
US7520897B2 (en) 2001-04-11 2009-04-21 Helix Medical, Llc Medical devices having antimicrobial properties
US8317861B2 (en) 2001-04-11 2012-11-27 Helix Medical, Llc Antimicrobial indwelling voice prosthesis
JP4803365B2 (en) * 2006-02-22 2011-10-26 信越化学工業株式会社 Thermally conductive silicone composition, thermally conductive silicone molded article and method for producing the same
JP5565758B2 (en) * 2011-06-29 2014-08-06 信越化学工業株式会社 Curable, grease-like thermally conductive silicone composition and semiconductor device
JP6059472B2 (en) * 2012-09-07 2017-01-11 東レ・ダウコーニング株式会社 Curable silicone composition and optical semiconductor device
CN104837930B (en) * 2012-12-07 2020-10-16 杜邦东丽特殊材料株式会社 Curable silicone composition and optical semiconductor device
JP6572634B2 (en) * 2015-06-09 2019-09-11 信越化学工業株式会社 Addition-curable silicone rubber composition and cured product
JP6679870B2 (en) * 2015-10-05 2020-04-15 三菱マテリアル株式会社 Heat dissipation sheet
GB201603107D0 (en) 2016-02-23 2016-04-06 Dow Corning Low temperature cure silicone elastomer
CN109844031B (en) * 2016-10-26 2022-01-11 信越化学工业株式会社 Heat conductive silicone composition
EP3533837B1 (en) 2016-10-31 2024-05-15 Dow Toray Co., Ltd. One-pack curable type thermally conductive silicone grease composition and electronic/electrical component
JP6943028B2 (en) * 2017-06-15 2021-09-29 信越化学工業株式会社 Thermally conductive silicone composition
WO2019155846A1 (en) * 2018-02-09 2019-08-15 信越化学工業株式会社 Thermoconductive silicone composition, cured product, semiconductor device, and semiconductor device production method
CN109486191A (en) * 2018-09-04 2019-03-19 苏州泰吉诺新材料科技有限公司 A kind of thermally conductive electromagnetic shielding material of the high-performance of room temperature curing and its production technology
CN115637050A (en) * 2021-07-20 2023-01-24 中蓝晨光化工研究设计院有限公司 Heat-conducting siloxane composition
JP2023111110A (en) * 2022-01-31 2023-08-10 信越化学工業株式会社 Thermally conductive addition-curable silicone composition and cured product of the same
JP2023122466A (en) * 2022-02-22 2023-09-01 旭化成ワッカーシリコーン株式会社 Heat conductive silicone composition and method for producing heat conductive cured product using the composition
CN115746362B (en) * 2022-09-09 2023-07-14 东莞市零度导热材料有限公司 Wave-absorbing heat-conducting sheet and preparation method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58219259A (en) * 1982-06-14 1983-12-20 Toray Silicone Co Ltd Heat-conductive silicone rubber composition
JP2623380B2 (en) * 1991-06-03 1997-06-25 信越化学工業株式会社 Silicone composition with excellent thermal conductivity
JP2868986B2 (en) * 1993-10-06 1999-03-10 東レ・ダウコーニング・シリコーン株式会社 Conductive silicone rubber composition
EP0647682B1 (en) * 1993-10-06 1997-12-03 Dow Corning Toray Silicone Company, Limited Silver-filled electrically conductive organosiloxane compositions
JP3524634B2 (en) * 1995-05-25 2004-05-10 東レ・ダウコーニング・シリコーン株式会社 Thermally conductive silicone rubber composition
JP3576639B2 (en) * 1995-05-29 2004-10-13 東レ・ダウコーニング・シリコーン株式会社 Thermally conductive silicone rubber composition
JP3597277B2 (en) * 1995-10-17 2004-12-02 東レ・ダウコーニング・シリコーン株式会社 Thermal conductive silicone rubber and composition thereof

Also Published As

Publication number Publication date
WO2004046233A1 (en) 2004-06-03
JP4676671B2 (en) 2011-04-27
JP2004168920A (en) 2004-06-17
TW200416258A (en) 2004-09-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase