JP4666399B2 - プリント配線板の製造方法 - Google Patents

プリント配線板の製造方法 Download PDF

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Publication number
JP4666399B2
JP4666399B2 JP2007556016A JP2007556016A JP4666399B2 JP 4666399 B2 JP4666399 B2 JP 4666399B2 JP 2007556016 A JP2007556016 A JP 2007556016A JP 2007556016 A JP2007556016 A JP 2007556016A JP 4666399 B2 JP4666399 B2 JP 4666399B2
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Prior art keywords
solder
opening
wiring board
printed wiring
mask
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Japanese (ja)
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JPWO2007086509A1 (ja
Inventor
克彦 丹野
洋一郎 川村
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Ibiden Co Ltd
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Ibiden Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2007556016A 2006-01-27 2007-01-26 プリント配線板の製造方法 Active JP4666399B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006019522 2006-01-27
JP2006019522 2006-01-27
PCT/JP2007/051274 WO2007086509A1 (ja) 2006-01-27 2007-01-26 プリント配線板の製造方法

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JPWO2007086509A1 JPWO2007086509A1 (ja) 2009-06-25
JP4666399B2 true JP4666399B2 (ja) 2011-04-06

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US (1) US8083123B2 (enExample)
EP (1) EP1978795A4 (enExample)
JP (1) JP4666399B2 (enExample)
KR (1) KR100973950B1 (enExample)
CN (2) CN101331812B (enExample)
TW (1) TW200746964A (enExample)
WO (1) WO2007086509A1 (enExample)

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CN101854771A (zh) 2005-06-30 2010-10-06 揖斐电株式会社 印刷线路板
JP2009081334A (ja) * 2007-09-27 2009-04-16 Aisin Aw Co Ltd 多層プリント配線基板及びその製造方法。
KR101022942B1 (ko) 2008-11-12 2011-03-16 삼성전기주식회사 흐름 방지용 댐을 구비한 인쇄회로기판 및 그 제조방법
KR101079513B1 (ko) 2009-05-13 2011-11-03 삼성전기주식회사 범프 인쇄장치 및 그 제어방법
US9455211B2 (en) * 2013-09-11 2016-09-27 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out structure with openings in buffer layer
US9425121B2 (en) 2013-09-11 2016-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out structure with guiding trenches in buffer layer
US9508636B2 (en) * 2013-10-16 2016-11-29 Intel Corporation Integrated circuit package substrate
US9153550B2 (en) * 2013-11-14 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate design with balanced metal and solder resist density
US9275955B2 (en) 2013-12-18 2016-03-01 Intel Corporation Integrated circuit package with embedded bridge
JP2015231003A (ja) * 2014-06-06 2015-12-21 イビデン株式会社 回路基板および回路基板の製造方法
CN209572247U (zh) * 2017-02-23 2019-11-01 株式会社村田制作所 电子部件及电子设备
CN107318228B (zh) * 2017-08-29 2019-09-06 郑州云海信息技术有限公司 一种印制电路板的制造方法及其制造装置
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KR20080028467A (ko) 2008-03-31
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CN101331812B (zh) 2011-02-02
US20090120680A1 (en) 2009-05-14
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TWI353204B (enExample) 2011-11-21
US8083123B2 (en) 2011-12-27
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TW200746964A (en) 2007-12-16
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