CN101331812B - 印刷线路板的制造方法 - Google Patents

印刷线路板的制造方法 Download PDF

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Publication number
CN101331812B
CN101331812B CN2007800007403A CN200780000740A CN101331812B CN 101331812 B CN101331812 B CN 101331812B CN 2007800007403 A CN2007800007403 A CN 2007800007403A CN 200780000740 A CN200780000740 A CN 200780000740A CN 101331812 B CN101331812 B CN 101331812B
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Prior art keywords
solder
opening
ball
mask
printed wiring
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Expired - Fee Related
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CN2007800007403A
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English (en)
Chinese (zh)
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CN101331812A (zh
Inventor
丹野克彦
川村洋一郎
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Ibiden Co Ltd
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Ibiden Co Ltd
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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  • Manufacturing & Machinery (AREA)
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  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN2007800007403A 2006-01-27 2007-01-26 印刷线路板的制造方法 Expired - Fee Related CN101331812B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP019522/2006 2006-01-27
JP2006019522 2006-01-27
PCT/JP2007/051274 WO2007086509A1 (ja) 2006-01-27 2007-01-26 プリント配線板の製造方法

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CN2010106229552A Division CN102098881A (zh) 2006-01-27 2007-01-26 印刷线路板的制造方法

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CN101331812A CN101331812A (zh) 2008-12-24
CN101331812B true CN101331812B (zh) 2011-02-02

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CN2010106229552A Pending CN102098881A (zh) 2006-01-27 2007-01-26 印刷线路板的制造方法

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US (1) US8083123B2 (enExample)
EP (1) EP1978795A4 (enExample)
JP (1) JP4666399B2 (enExample)
KR (1) KR100973950B1 (enExample)
CN (2) CN101331812B (enExample)
TW (1) TW200746964A (enExample)
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105556648A (zh) * 2013-10-16 2016-05-04 英特尔公司 集成电路封装衬底
US10068852B2 (en) 2013-12-18 2018-09-04 Intel Corporation Integrated circuit package with embedded bridge

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101854771A (zh) 2005-06-30 2010-10-06 揖斐电株式会社 印刷线路板
JP2009081334A (ja) * 2007-09-27 2009-04-16 Aisin Aw Co Ltd 多層プリント配線基板及びその製造方法。
KR101022942B1 (ko) 2008-11-12 2011-03-16 삼성전기주식회사 흐름 방지용 댐을 구비한 인쇄회로기판 및 그 제조방법
KR101079513B1 (ko) 2009-05-13 2011-11-03 삼성전기주식회사 범프 인쇄장치 및 그 제어방법
US9455211B2 (en) * 2013-09-11 2016-09-27 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out structure with openings in buffer layer
US9425121B2 (en) 2013-09-11 2016-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out structure with guiding trenches in buffer layer
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US8083123B2 (en) 2011-12-27
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TW200746964A (en) 2007-12-16
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