JP4657824B2 - 基板載置台、基板処理装置および基板載置台の製造方法 - Google Patents

基板載置台、基板処理装置および基板載置台の製造方法 Download PDF

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JP4657824B2
JP4657824B2 JP2005178149A JP2005178149A JP4657824B2 JP 4657824 B2 JP4657824 B2 JP 4657824B2 JP 2005178149 A JP2005178149 A JP 2005178149A JP 2005178149 A JP2005178149 A JP 2005178149A JP 4657824 B2 JP4657824 B2 JP 4657824B2
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Prior art keywords
substrate
mounting table
dielectric material
material film
substrate mounting
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JP2005178149A
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Japanese (ja)
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JP2006351949A (ja
Inventor
聖 林
務 里吉
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2005178149A priority Critical patent/JP4657824B2/ja
Priority to KR1020060053935A priority patent/KR100904563B1/ko
Priority to TW095121599A priority patent/TWI413205B/zh
Priority to CNB2006100923036A priority patent/CN100411133C/zh
Publication of JP2006351949A publication Critical patent/JP2006351949A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2005178149A 2005-06-17 2005-06-17 基板載置台、基板処理装置および基板載置台の製造方法 Active JP4657824B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005178149A JP4657824B2 (ja) 2005-06-17 2005-06-17 基板載置台、基板処理装置および基板載置台の製造方法
KR1020060053935A KR100904563B1 (ko) 2005-06-17 2006-06-15 기판 탑재대, 기판 처리 장치 및 기판 탑재대의 제조 방법
TW095121599A TWI413205B (zh) 2005-06-17 2006-06-16 A substrate mounting table, a substrate processing apparatus, and a substrate mounting table
CNB2006100923036A CN100411133C (zh) 2005-06-17 2006-06-16 基板载置台、基板处理装置和基板载置台的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005178149A JP4657824B2 (ja) 2005-06-17 2005-06-17 基板載置台、基板処理装置および基板載置台の製造方法

Publications (2)

Publication Number Publication Date
JP2006351949A JP2006351949A (ja) 2006-12-28
JP4657824B2 true JP4657824B2 (ja) 2011-03-23

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ID=37519680

Family Applications (1)

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JP2005178149A Active JP4657824B2 (ja) 2005-06-17 2005-06-17 基板載置台、基板処理装置および基板載置台の製造方法

Country Status (4)

Country Link
JP (1) JP4657824B2 (zh)
KR (1) KR100904563B1 (zh)
CN (1) CN100411133C (zh)
TW (1) TWI413205B (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4864757B2 (ja) * 2007-02-14 2012-02-01 東京エレクトロン株式会社 基板載置台及びその表面処理方法
JP5059450B2 (ja) * 2007-03-06 2012-10-24 東京エレクトロン株式会社 基板載置台及び基板処理装置
WO2008114753A1 (ja) * 2007-03-22 2008-09-25 Tokyo Electron Limited 基板載置台，基板処理装置，基板載置台の表面加工方法
JP4516089B2 (ja) * 2007-03-30 2010-08-04 アプライド マテリアルズ インコーポレイテッド ウェハ搬送用ブレード
JP2008300374A (ja) * 2007-05-29 2008-12-11 Shin Etsu Chem Co Ltd 静電吸着装置
KR100938874B1 (ko) * 2007-07-24 2010-01-27 주식회사 에스에프에이 유리기판 지지용 서셉터 및 그 제조 방법, 그리고 그유리기판 지지용 서셉터를 구비한 화학 기상 증착장치
JP2009188332A (ja) 2008-02-08 2009-08-20 Tokyo Electron Ltd プラズマ処理装置用基板載置台、プラズマ処理装置および絶縁皮膜の成膜方法
JP5612300B2 (ja) * 2009-12-01 2014-10-22 東京エレクトロン株式会社 基板載置台、その製造方法及び基板処理装置
JP2012028539A (ja) * 2010-07-23 2012-02-09 Ngk Spark Plug Co Ltd セラミックス接合体
JP6010296B2 (ja) * 2010-12-28 2016-10-19 東京エレクトロン株式会社 静電チャック
CN102732861B (zh) * 2011-04-14 2014-12-17 北京北方微电子基地设备工艺研究中心有限责任公司 托盘及具有其的化学气相沉积设备
WO2012166256A1 (en) * 2011-06-02 2012-12-06 Applied Materials, Inc. Electrostatic chuck aln dielectric repair
KR101974386B1 (ko) * 2012-03-21 2019-05-03 주식회사 미코 정전척
TWI514463B (zh) * 2012-11-30 2015-12-21 Global Material Science Co Ltd 乾蝕刻設備中的靜電吸附板表面凸點的製造方法
KR20150138959A (ko) * 2014-05-30 2015-12-11 (주)아이씨디 챔버 내 피처리 대상물 접촉구조, 정전 척 및 그 제조방법
US10020218B2 (en) * 2015-11-17 2018-07-10 Applied Materials, Inc. Substrate support assembly with deposited surface features
JP6991043B2 (ja) * 2017-11-22 2022-02-03 東京エレクトロン株式会社 基板載置台
WO2019245727A1 (en) * 2018-06-22 2019-12-26 Applied Materials, Inc. Methods of minimizing wafer backside damage in semiconductor wafer processing
JP7182916B2 (ja) * 2018-06-26 2022-12-05 東京エレクトロン株式会社 プラズマ処理装置
JP7241519B2 (ja) * 2018-12-04 2023-03-17 東京エレクトロン株式会社 基板載置台、基板処理装置及び基板載置台の製造方法
US11315759B2 (en) * 2019-02-08 2022-04-26 Hitachi High-Tech Corporation Plasma processing apparatus
CN109881184B (zh) * 2019-03-29 2022-03-25 拓荆科技股份有限公司 具有静电力抑制的基板承载装置
CN114351120A (zh) * 2021-12-27 2022-04-15 拓荆科技股份有限公司 晶圆支撑装置及沉积薄膜厚度控制的方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0230159A (ja) * 1988-07-20 1990-01-31 Nikon Corp 基板吸着装置
JPH05205997A (ja) * 1992-01-29 1993-08-13 Canon Inc 基板保持盤
JPH08330401A (ja) * 1995-06-02 1996-12-13 Sony Corp ウエハチャック
JP2001341043A (ja) * 2000-06-02 2001-12-11 Sumitomo Osaka Cement Co Ltd 吸着固定装置
JP2001351966A (ja) * 2000-06-05 2001-12-21 Sumitomo Osaka Cement Co Ltd サセプタ及びサセプタの製造方法
JP2002313898A (ja) * 2001-02-08 2002-10-25 Tokyo Electron Ltd 基板載置台およびその製造方法ならびに処理装置
JP2003086664A (ja) * 2001-09-13 2003-03-20 Sumitomo Osaka Cement Co Ltd 吸着固定装置及びその製造方法
JP2003142566A (ja) * 2001-11-07 2003-05-16 New Creation Co Ltd 真空吸着器及びその製造方法
JP2005142591A (ja) * 2005-01-31 2005-06-02 Sumitomo Osaka Cement Co Ltd 静電チャック
JP2005332910A (ja) * 2004-05-19 2005-12-02 Hitachi High-Tech Electronics Engineering Co Ltd 基板チャック、及び表示用パネル基板の製造方法
JP2006049352A (ja) * 2004-07-30 2006-02-16 Sumitomo Osaka Cement Co Ltd サセプタ装置
JP2006073909A (ja) * 2004-09-06 2006-03-16 Tokyo Electron Ltd 基板処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62124735A (ja) * 1985-11-25 1987-06-06 Denki Kagaku Kogyo Kk 半導体気相成長用サセプタ
JP3160229B2 (ja) * 1997-06-06 2001-04-25 日本エー・エス・エム株式会社 プラズマｃｖｄ装置用サセプタ及びその製造方法
KR20050054317A (ko) * 2003-12-04 2005-06-10 엘지.필립스 엘시디 주식회사 블래스트 공정을 포함하는 서셉터 제조방법 및 이를 통해제조되는 서셉터
US7663860B2 (en) * 2003-12-05 2010-02-16 Tokyo Electron Limited Electrostatic chuck
JP4618253B2 (ja) * 2004-09-17 2011-01-26 株式会社ニコン 基板保持装置、露光装置、及びデバイス製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0230159A (ja) * 1988-07-20 1990-01-31 Nikon Corp 基板吸着装置
JPH05205997A (ja) * 1992-01-29 1993-08-13 Canon Inc 基板保持盤
JPH08330401A (ja) * 1995-06-02 1996-12-13 Sony Corp ウエハチャック
JP2001341043A (ja) * 2000-06-02 2001-12-11 Sumitomo Osaka Cement Co Ltd 吸着固定装置
JP2001351966A (ja) * 2000-06-05 2001-12-21 Sumitomo Osaka Cement Co Ltd サセプタ及びサセプタの製造方法
JP2002313898A (ja) * 2001-02-08 2002-10-25 Tokyo Electron Ltd 基板載置台およびその製造方法ならびに処理装置
JP2003086664A (ja) * 2001-09-13 2003-03-20 Sumitomo Osaka Cement Co Ltd 吸着固定装置及びその製造方法
JP2003142566A (ja) * 2001-11-07 2003-05-16 New Creation Co Ltd 真空吸着器及びその製造方法
JP2005332910A (ja) * 2004-05-19 2005-12-02 Hitachi High-Tech Electronics Engineering Co Ltd 基板チャック、及び表示用パネル基板の製造方法
JP2006049352A (ja) * 2004-07-30 2006-02-16 Sumitomo Osaka Cement Co Ltd サセプタ装置
JP2006073909A (ja) * 2004-09-06 2006-03-16 Tokyo Electron Ltd 基板処理装置
JP2005142591A (ja) * 2005-01-31 2005-06-02 Sumitomo Osaka Cement Co Ltd 静電チャック

Also Published As

Publication number Publication date
KR20060132466A (ko) 2006-12-21
CN1881555A (zh) 2006-12-20
TW200715456A (en) 2007-04-16
KR100904563B1 (ko) 2009-06-25
TWI413205B (zh) 2013-10-21
CN100411133C (zh) 2008-08-13
JP2006351949A (ja) 2006-12-28

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