JP4657204B2 - 固体電解コンデンサ - Google Patents
固体電解コンデンサ Download PDFInfo
- Publication number
- JP4657204B2 JP4657204B2 JP2006511754A JP2006511754A JP4657204B2 JP 4657204 B2 JP4657204 B2 JP 4657204B2 JP 2006511754 A JP2006511754 A JP 2006511754A JP 2006511754 A JP2006511754 A JP 2006511754A JP 4657204 B2 JP4657204 B2 JP 4657204B2
- Authority
- JP
- Japan
- Prior art keywords
- sintered body
- anode
- electrolytic capacitor
- solid electrolytic
- porous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims description 110
- 239000007787 solid Substances 0.000 title claims description 100
- 229910052751 metal Inorganic materials 0.000 claims description 105
- 239000002184 metal Substances 0.000 claims description 105
- 239000007784 solid electrolyte Substances 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 15
- 239000012212 insulator Substances 0.000 claims description 6
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 58
- 239000010955 niobium Substances 0.000 description 54
- 229910052758 niobium Inorganic materials 0.000 description 53
- 239000000463 material Substances 0.000 description 43
- 239000000843 powder Substances 0.000 description 35
- 229920005989 resin Polymers 0.000 description 21
- 239000011347 resin Substances 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 20
- BFRGSJVXBIWTCF-UHFFFAOYSA-N niobium monoxide Chemical compound [Nb]=O BFRGSJVXBIWTCF-UHFFFAOYSA-N 0.000 description 18
- 230000009471 action Effects 0.000 description 14
- 230000001965 increasing effect Effects 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 239000004020 conductor Substances 0.000 description 11
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 238000005245 sintering Methods 0.000 description 10
- 239000000243 solution Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 8
- 229910052715 tantalum Inorganic materials 0.000 description 8
- CFJRGWXELQQLSA-UHFFFAOYSA-N azanylidyneniobium Chemical compound [Nb]#N CFJRGWXELQQLSA-UHFFFAOYSA-N 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000005304 joining Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229910000484 niobium oxide Inorganic materials 0.000 description 4
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 238000007743 anodising Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- -1 for example Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- ZYTNDGXGVOZJBT-UHFFFAOYSA-N niobium Chemical compound [Nb].[Nb].[Nb] ZYTNDGXGVOZJBT-UHFFFAOYSA-N 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/052—Sintered electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
Claims (6)
- 弁作用金属からなる多孔質の第1焼結体と、
弁作用金属からなる多孔質の第2焼結体と、を備えており、
上記各焼結体は2つの主面を有する扁平状であり、
上記第1焼結体および上記第2焼結体は、上記2つの主面が相互に離間する方向に対して垂直な所定の方向に離間して配置されており、
上記第1焼結体および上記第2焼結体を一纏めに封止するパッケージをさらに備え、
上記第1焼結体および上記第2焼結体の一方に導通する内部陽極端子と、この内部陽極端子に導通し且つ上記パッケージから露出する外部陽極端子とをさらに備えており、
上記内部陽極端子は、上記一方の焼結体から互いに逆方向に突出する第1陽極棒および第2陽極棒を含み、上記第1陽極棒の突出方向は、上記第1焼結体および上記第2焼結体が離間する上記所定の方向と交差し、
上記第1陽極棒および上記第2陽極棒を互いに導通させる導通部材をさらに備え、且つ、上記導通部材は、上記各焼結体の下面に絶縁体を介して固定された陽極金属板を含んでいる、固体電解コンデンサ。 - 上記陽極金属板の少なくとも一部が、上記外部陽極端子となっている、請求項1に記載の固体電解コンデンサ。
- 上記各焼結体と上記絶縁体との間に介在し、かつ上記内部陰極端子および上記外部陰極端子をそれぞれ形成する部分を有する陰極金属板をさらに備える、請求項1に記載の固体電解コンデンサ。
- 上記第1焼結体および上記第2焼結体の一方に形成された誘電体層および固体電解質層と、この固体電解質層に導通する内部陰極端子と、この内部陰極端子に導通し且つ上記パッケージから露出する外部陰極端子とをさらに備える、請求項1に記載の固体電解コンデンサ。
- 上記外部陰極端子は、上記外部陰極端子と同方向に延出している、請求項3に記載の固体電解コンデンサ。
- 上記外部陽極端子および上記外部陰極端子は、上記第1および第2焼結体が離間する上記所定の方向に延出している、請求項5に記載の固体電解コンデンサ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004099435 | 2004-03-30 | ||
JP2004099435 | 2004-03-30 | ||
PCT/JP2005/006133 WO2005096332A1 (ja) | 2004-03-30 | 2005-03-30 | 固体電解コンデンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2005096332A1 JPWO2005096332A1 (ja) | 2008-02-21 |
JP4657204B2 true JP4657204B2 (ja) | 2011-03-23 |
Family
ID=35064053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006511754A Expired - Fee Related JP4657204B2 (ja) | 2004-03-30 | 2005-03-30 | 固体電解コンデンサ |
Country Status (5)
Country | Link |
---|---|
US (1) | US7551424B2 (ja) |
JP (1) | JP4657204B2 (ja) |
KR (1) | KR100859910B1 (ja) |
CN (1) | CN1938801B (ja) |
WO (1) | WO2005096332A1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7468882B2 (en) * | 2006-04-28 | 2008-12-23 | Avx Corporation | Solid electrolytic capacitor assembly |
US8081419B2 (en) * | 2007-10-17 | 2011-12-20 | Greatbatch Ltd. | Interconnections for multiple capacitor anode leads |
EP2365496A4 (en) * | 2008-12-01 | 2013-01-23 | Panasonic Corp | ELECTRODE SHEET FOR CAPACITOR, AND L ELECTROLYTIC CAPACITOR USING THE SAME |
US8203827B2 (en) * | 2009-02-20 | 2012-06-19 | Avx Corporation | Anode for a solid electrolytic capacitor containing a non-metallic surface treatment |
CN102549692B (zh) * | 2009-10-09 | 2013-09-18 | 松下电器产业株式会社 | 电极箔及使用该电极箔的电容器 |
EP2557578A1 (en) * | 2010-04-07 | 2013-02-13 | Toyo Aluminium Kabushiki Kaisha | Method of manufacturing electrode structure, electrode structure, and capacitor |
JP2012038873A (ja) * | 2010-08-06 | 2012-02-23 | Nec Tokin Corp | 半導体装置 |
TWI492254B (zh) * | 2010-12-28 | 2015-07-11 | Ind Tech Res Inst | 去耦合元件 |
TWI511172B (zh) | 2011-11-10 | 2015-12-01 | 財團法人工業技術研究院 | 去耦合元件及其製造方法 |
US9282638B2 (en) * | 2012-01-13 | 2016-03-08 | Zycube Co., Ltd. | Electrode, electrode material, and electrode formation method |
KR102089698B1 (ko) * | 2014-05-07 | 2020-03-16 | 삼성전기주식회사 | 탄탈륨 캐패시터 |
KR20160007197A (ko) * | 2014-07-11 | 2016-01-20 | 삼성전기주식회사 | 탄탈륨 캐패시터 |
KR102149799B1 (ko) * | 2014-09-23 | 2020-08-31 | 삼성전기주식회사 | 탄탈륨 커패시터 |
KR102189802B1 (ko) * | 2015-12-15 | 2020-12-11 | 삼성전기주식회사 | 복합 전자 부품 및 그 실장 기판 |
JP7151764B2 (ja) | 2018-06-11 | 2022-10-12 | 株式会社村田製作所 | コンデンサアレイ、複合電子部品、コンデンサアレイの製造方法、及び、複合電子部品の製造方法 |
KR102356960B1 (ko) | 2019-03-29 | 2022-01-28 | 가부시키가이샤 무라타 세이사쿠쇼 | 콘덴서 어레이 및 복합 전자 부품 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6041716Y2 (ja) * | 1979-03-29 | 1985-12-19 | 日立コンデンサ株式会社 | 固体電解コンデンサ |
JPS6151911A (ja) * | 1984-07-13 | 1986-03-14 | スプラグ・エレクトリツク・カンパニ− | 改良された固体電解コンデンサおよびその製造法 |
JPH06349678A (ja) * | 1993-06-07 | 1994-12-22 | Tdk Corp | 貫通型コンデンサ及びそれを用いた電子装置並びに貫通型コンデンサの実装方法 |
JP2001057319A (ja) * | 1999-06-11 | 2001-02-27 | Sanyo Electric Co Ltd | 固体電解コンデンサの陽極素子、固体電解コンデンサ、並びに固体電解コンデンサの製造方法及び製造装置 |
WO2002010483A2 (en) * | 2000-08-02 | 2002-02-07 | Kemet Electronics Corporation | Non-aqueous electrolytes and method for anodizing |
JP2003101311A (ja) * | 2001-09-20 | 2003-04-04 | Nec Corp | シールドストリップ線路型素子 |
JP2003142347A (ja) * | 2001-11-02 | 2003-05-16 | Rohm Co Ltd | 固体電解コンデンサの構造及びその製造方法 |
JP2003338433A (ja) * | 2002-05-22 | 2003-11-28 | Nec Tokin Corp | 固体電解コンデンサ用の陽極体、その製造方法及び固体電解コンデンサ |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3686535A (en) * | 1971-07-02 | 1972-08-22 | Union Carbide Corp | Electrolytic capacitor with separate interconnected anode bodies |
EP1045410B1 (en) * | 1999-04-16 | 2007-01-24 | Matsushita Electric Industrial Co., Ltd. | Anodic electrode for electrolytic capacitor and process of producing the same |
TWI279080B (en) | 2001-09-20 | 2007-04-11 | Nec Corp | Shielded strip line device and method of manufacture thereof |
JP4539948B2 (ja) | 2001-11-29 | 2010-09-08 | ローム株式会社 | コンデンサの製造方法 |
JP4010447B2 (ja) * | 2002-05-30 | 2007-11-21 | ローム株式会社 | 固体電解コンデンサ及びその製造方法 |
US6870727B2 (en) * | 2002-10-07 | 2005-03-22 | Avx Corporation | Electrolytic capacitor with improved volumetric efficiency |
US7218505B2 (en) * | 2003-03-03 | 2007-05-15 | Showa Denko K.K. | Chip solid electrolyte capacitor |
JP4472277B2 (ja) * | 2003-04-10 | 2010-06-02 | Necトーキン株式会社 | チップ型固体電解コンデンサ |
US7609505B2 (en) * | 2003-08-13 | 2009-10-27 | Showa Denko K.K. | Chip solid electrolyte capacitor and production method of the same |
JP2005166832A (ja) * | 2003-12-01 | 2005-06-23 | Rohm Co Ltd | 固体電解コンデンサ |
JP4392237B2 (ja) * | 2003-12-26 | 2009-12-24 | ローム株式会社 | 固体電解コンデンサ |
-
2005
- 2005-03-30 US US10/594,700 patent/US7551424B2/en not_active Expired - Fee Related
- 2005-03-30 CN CN2005800105591A patent/CN1938801B/zh not_active Expired - Fee Related
- 2005-03-30 JP JP2006511754A patent/JP4657204B2/ja not_active Expired - Fee Related
- 2005-03-30 KR KR1020067020433A patent/KR100859910B1/ko not_active IP Right Cessation
- 2005-03-30 WO PCT/JP2005/006133 patent/WO2005096332A1/ja active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6041716Y2 (ja) * | 1979-03-29 | 1985-12-19 | 日立コンデンサ株式会社 | 固体電解コンデンサ |
JPS6151911A (ja) * | 1984-07-13 | 1986-03-14 | スプラグ・エレクトリツク・カンパニ− | 改良された固体電解コンデンサおよびその製造法 |
JPH06349678A (ja) * | 1993-06-07 | 1994-12-22 | Tdk Corp | 貫通型コンデンサ及びそれを用いた電子装置並びに貫通型コンデンサの実装方法 |
JP2001057319A (ja) * | 1999-06-11 | 2001-02-27 | Sanyo Electric Co Ltd | 固体電解コンデンサの陽極素子、固体電解コンデンサ、並びに固体電解コンデンサの製造方法及び製造装置 |
WO2002010483A2 (en) * | 2000-08-02 | 2002-02-07 | Kemet Electronics Corporation | Non-aqueous electrolytes and method for anodizing |
JP2003101311A (ja) * | 2001-09-20 | 2003-04-04 | Nec Corp | シールドストリップ線路型素子 |
JP2003142347A (ja) * | 2001-11-02 | 2003-05-16 | Rohm Co Ltd | 固体電解コンデンサの構造及びその製造方法 |
JP2003338433A (ja) * | 2002-05-22 | 2003-11-28 | Nec Tokin Corp | 固体電解コンデンサ用の陽極体、その製造方法及び固体電解コンデンサ |
Also Published As
Publication number | Publication date |
---|---|
CN1938801B (zh) | 2012-10-31 |
US7551424B2 (en) | 2009-06-23 |
US20070177336A1 (en) | 2007-08-02 |
WO2005096332A1 (ja) | 2005-10-13 |
JPWO2005096332A1 (ja) | 2008-02-21 |
CN1938801A (zh) | 2007-03-28 |
KR100859910B1 (ko) | 2008-09-23 |
KR20060135855A (ko) | 2006-12-29 |
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