JP4657090B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP4657090B2
JP4657090B2 JP2005332568A JP2005332568A JP4657090B2 JP 4657090 B2 JP4657090 B2 JP 4657090B2 JP 2005332568 A JP2005332568 A JP 2005332568A JP 2005332568 A JP2005332568 A JP 2005332568A JP 4657090 B2 JP4657090 B2 JP 4657090B2
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JP
Japan
Prior art keywords
substrate
nozzle
processing
hole
liquid
Prior art date
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Expired - Fee Related
Application number
JP2005332568A
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English (en)
Japanese (ja)
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JP2007142077A5 (enExample
JP2007142077A (ja
Inventor
勝彦 宮
昭 泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2005332568A priority Critical patent/JP4657090B2/ja
Publication of JP2007142077A publication Critical patent/JP2007142077A/ja
Publication of JP2007142077A5 publication Critical patent/JP2007142077A5/ja
Application granted granted Critical
Publication of JP4657090B2 publication Critical patent/JP4657090B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2005332568A 2005-11-17 2005-11-17 基板処理装置 Expired - Fee Related JP4657090B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005332568A JP4657090B2 (ja) 2005-11-17 2005-11-17 基板処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005332568A JP4657090B2 (ja) 2005-11-17 2005-11-17 基板処理装置

Publications (3)

Publication Number Publication Date
JP2007142077A JP2007142077A (ja) 2007-06-07
JP2007142077A5 JP2007142077A5 (enExample) 2008-10-23
JP4657090B2 true JP4657090B2 (ja) 2011-03-23

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ID=38204604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005332568A Expired - Fee Related JP4657090B2 (ja) 2005-11-17 2005-11-17 基板処理装置

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JP (1) JP4657090B2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4841451B2 (ja) 2007-01-31 2011-12-21 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US8617318B2 (en) 2008-06-05 2013-12-31 Tokyo Electron Limited Liquid processing apparatus and liquid processing method
JP5308211B2 (ja) * 2009-03-30 2013-10-09 大日本スクリーン製造株式会社 基板処理装置
KR101065557B1 (ko) 2008-10-29 2011-09-19 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치
JP5480617B2 (ja) * 2009-12-25 2014-04-23 大日本スクリーン製造株式会社 基板処理装置
JP5572575B2 (ja) 2010-05-12 2014-08-13 東京エレクトロン株式会社 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体
JP5449239B2 (ja) * 2010-05-12 2014-03-19 東京エレクトロン株式会社 基板処理装置、基板処理方法及びプログラムを記録した記憶媒体
JP5243491B2 (ja) 2010-06-18 2013-07-24 東京エレクトロン株式会社 位置決め装置、基板処理装置及び基準部材の固定方法
JP5802407B2 (ja) 2011-03-04 2015-10-28 三菱瓦斯化学株式会社 基板処理装置および基板処理方法
JP5729326B2 (ja) 2012-02-14 2015-06-03 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP5706981B2 (ja) * 2014-02-13 2015-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR101994423B1 (ko) * 2016-12-27 2019-07-01 세메스 주식회사 기판 처리 장치
KR102099883B1 (ko) * 2019-05-24 2020-04-13 세메스 주식회사 기판 처리 장치
JP7543130B2 (ja) 2020-12-28 2024-09-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4179593B2 (ja) * 2002-08-21 2008-11-12 大日本スクリーン製造株式会社 基板周縁処理装置および基板周縁処理方法
JP4409312B2 (ja) * 2004-02-18 2010-02-03 大日本スクリーン製造株式会社 基板周縁処理装置および基板周縁処理方法

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Publication number Publication date
JP2007142077A (ja) 2007-06-07

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