JP4642350B2 - 基板の貼り合わせ装置及び貼り合わせ方法 - Google Patents

基板の貼り合わせ装置及び貼り合わせ方法 Download PDF

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Publication number
JP4642350B2
JP4642350B2 JP2003435974A JP2003435974A JP4642350B2 JP 4642350 B2 JP4642350 B2 JP 4642350B2 JP 2003435974 A JP2003435974 A JP 2003435974A JP 2003435974 A JP2003435974 A JP 2003435974A JP 4642350 B2 JP4642350 B2 JP 4642350B2
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substrate
holding table
holding
held
chamber
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Expired - Fee Related
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JP2003435974A
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Japanese (ja)
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JP2004220023A (ja
JP2004220023A5 (enExample
Inventor
浩一 増田
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2003435974A priority Critical patent/JP4642350B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B2038/1891—Using a robot for handling the layers

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  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2003435974A 2002-12-26 2003-12-26 基板の貼り合わせ装置及び貼り合わせ方法 Expired - Fee Related JP4642350B2 (ja)

Priority Applications (1)

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JP2003435974A JP4642350B2 (ja) 2002-12-26 2003-12-26 基板の貼り合わせ装置及び貼り合わせ方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002378179 2002-12-26
JP2003435974A JP4642350B2 (ja) 2002-12-26 2003-12-26 基板の貼り合わせ装置及び貼り合わせ方法

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JP2004220023A JP2004220023A (ja) 2004-08-05
JP2004220023A5 JP2004220023A5 (enExample) 2007-02-15
JP4642350B2 true JP4642350B2 (ja) 2011-03-02

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JP2003435974A Expired - Fee Related JP4642350B2 (ja) 2002-12-26 2003-12-26 基板の貼り合わせ装置及び貼り合わせ方法

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JP (1) JP4642350B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI285758B (en) * 2004-10-08 2007-08-21 Au Optronics Corp A method for combining set of substrates and apparatus of the same
JP4711466B2 (ja) * 2004-10-28 2011-06-29 芝浦メカトロニクス株式会社 基板製造装置及び基板製造方法
CN103029410B (zh) * 2012-12-30 2015-08-19 金龙机电（东莞）有限公司 一种触摸屏和显示屏全贴合的方法及装置
CN112731697B (zh) * 2021-01-04 2022-09-27 河北光兴半导体技术有限公司 液晶显示面板的加工系统及其加工方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05232423A (ja) * 1992-02-24 1993-09-10 Tekunisuko:Kk 液晶板切断装置
JPH10244545A (ja) * 1997-03-04 1998-09-14 Canon Inc 離型方法及び離型装置
JP3574865B2 (ja) * 1999-11-08 2004-10-06 株式会社 日立インダストリイズ 基板の組立方法とその装置
JP2001215459A (ja) * 2000-02-02 2001-08-10 Matsushita Electric Ind Co Ltd 液晶表示素子製造装置
JP2001264780A (ja) * 2000-03-17 2001-09-26 Toshiba Corp 液晶表示装置の製造装置及び製造方法
JP3742000B2 (ja) * 2000-11-30 2006-02-01 富士通株式会社 プレス装置
JP4605332B2 (ja) * 2001-03-07 2011-01-05 株式会社日立ハイテクノロジーズ 基板重ね合わせ装置
JP2002357838A (ja) * 2001-05-31 2002-12-13 Hitachi Industries Co Ltd 基板貼り合わせ方法及びその装置

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Publication number Publication date
JP2004220023A (ja) 2004-08-05

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