JP4636183B2 - 異方導電性接着剤組成物、異方導電性フィルム、回路部材の接続構造、及び、被覆粒子の製造方法 - Google Patents
異方導電性接着剤組成物、異方導電性フィルム、回路部材の接続構造、及び、被覆粒子の製造方法 Download PDFInfo
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- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Cited By (1)
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|---|---|---|---|---|
| WO2015125778A1 (ja) * | 2014-02-24 | 2015-08-27 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
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| JP2008120990A (ja) * | 2006-10-17 | 2008-05-29 | Hitachi Chem Co Ltd | 異方導電性接着剤組成物、異方導電性フィルム、回路部材の接続構造、及び、被覆粒子の製造方法 |
| JP5549069B2 (ja) * | 2008-04-22 | 2014-07-16 | 日立化成株式会社 | 異方性導電接着剤用粒子状導電材料及びその製造方法、並びに異方性導電接着剤 |
| JP5644067B2 (ja) * | 2008-07-23 | 2014-12-24 | 日立化成株式会社 | 絶縁被覆導電粒子 |
| CN102687603B (zh) * | 2009-12-24 | 2015-07-15 | 住友电木株式会社 | 导电连接材料、电子部件的生产方法以及具有导电连接材料的电子构件和电子部件 |
| JP5510539B2 (ja) * | 2010-04-01 | 2014-06-04 | トヨタ自動車株式会社 | 燃料電池用接着材料および燃料電池 |
| JP2013033735A (ja) * | 2011-07-06 | 2013-02-14 | Sekisui Chem Co Ltd | 異方性導電材料及び接続構造体 |
| JPWO2013089199A1 (ja) * | 2011-12-16 | 2015-04-27 | 旭化成イーマテリアルズ株式会社 | 異方導電性フィルム付き半導体チップ、異方導電性フィルム付き半導体ウェハ、及び半導体装置 |
| KR101464353B1 (ko) * | 2011-12-28 | 2014-11-25 | 제일모직 주식회사 | 이방 도전성 필름용 조성물, 이방 도전성 필름, 및 이를 이용한 반도체 장치 |
| JP6155651B2 (ja) * | 2012-01-11 | 2017-07-05 | 日立化成株式会社 | 導電粒子、絶縁被覆導電粒子及び異方導電性接着剤 |
| TW201415495A (zh) * | 2012-10-12 | 2014-04-16 | 鴻海精密工業股份有限公司 | 異方性導電膜及其製備方法 |
| CN103730192A (zh) * | 2012-10-16 | 2014-04-16 | 鸿富锦精密工业(深圳)有限公司 | 各向异性导电膜及其制备方法 |
| TWI500126B (zh) * | 2013-01-02 | 2015-09-11 | Au Optronics Corp | 顯示裝置之驅動元件的構裝方法以及顯示裝置之驅動元件的構裝結構 |
| US9187314B2 (en) * | 2013-03-15 | 2015-11-17 | Robert Bosch Gmbh | Anisotropic conductor and method of fabrication thereof |
| JP5805147B2 (ja) * | 2013-07-01 | 2015-11-04 | 本田技研工業株式会社 | 塗装方法 |
| JP6408759B2 (ja) * | 2013-11-08 | 2018-10-17 | デクセリアルズ株式会社 | 接着剤組成物、及びフィルム巻装体 |
| JP2015135878A (ja) * | 2014-01-16 | 2015-07-27 | デクセリアルズ株式会社 | 接続体、接続体の製造方法、接続方法、異方性導電接着剤 |
| KR102545861B1 (ko) * | 2014-10-29 | 2023-06-21 | 데쿠세리아루즈 가부시키가이샤 | 도전 재료 |
| US10307513B2 (en) | 2015-06-12 | 2019-06-04 | University of Pittsburgh—of the Commonwealth System of Higher Education | Biomimetic hydrogel scaffolds and related methods |
| CN108604480B (zh) * | 2016-02-10 | 2020-03-24 | 日立化成株式会社 | 导电粒子、绝缘被覆导电粒子、各向异性导电性粘接剂、连接结构体和导电粒子的制造方法 |
| JP6935702B2 (ja) * | 2016-10-24 | 2021-09-15 | デクセリアルズ株式会社 | 異方性導電フィルム |
| JP2018112578A (ja) * | 2017-01-06 | 2018-07-19 | 株式会社ジャパンディスプレイ | 表示装置 |
| KR102422589B1 (ko) * | 2017-01-27 | 2022-07-18 | 쇼와덴코머티리얼즈가부시끼가이샤 | 절연 피복 도전 입자, 이방 도전 필름, 이방 도전 필름의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법 |
| WO2018143501A1 (ko) * | 2017-02-06 | 2018-08-09 | 이경섭 | 미세피치용 이방성 도전 접착제 제조방법 및 이 방법에 의해 제조된 미세피치용 이방성 도전 접착제 |
| US20190100663A1 (en) * | 2017-10-03 | 2019-04-04 | Shin-Etsu Chemical Co., Ltd. | Anisotropic conductive film and method for manufacturing anisotropic conductive film |
| KR102536305B1 (ko) * | 2018-01-05 | 2023-05-24 | (주)포인트엔지니어링 | 마이크로 led 구조체 및 이의 제조방법 |
| CN109036171B (zh) * | 2018-07-10 | 2021-01-26 | 中航华东光电有限公司 | 液晶屏信号转接带密封方法 |
| WO2021187591A1 (ja) * | 2020-03-19 | 2021-09-23 | デクセリアルズ株式会社 | 接続体、及び接続体の製造方法 |
| US20250006687A1 (en) * | 2023-06-30 | 2025-01-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Heat dissipation in semiconductor devices |
| CN117425291B (zh) * | 2023-10-27 | 2024-05-03 | 浙江晶引电子科技有限公司 | 一种超薄柔性薄膜封装基板的高可靠性电气连接方法 |
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| JP5059312B2 (ja) * | 2005-09-16 | 2012-10-24 | Hoya株式会社 | 高分散性リン酸カルシウム系化合物ナノ粒子及びその製造方法 |
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| JP4780197B2 (ja) * | 2006-10-17 | 2011-09-28 | 日立化成工業株式会社 | 被覆粒子及びその製造方法、並びに、被覆粒子を用いた異方導電性接着剤組成物及び異方導電性接着剤フィルム |
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|---|---|---|---|---|
| JP2005209491A (ja) * | 2003-09-29 | 2005-08-04 | Sony Chem Corp | 導電粒子及びこれを用いた異方導電性接着剤 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015125778A1 (ja) * | 2014-02-24 | 2015-08-27 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
| JP5830196B1 (ja) * | 2014-02-24 | 2015-12-09 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
| CN105493201A (zh) * | 2014-02-24 | 2016-04-13 | 积水化学工业株式会社 | 导电糊剂、连接结构体及连接结构体的制造方法 |
| CN105493201B (zh) * | 2014-02-24 | 2018-12-07 | 积水化学工业株式会社 | 导电糊剂、连接结构体及连接结构体的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI352109B (enExample) | 2011-11-11 |
| EP2073316A4 (en) | 2010-07-21 |
| KR101063710B1 (ko) | 2011-09-07 |
| CN101517831B (zh) | 2010-11-17 |
| WO2008038565A1 (fr) | 2008-04-03 |
| TW200829677A (en) | 2008-07-16 |
| US20110121243A1 (en) | 2011-05-26 |
| KR20090075702A (ko) | 2009-07-08 |
| CN101517831A (zh) | 2009-08-26 |
| JPWO2008038565A1 (ja) | 2010-01-28 |
| US20100110652A1 (en) | 2010-05-06 |
| EP2073316A1 (en) | 2009-06-24 |
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