JP4628971B2 - 積層体およびその製造方法 - Google Patents

積層体およびその製造方法 Download PDF

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Publication number
JP4628971B2
JP4628971B2 JP2006049029A JP2006049029A JP4628971B2 JP 4628971 B2 JP4628971 B2 JP 4628971B2 JP 2006049029 A JP2006049029 A JP 2006049029A JP 2006049029 A JP2006049029 A JP 2006049029A JP 4628971 B2 JP4628971 B2 JP 4628971B2
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Prior art keywords
thin film
layer
metal thin
metal
heat treatment
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Expired - Fee Related
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Japanese (ja)
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JP2007223224A (ja
JP2007223224A5 (enrdf_load_stackoverflow
Inventor
睦弘 丸山
利典 柏木
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Asahi Kasei Corp
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Asahi Kasei E Materials Corp
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Publication of JP2007223224A5 publication Critical patent/JP2007223224A5/ja
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JP2006049029A 2006-02-24 2006-02-24 積層体およびその製造方法 Expired - Fee Related JP4628971B2 (ja)

Priority Applications (1)

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JP2006049029A JP4628971B2 (ja) 2006-02-24 2006-02-24 積層体およびその製造方法

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JP2006049029A JP4628971B2 (ja) 2006-02-24 2006-02-24 積層体およびその製造方法

Publications (3)

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JP2007223224A JP2007223224A (ja) 2007-09-06
JP2007223224A5 JP2007223224A5 (enrdf_load_stackoverflow) 2009-03-26
JP4628971B2 true JP4628971B2 (ja) 2011-02-09

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JP2006049029A Expired - Fee Related JP4628971B2 (ja) 2006-02-24 2006-02-24 積層体およびその製造方法

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JP (1) JP4628971B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009196249A (ja) * 2008-02-22 2009-09-03 Asahi Kasei E-Materials Corp 積層体および積層体の製造方法
JP7503987B2 (ja) 2019-12-23 2024-06-21 旭化成株式会社 導電性パターン付構造体の製造方法
WO2024038701A1 (ja) * 2022-08-17 2024-02-22 株式会社ダイセル 積層体および積層体の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3781118B2 (ja) * 2003-03-03 2006-05-31 セイコーエプソン株式会社 配線基板の製造方法
JP2005262598A (ja) * 2004-03-18 2005-09-29 Asahi Kasei Corp 積層体およびその製造方法

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JP2007223224A (ja) 2007-09-06

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