JP4622253B2 - 発光デバイス及びその製造方法 - Google Patents

発光デバイス及びその製造方法 Download PDF

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Publication number
JP4622253B2
JP4622253B2 JP2004014224A JP2004014224A JP4622253B2 JP 4622253 B2 JP4622253 B2 JP 4622253B2 JP 2004014224 A JP2004014224 A JP 2004014224A JP 2004014224 A JP2004014224 A JP 2004014224A JP 4622253 B2 JP4622253 B2 JP 4622253B2
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JP
Japan
Prior art keywords
light
light emitting
phosphor
emitting element
semiconductor
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Expired - Fee Related
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JP2004014224A
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English (en)
Japanese (ja)
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JP2005209852A5 (enExample
JP2005209852A (ja
Inventor
雅彦 佐野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2004014224A priority Critical patent/JP4622253B2/ja
Publication of JP2005209852A publication Critical patent/JP2005209852A/ja
Publication of JP2005209852A5 publication Critical patent/JP2005209852A5/ja
Application granted granted Critical
Publication of JP4622253B2 publication Critical patent/JP4622253B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Devices (AREA)
JP2004014224A 2004-01-22 2004-01-22 発光デバイス及びその製造方法 Expired - Fee Related JP4622253B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004014224A JP4622253B2 (ja) 2004-01-22 2004-01-22 発光デバイス及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004014224A JP4622253B2 (ja) 2004-01-22 2004-01-22 発光デバイス及びその製造方法

Publications (3)

Publication Number Publication Date
JP2005209852A JP2005209852A (ja) 2005-08-04
JP2005209852A5 JP2005209852A5 (enExample) 2007-02-22
JP4622253B2 true JP4622253B2 (ja) 2011-02-02

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Family Applications (1)

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JP2004014224A Expired - Fee Related JP4622253B2 (ja) 2004-01-22 2004-01-22 発光デバイス及びその製造方法

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JP (1) JP4622253B2 (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1777999B (zh) 2003-02-26 2010-05-26 美商克立股份有限公司 复合式白色光源及其制造方法
EP2270887B1 (en) 2003-04-30 2020-01-22 Cree, Inc. High powered light emitter packages with compact optics
JP4667803B2 (ja) * 2004-09-14 2011-04-13 日亜化学工業株式会社 発光装置
US7956372B2 (en) 2005-09-20 2011-06-07 Panasonic Electric Works Co., Ltd. Light emitting device
CN100583469C (zh) * 2005-09-20 2010-01-20 松下电工株式会社 发光装置
US20070075306A1 (en) * 2005-09-22 2007-04-05 Toyoda Gosei Co., Ltd. Light emitting device
JP5016808B2 (ja) * 2005-11-08 2012-09-05 ローム株式会社 窒化物半導体発光素子及び窒化物半導体発光素子製造方法
DE102006015117A1 (de) 2006-03-31 2007-10-04 Osram Opto Semiconductors Gmbh Optoelektronischer Scheinwerfer, Verfahren zum Herstellen eines optoelektronischen Scheinwerfers und Lumineszenzdiodenchip
JP4961827B2 (ja) * 2006-05-11 2012-06-27 日亜化学工業株式会社 発光装置及びその製造方法
JP5013905B2 (ja) * 2007-02-28 2012-08-29 スタンレー電気株式会社 半導体発光装置
JP5043554B2 (ja) * 2007-08-07 2012-10-10 スタンレー電気株式会社 半導体発光装置
US20100283074A1 (en) * 2007-10-08 2010-11-11 Kelley Tommie W Light emitting diode with bonded semiconductor wavelength converter
KR101585239B1 (ko) * 2007-10-25 2016-01-22 코닌클리케 필립스 엔.브이. 편광 광 방출 장치
JP5558665B2 (ja) * 2007-11-27 2014-07-23 パナソニック株式会社 発光装置
US9431589B2 (en) * 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
JP5521325B2 (ja) * 2008-12-27 2014-06-11 日亜化学工業株式会社 発光装置及びその製造方法
US8343575B2 (en) 2008-12-30 2013-01-01 Nanosys, Inc. Methods for encapsulating nanocrystals and resulting compositions
US11198270B2 (en) 2008-12-30 2021-12-14 Nanosys, Inc. Quantum dot films, lighting devices, and lighting methods
US10214686B2 (en) 2008-12-30 2019-02-26 Nanosys, Inc. Methods for encapsulating nanocrystals and resulting compositions
CN102257599A (zh) * 2008-12-30 2011-11-23 纳米系统公司 用于包封纳米晶体的方法及所得的复合物
JP2011071272A (ja) 2009-09-25 2011-04-07 Toshiba Corp 半導体発光装置及びその製造方法
JP4875185B2 (ja) 2010-06-07 2012-02-15 株式会社東芝 光半導体装置
KR101722623B1 (ko) * 2010-08-02 2017-04-03 엘지이노텍 주식회사 발광소자 및 발광소자 패키지
KR20130099912A (ko) 2010-08-26 2013-09-06 니폰 덴키 가라스 가부시키가이샤 파장 변환 소자, 광원 및 액정용 백라이트 유닛
CN203300702U (zh) * 2010-10-29 2013-11-20 东芝照明技术株式会社 发光模块以及照明设备
EP2638321B1 (en) 2010-11-10 2019-05-08 Nanosys, Inc. Quantum dot films, lighting devices, and lighting methods
JP5886105B2 (ja) * 2012-03-29 2016-03-16 スタンレー電気株式会社 発光ダイオード発光装置の製造方法
EP2927970B1 (en) * 2012-12-03 2017-08-30 Citizen Watch Co., Ltd. Led module
JP2014157989A (ja) 2013-02-18 2014-08-28 Toshiba Corp 半導体発光装置及びその製造方法
CN104241262B (zh) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 发光装置以及显示装置
CN103775866A (zh) * 2013-06-20 2014-05-07 苏州恒荣节能科技安装工程有限公司 一种led灯珠
JP6282438B2 (ja) 2013-10-18 2018-02-21 スタンレー電気株式会社 半導体発光装置
JP5834109B2 (ja) * 2014-05-14 2015-12-16 株式会社東芝 半導体発光装置、半導体発光装置の製造方法、発光装置の製造方法
KR102605585B1 (ko) 2016-08-11 2023-11-24 삼성전자주식회사 발광소자 패키지 제조방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4925512B2 (ja) * 2001-02-16 2012-04-25 スタンレー電気株式会社 波長変換型半導体素子
JP3991612B2 (ja) * 2001-04-09 2007-10-17 日亜化学工業株式会社 発光素子
JP4447806B2 (ja) * 2001-09-26 2010-04-07 スタンレー電気株式会社 発光装置

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