JP4589853B2 - 基板搬送システム及び基板搬送方法 - Google Patents

基板搬送システム及び基板搬送方法 Download PDF

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Publication number
JP4589853B2
JP4589853B2 JP2005276441A JP2005276441A JP4589853B2 JP 4589853 B2 JP4589853 B2 JP 4589853B2 JP 2005276441 A JP2005276441 A JP 2005276441A JP 2005276441 A JP2005276441 A JP 2005276441A JP 4589853 B2 JP4589853 B2 JP 4589853B2
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JP
Japan
Prior art keywords
substrate
transfer
wafer
transport
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005276441A
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English (en)
Japanese (ja)
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JP2007088286A (ja
JP2007088286A5 (https=
Inventor
俊彦 飯島
信也 清水
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2005276441A priority Critical patent/JP4589853B2/ja
Priority to KR1020060091636A priority patent/KR100800636B1/ko
Priority to US11/524,280 priority patent/US8121723B2/en
Publication of JP2007088286A publication Critical patent/JP2007088286A/ja
Publication of JP2007088286A5 publication Critical patent/JP2007088286A5/ja
Application granted granted Critical
Publication of JP4589853B2 publication Critical patent/JP4589853B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2005276441A 2005-09-22 2005-09-22 基板搬送システム及び基板搬送方法 Expired - Fee Related JP4589853B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005276441A JP4589853B2 (ja) 2005-09-22 2005-09-22 基板搬送システム及び基板搬送方法
KR1020060091636A KR100800636B1 (ko) 2005-09-22 2006-09-21 기판반송 시스템, 기판반송 장치 및 기억 매체
US11/524,280 US8121723B2 (en) 2005-09-22 2006-09-21 Substrate transfer system, substrate transfer apparatus and storage medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005276441A JP4589853B2 (ja) 2005-09-22 2005-09-22 基板搬送システム及び基板搬送方法

Publications (3)

Publication Number Publication Date
JP2007088286A JP2007088286A (ja) 2007-04-05
JP2007088286A5 JP2007088286A5 (https=) 2008-11-06
JP4589853B2 true JP4589853B2 (ja) 2010-12-01

Family

ID=37882801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005276441A Expired - Fee Related JP4589853B2 (ja) 2005-09-22 2005-09-22 基板搬送システム及び基板搬送方法

Country Status (3)

Country Link
US (1) US8121723B2 (https=)
JP (1) JP4589853B2 (https=)
KR (1) KR100800636B1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4313824B2 (ja) * 2007-03-23 2009-08-12 東京エレクトロン株式会社 基板移載装置及び基板移載方法並びに記憶媒体
JP4973675B2 (ja) * 2009-02-26 2012-07-11 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5384219B2 (ja) * 2009-06-19 2014-01-08 東京エレクトロン株式会社 検査装置におけるプリアライメント方法及びプリアライメント用プログラム
JP5436949B2 (ja) 2009-06-23 2014-03-05 東京エレクトロン株式会社 アダプタユニット内蔵型ローダ室
JP4949454B2 (ja) * 2009-11-17 2012-06-06 東京エレクトロン株式会社 プローブ装置
CN102116835B (zh) 2009-11-06 2014-12-03 东京毅力科创株式会社 探测装置以及衬底运送方法
US8802545B2 (en) * 2011-03-14 2014-08-12 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US20150200514A1 (en) * 2014-01-13 2015-07-16 United Microelectronics Corp. Method for calibrating a plurality of pincettes of a wafer conveyer
JP6869080B2 (ja) * 2017-03-31 2021-05-12 株式会社ダイヘン ロボット制御装置及び制御プログラム
CN111498401A (zh) * 2019-01-31 2020-08-07 泰科电子(上海)有限公司 部件输送装置和方法
KR102171686B1 (ko) 2019-03-04 2020-10-29 주식회사 에스에프에이 선반 클리닝장치 및 이를 구비하는 반송물 이적재 시스템
KR102153972B1 (ko) 2019-04-23 2020-09-09 주식회사 에스에프에이 이송물 분리 겸용 이송장치 및 그 방법
KR102171687B1 (ko) 2019-04-23 2020-10-29 주식회사 에스에프에이 이송물 매수확인 겸용 이송장치 및 그 방법
KR102179235B1 (ko) 2019-04-23 2020-11-16 주식회사 에스에프에이 이송물 이송장치 및 이송방법
KR102246006B1 (ko) 2019-05-10 2021-04-29 주식회사 에스에프에이 스마트 팩토리를 위한 이동 설비의 실시간 센싱 데이터 처리 시스템 및 그 방법
KR102246005B1 (ko) 2019-05-10 2021-04-29 주식회사 에스에프에이 스마트 팩토리를 위한 이동 설비의 실시간 센싱 데이터 처리 시스템 및 그 방법
KR102413317B1 (ko) 2020-10-22 2022-06-27 삼성디스플레이 주식회사 자동반송시스템의 제어방법
KR102430980B1 (ko) 2020-11-11 2022-08-09 삼성디스플레이 주식회사 자동반송시스템의 제어방법
KR102891245B1 (ko) 2022-12-28 2025-11-26 삼성디스플레이 주식회사 자동티칭이 가능한 반송시스템 및 방법
KR102827010B1 (ko) * 2023-09-25 2025-06-30 주식회사 쎄믹스 프로브 카드 핸들링 장치
KR20250058468A (ko) 2023-10-23 2025-04-30 주식회사 에스에프에이 자동티칭이 가능한 반송시스템 및 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2931820B2 (ja) * 1991-11-05 1999-08-09 東京エレクトロン株式会社 板状体の処理装置及び搬送装置
TW353777B (en) * 1996-11-08 1999-03-01 Tokyo Electron Ltd Treatment device
JPH11330197A (ja) 1998-05-15 1999-11-30 Hitachi Ltd 搬送制御方法とその装置
JP2001338968A (ja) * 2000-05-30 2001-12-07 Kaapu:Kk 半導体製造ライン
TW559855B (en) * 2000-09-06 2003-11-01 Olympus Optical Co Wafer transfer apparatus
JP4696373B2 (ja) * 2001-02-20 2011-06-08 東京エレクトロン株式会社 処理システム及び被処理体の搬送方法
JP2003197711A (ja) * 2001-12-27 2003-07-11 Tokyo Electron Ltd 被処理体の搬送システム及び被処理体の搬送方法
JP4234934B2 (ja) * 2002-02-15 2009-03-04 東京エレクトロン株式会社 無人搬送車システム
TWI256372B (en) 2001-12-27 2006-06-11 Tokyo Electron Ltd Carrier system of polishing processing body and conveying method of polishing processing body
JP4025069B2 (ja) * 2001-12-28 2007-12-19 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2004095626A (ja) * 2002-08-29 2004-03-25 Trecenti Technologies Inc 搬送方法
JP4450664B2 (ja) * 2003-06-02 2010-04-14 東京エレクトロン株式会社 基板処理装置及び基板搬送方法

Also Published As

Publication number Publication date
JP2007088286A (ja) 2007-04-05
US20070062446A1 (en) 2007-03-22
US8121723B2 (en) 2012-02-21
KR100800636B1 (ko) 2008-02-01
KR20070033908A (ko) 2007-03-27

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