JP4586020B2 - 銅被膜を電解で析出するための酸性水溶液と方法に加えて上記水溶液の使用 - Google Patents
銅被膜を電解で析出するための酸性水溶液と方法に加えて上記水溶液の使用 Download PDFInfo
- Publication number
- JP4586020B2 JP4586020B2 JP2006522934A JP2006522934A JP4586020B2 JP 4586020 B2 JP4586020 B2 JP 4586020B2 JP 2006522934 A JP2006522934 A JP 2006522934A JP 2006522934 A JP2006522934 A JP 2006522934A JP 4586020 B2 JP4586020 B2 JP 4586020B2
- Authority
- JP
- Japan
- Prior art keywords
- aqueous solution
- poly
- sub
- acid
- solution according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 50
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 50
- 239000010949 copper Substances 0.000 title claims abstract description 50
- 238000000151 deposition Methods 0.000 title claims abstract description 28
- 238000000576 coating method Methods 0.000 title claims abstract description 26
- 239000007864 aqueous solution Substances 0.000 title claims description 94
- 238000000034 method Methods 0.000 title claims description 18
- 230000002378 acidificating effect Effects 0.000 title claims description 8
- -1 aromatic halogen Chemical class 0.000 claims abstract description 50
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 239000000654 additive Substances 0.000 claims abstract description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 13
- 239000001301 oxygen Substances 0.000 claims abstract description 13
- 150000002367 halogens Chemical class 0.000 claims abstract description 11
- 229920003023 plastic Polymers 0.000 claims abstract description 11
- 239000004033 plastic Substances 0.000 claims abstract description 11
- 230000000996 additive effect Effects 0.000 claims abstract description 9
- 150000003464 sulfur compounds Chemical class 0.000 claims abstract description 9
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 7
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims abstract description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 4
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims abstract description 3
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims abstract description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 3
- 239000001257 hydrogen Substances 0.000 claims abstract description 3
- 239000011248 coating agent Substances 0.000 claims description 17
- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical class [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 10
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 10
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 9
- 150000003839 salts Chemical class 0.000 claims description 9
- 159000000000 sodium salts Chemical class 0.000 claims description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 8
- 150000001299 aldehydes Chemical class 0.000 claims description 8
- 229910017464 nitrogen compound Inorganic materials 0.000 claims description 7
- 150000002830 nitrogen compounds Chemical class 0.000 claims description 7
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- OSDLLIBGSJNGJE-UHFFFAOYSA-N 4-chloro-3,5-dimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1Cl OSDLLIBGSJNGJE-UHFFFAOYSA-N 0.000 claims description 5
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 5
- 238000005868 electrolysis reaction Methods 0.000 claims description 5
- 239000011780 sodium chloride Substances 0.000 claims description 5
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 claims description 4
- FIGPGTJKHFAYRK-UHFFFAOYSA-N 2,6-dibromo-4-methylphenol Chemical compound CC1=CC(Br)=C(O)C(Br)=C1 FIGPGTJKHFAYRK-UHFFFAOYSA-N 0.000 claims description 4
- CFKMVGJGLGKFKI-UHFFFAOYSA-N 4-chloro-m-cresol Chemical compound CC1=CC(O)=CC=C1Cl CFKMVGJGLGKFKI-UHFFFAOYSA-N 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 claims description 4
- 229920001521 polyalkylene glycol ether Polymers 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- 229920000151 polyglycol Polymers 0.000 claims description 4
- 239000010695 polyglycol Substances 0.000 claims description 4
- 229920001522 polyglycol ester Polymers 0.000 claims description 4
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 claims description 4
- FPYUJUBAXZAQNL-UHFFFAOYSA-N 2-chlorobenzaldehyde Chemical group ClC1=CC=CC=C1C=O FPYUJUBAXZAQNL-UHFFFAOYSA-N 0.000 claims description 3
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 claims description 3
- OBDVFOBWBHMJDG-UHFFFAOYSA-N 3-mercapto-1-propanesulfonic acid Chemical compound OS(=O)(=O)CCCS OBDVFOBWBHMJDG-UHFFFAOYSA-N 0.000 claims description 3
- IPCRBOOJBPETMF-UHFFFAOYSA-N N-acetylthiourea Chemical compound CC(=O)NC(N)=S IPCRBOOJBPETMF-UHFFFAOYSA-N 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- 150000001408 amides Chemical class 0.000 claims description 3
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 3
- CSPOBUGOIOVNRS-UHFFFAOYSA-M n,n-dimethyl-10-phenylphenazin-10-ium-2-amine;chloride Chemical compound [Cl-].C12=CC(N(C)C)=CC=C2N=C2C=CC=CC2=[N+]1C1=CC=CC=C1 CSPOBUGOIOVNRS-UHFFFAOYSA-M 0.000 claims description 3
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- MBYQPPXEXWRMQC-UHFFFAOYSA-N (2-chlorophenyl)methanol Chemical compound OCC1=CC=CC=C1Cl MBYQPPXEXWRMQC-UHFFFAOYSA-N 0.000 claims description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 2
- SPEUIVXLLWOEMJ-UHFFFAOYSA-N 1,1-dimethoxyethane Chemical group COC(C)OC SPEUIVXLLWOEMJ-UHFFFAOYSA-N 0.000 claims description 2
- OGYGFUAIIOPWQD-UHFFFAOYSA-N 1,3-thiazolidine Chemical compound C1CSCN1 OGYGFUAIIOPWQD-UHFFFAOYSA-N 0.000 claims description 2
- ZDOYHCIRUPHUHN-UHFFFAOYSA-N 1-(2-chlorophenyl)ethanone Chemical compound CC(=O)C1=CC=CC=C1Cl ZDOYHCIRUPHUHN-UHFFFAOYSA-N 0.000 claims description 2
- AURSMWWOMOVHBM-UHFFFAOYSA-N 2,3,6-trichlorobenzaldehyde Chemical compound ClC1=CC=C(Cl)C(C=O)=C1Cl AURSMWWOMOVHBM-UHFFFAOYSA-N 0.000 claims description 2
- LINPIYWFGCPVIE-UHFFFAOYSA-N 2,4,6-trichlorophenol Chemical compound OC1=C(Cl)C=C(Cl)C=C1Cl LINPIYWFGCPVIE-UHFFFAOYSA-N 0.000 claims description 2
- DBHODFSFBXJZNY-UHFFFAOYSA-N 2,4-dichlorobenzyl alcohol Chemical compound OCC1=CC=C(Cl)C=C1Cl DBHODFSFBXJZNY-UHFFFAOYSA-N 0.000 claims description 2
- SQQKOTVDGCJJKI-UHFFFAOYSA-N 2,5-dibromobenzoic acid Chemical compound OC(=O)C1=CC(Br)=CC=C1Br SQQKOTVDGCJJKI-UHFFFAOYSA-N 0.000 claims description 2
- RANCECPPZPIPNO-UHFFFAOYSA-N 2,5-dichlorophenol Chemical compound OC1=CC(Cl)=CC=C1Cl RANCECPPZPIPNO-UHFFFAOYSA-N 0.000 claims description 2
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 claims description 2
- PSOJLBXHRBFLLQ-UHFFFAOYSA-N 2-chloro-4,5-dimethylphenol Chemical compound CC1=CC(O)=C(Cl)C=C1C PSOJLBXHRBFLLQ-UHFFFAOYSA-N 0.000 claims description 2
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 claims description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 2
- ZLDMZIXUGCGKMB-UHFFFAOYSA-N 3,5-dibromobenzaldehyde Chemical compound BrC1=CC(Br)=CC(C=O)=C1 ZLDMZIXUGCGKMB-UHFFFAOYSA-N 0.000 claims description 2
- HYYIFRBLARMOSX-UHFFFAOYSA-N 3,7-dimethyl-10-phenylphenazin-10-ium-2-amine;sulfate Chemical compound [O-]S([O-])(=O)=O.C=12C=C(N)C(C)=CC2=NC2=CC(C)=CC=C2[N+]=1C1=CC=CC=C1.C=12C=C(N)C(C)=CC2=NC2=CC(C)=CC=C2[N+]=1C1=CC=CC=C1 HYYIFRBLARMOSX-UHFFFAOYSA-N 0.000 claims description 2
- LUENVHHLGFLMFJ-UHFFFAOYSA-N 4-[(4-sulfophenyl)disulfanyl]benzenesulfonic acid Chemical compound C1=CC(S(=O)(=O)O)=CC=C1SSC1=CC=C(S(O)(=O)=O)C=C1 LUENVHHLGFLMFJ-UHFFFAOYSA-N 0.000 claims description 2
- ZLVFYUORUHNMBO-UHFFFAOYSA-N 4-bromo-2,6-dimethylphenol Chemical compound CC1=CC(Br)=CC(C)=C1O ZLVFYUORUHNMBO-UHFFFAOYSA-N 0.000 claims description 2
- GZFGOTFRPZRKDS-UHFFFAOYSA-N 4-bromophenol Chemical compound OC1=CC=C(Br)C=C1 GZFGOTFRPZRKDS-UHFFFAOYSA-N 0.000 claims description 2
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 claims description 2
- BVPHXTUEZOQIBS-UHFFFAOYSA-N 6-methyl-1h-pyrimidine-2-thione Chemical compound CC1=CC=NC(S)=N1 BVPHXTUEZOQIBS-UHFFFAOYSA-N 0.000 claims description 2
- BBGFVQCCZUXILQ-UHFFFAOYSA-N 7-methyl-n,10-diphenylphenazin-10-ium-2-amine;sulfate Chemical compound [O-]S([O-])(=O)=O.C=12C=C(NC=3C=CC=CC=3)C=CC2=NC2=CC(C)=CC=C2[N+]=1C1=CC=CC=C1.C=12C=C(NC=3C=CC=CC=3)C=CC2=NC2=CC(C)=CC=C2[N+]=1C1=CC=CC=C1 BBGFVQCCZUXILQ-UHFFFAOYSA-N 0.000 claims description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 2
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 2
- 239000005977 Ethylene Substances 0.000 claims description 2
- PDQAZBWRQCGBEV-UHFFFAOYSA-N Ethylenethiourea Chemical compound S=C1NCCN1 PDQAZBWRQCGBEV-UHFFFAOYSA-N 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- GMEHFXXZSWDEDB-UHFFFAOYSA-N N-ethylthiourea Chemical compound CCNC(N)=S GMEHFXXZSWDEDB-UHFFFAOYSA-N 0.000 claims description 2
- 239000005642 Oleic acid Substances 0.000 claims description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 2
- 229920000463 Poly(ethylene glycol)-block-poly(propylene glycol)-block-poly(ethylene glycol) Polymers 0.000 claims description 2
- 229920000464 Poly(propylene glycol)-block-poly(ethylene glycol)-block-poly(propylene glycol) Polymers 0.000 claims description 2
- 229920002873 Polyethylenimine Polymers 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- 229910001413 alkali metal ion Inorganic materials 0.000 claims description 2
- 229910001420 alkaline earth metal ion Inorganic materials 0.000 claims description 2
- HTKFORQRBXIQHD-UHFFFAOYSA-N allylthiourea Chemical compound NC(=S)NCC=C HTKFORQRBXIQHD-UHFFFAOYSA-N 0.000 claims description 2
- 239000011575 calcium Substances 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 2
- 235000010948 carboxy methyl cellulose Nutrition 0.000 claims description 2
- 239000008112 carboxymethyl-cellulose Substances 0.000 claims description 2
- 229960004698 dichlorobenzyl alcohol Drugs 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 150000002431 hydrogen Chemical class 0.000 claims description 2
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 claims description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 claims description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- LNGQDLWAPLXXDF-UHFFFAOYSA-L n,n,1-trimethyl-10-phenylphenazin-10-ium-2-amine;sulfate Chemical compound [O-]S([O-])(=O)=O.C12=C(C)C(N(C)C)=CC=C2N=C2C=CC=CC2=[N+]1C1=CC=CC=C1.C12=C(C)C(N(C)C)=CC=C2N=C2C=CC=CC2=[N+]1C1=CC=CC=C1 LNGQDLWAPLXXDF-UHFFFAOYSA-L 0.000 claims description 2
- SPBDDPQYRLAFII-UHFFFAOYSA-M n,n,10-trimethylphenazin-10-ium-2-amine;acetate Chemical compound CC([O-])=O.C1=CC=CC2=[N+](C)C3=CC(N(C)C)=CC=C3N=C21 SPBDDPQYRLAFII-UHFFFAOYSA-M 0.000 claims description 2
- XQURAQQWHLZZJZ-UHFFFAOYSA-L n,n,7-trimethyl-10-phenylphenazin-10-ium-2-amine;sulfate Chemical compound [O-]S([O-])(=O)=O.C12=CC(N(C)C)=CC=C2N=C2C=C(C)C=CC2=[N+]1C1=CC=CC=C1.C12=CC(N(C)C)=CC=C2N=C2C=C(C)C=CC2=[N+]1C1=CC=CC=C1 XQURAQQWHLZZJZ-UHFFFAOYSA-L 0.000 claims description 2
- ZZJOPEPPFYWXML-UHFFFAOYSA-N n,n,7-trimethylphenazin-10-ium-2-amine;sulfate Chemical compound [O-]S([O-])(=O)=O.C1=C(C)C=CC2=[NH+]C3=CC(N(C)C)=CC=C3N=C21.C1=C(C)C=CC2=[NH+]C3=CC(N(C)C)=CC=C3N=C21 ZZJOPEPPFYWXML-UHFFFAOYSA-N 0.000 claims description 2
- SBBPEOBNLROXQG-UHFFFAOYSA-M n,n-diethyl-3,7-dimethyl-10-(4-methylphenyl)phenazin-10-ium-2-amine;chloride Chemical compound [Cl-].C12=CC=C(C)C=C2N=C2C=C(C)C(N(CC)CC)=CC2=[N+]1C1=CC=C(C)C=C1 SBBPEOBNLROXQG-UHFFFAOYSA-M 0.000 claims description 2
- JVEJNCHHJPQTPO-UHFFFAOYSA-M n,n-diethyl-7-methyl-10-phenylphenazin-10-ium-2-amine;chloride Chemical compound [Cl-].C12=CC(N(CC)CC)=CC=C2N=C2C=C(C)C=CC2=[N+]1C1=CC=CC=C1 JVEJNCHHJPQTPO-UHFFFAOYSA-M 0.000 claims description 2
- PTJZRLCLRPDVEY-UHFFFAOYSA-L n,n-dimethyl-3,7,10-triphenylphenazin-10-ium-2-amine;sulfate Chemical compound [O-]S([O-])(=O)=O.C12=CC=C(C=3C=CC=CC=3)C=C2N=C2C=C(C=3C=CC=CC=3)C(N(C)C)=CC2=[N+]1C1=CC=CC=C1.C12=CC=C(C=3C=CC=CC=3)C=C2N=C2C=C(C=3C=CC=CC=3)C(N(C)C)=CC2=[N+]1C1=CC=CC=C1 PTJZRLCLRPDVEY-UHFFFAOYSA-L 0.000 claims description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- IUOYQVWAOBUMLY-UHFFFAOYSA-N n-carbamothioyl-2,2,2-trifluoroacetamide Chemical compound NC(=S)NC(=O)C(F)(F)F IUOYQVWAOBUMLY-UHFFFAOYSA-N 0.000 claims description 2
- NLEQMBHQFHUCST-UHFFFAOYSA-N n-carbamothioyl-2-cyanoacetamide Chemical compound NC(=S)NC(=O)CC#N NLEQMBHQFHUCST-UHFFFAOYSA-N 0.000 claims description 2
- AQIPJGFHPAYIPJ-UHFFFAOYSA-N n-ethyl-7,10-diphenylphenazin-10-ium-2-amine;chloride Chemical compound [Cl-].C12=CC(NCC)=CC=C2N=C2C=C(C=3C=CC=CC=3)C=CC2=[N+]1C1=CC=CC=C1 AQIPJGFHPAYIPJ-UHFFFAOYSA-N 0.000 claims description 2
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 claims description 2
- URPCIIYTOGQWMA-UHFFFAOYSA-N n-methyl-10-phenylphenazin-10-ium-2-amine;acetate Chemical compound CC([O-])=O.C12=CC(NC)=CC=C2N=C2C=CC=CC2=[N+]1C1=CC=CC=C1 URPCIIYTOGQWMA-UHFFFAOYSA-N 0.000 claims description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- ACLZYRNSDLQOIA-UHFFFAOYSA-N o-tolylthiourea Chemical compound CC1=CC=CC=C1NC(N)=S ACLZYRNSDLQOIA-UHFFFAOYSA-N 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 2
- 229920000333 poly(propyleneimine) Polymers 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 claims description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N propylene glycol Substances CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 239000008117 stearic acid Substances 0.000 claims description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 2
- ZEMGGZBWXRYJHK-UHFFFAOYSA-N thiouracil Chemical compound O=C1C=CNC(=S)N1 ZEMGGZBWXRYJHK-UHFFFAOYSA-N 0.000 claims description 2
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 claims description 2
- 229920002125 Sokalan® Polymers 0.000 claims 1
- 125000001477 organic nitrogen group Chemical group 0.000 claims 1
- 239000004584 polyacrylic acid Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 125000004432 carbon atom Chemical group C* 0.000 abstract description 4
- 239000000243 solution Substances 0.000 abstract description 4
- 239000003929 acidic solution Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 1
- 230000008021 deposition Effects 0.000 description 14
- 239000010410 layer Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 229910000365 copper sulfate Inorganic materials 0.000 description 8
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 238000001556 precipitation Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000009499 grossing Methods 0.000 description 6
- 238000007373 indentation Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- AZUYLZMQTIKGSC-UHFFFAOYSA-N 1-[6-[4-(5-chloro-6-methyl-1H-indazol-4-yl)-5-methyl-3-(1-methylindazol-5-yl)pyrazol-1-yl]-2-azaspiro[3.3]heptan-2-yl]prop-2-en-1-one Chemical compound ClC=1C(=C2C=NNC2=CC=1C)C=1C(=NN(C=1C)C1CC2(CN(C2)C(C=C)=O)C1)C=1C=C2C=NN(C2=CC=1)C AZUYLZMQTIKGSC-UHFFFAOYSA-N 0.000 description 4
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000000080 wetting agent Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 239000008151 electrolyte solution Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920001515 polyalkylene glycol Polymers 0.000 description 3
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- SQHWUYVHKRVCMD-UHFFFAOYSA-N 2-n,2-n-dimethyl-10-phenylphenazin-10-ium-2,8-diamine;chloride Chemical class [Cl-].C12=CC(N(C)C)=CC=C2N=C2C=CC(N)=CC2=[N+]1C1=CC=CC=C1 SQHWUYVHKRVCMD-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000003172 aldehyde group Chemical group 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- ZMOMCILMBYEGLD-UHFFFAOYSA-N 2-chloro-4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C(Cl)=C1 ZMOMCILMBYEGLD-UHFFFAOYSA-N 0.000 description 1
- UGEJOEBBMPOJMT-UHFFFAOYSA-N 3-(trifluoromethyl)phenol Chemical compound OC1=CC=CC(C(F)(F)F)=C1 UGEJOEBBMPOJMT-UHFFFAOYSA-N 0.000 description 1
- JQVAPEJNIZULEK-UHFFFAOYSA-N 4-chlorobenzene-1,3-diol Chemical compound OC1=CC=C(Cl)C(O)=C1 JQVAPEJNIZULEK-UHFFFAOYSA-N 0.000 description 1
- MWXMWLZIZRDIBL-UHFFFAOYSA-N 5-phenyl-4a,10-dihydro-4h-phenazin-10-ium-2-amine;chloride Chemical compound [Cl-].C12=CC=CC=C2[NH2+]C2=CC(N)=CCC2N1C1=CC=CC=C1 MWXMWLZIZRDIBL-UHFFFAOYSA-N 0.000 description 1
- VZCCTDLWCKUBGD-UHFFFAOYSA-N 8-[[4-(dimethylamino)phenyl]diazenyl]-10-phenylphenazin-10-ium-2-amine;chloride Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1N=NC1=CC=C(N=C2C(C=C(N)C=C2)=[N+]2C=3C=CC=CC=3)C2=C1 VZCCTDLWCKUBGD-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 125000002853 C1-C4 hydroxyalkyl group Chemical group 0.000 description 1
- 239000004375 Dextrin Substances 0.000 description 1
- 229920001353 Dextrin Polymers 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- KCXMKQUNVWSEMD-UHFFFAOYSA-N benzyl chloride Chemical compound ClCC1=CC=CC=C1 KCXMKQUNVWSEMD-UHFFFAOYSA-N 0.000 description 1
- 229940073608 benzyl chloride Drugs 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 235000010980 cellulose Nutrition 0.000 description 1
- 238000002484 cyclic voltammetry Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- LRMHFDNWKCSEQU-UHFFFAOYSA-N ethoxyethane;phenol Chemical compound CCOCC.OC1=CC=CC=C1 LRMHFDNWKCSEQU-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 150000002440 hydroxy compounds Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000013379 molasses Nutrition 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229940031826 phenolate Drugs 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical class N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Paints Or Removers (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10337669A DE10337669B4 (de) | 2003-08-08 | 2003-08-08 | Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung |
| PCT/EP2004/008492 WO2005014891A2 (en) | 2003-08-08 | 2004-07-28 | Aqueous, acidic solution and method for electrolytically depositing copper coatings as well as use of said solution |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007501899A JP2007501899A (ja) | 2007-02-01 |
| JP2007501899A5 JP2007501899A5 (https=) | 2007-08-09 |
| JP4586020B2 true JP4586020B2 (ja) | 2010-11-24 |
Family
ID=34112129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006522934A Expired - Fee Related JP4586020B2 (ja) | 2003-08-08 | 2004-07-28 | 銅被膜を電解で析出するための酸性水溶液と方法に加えて上記水溶液の使用 |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US20080142370A1 (https=) |
| EP (1) | EP1651801B1 (https=) |
| JP (1) | JP4586020B2 (https=) |
| KR (1) | KR101105938B1 (https=) |
| CN (1) | CN1833054B (https=) |
| AT (1) | ATE384808T1 (https=) |
| BR (1) | BRPI0413376A (https=) |
| CA (1) | CA2532445C (https=) |
| DE (2) | DE10337669B4 (https=) |
| ES (1) | ES2298799T3 (https=) |
| MX (1) | MXPA06001555A (https=) |
| MY (1) | MY138397A (https=) |
| TW (1) | TW200512318A (https=) |
| WO (1) | WO2005014891A2 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4750486B2 (ja) * | 2005-07-06 | 2011-08-17 | 株式会社Adeka | 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法 |
| EP2113587B9 (de) * | 2008-04-28 | 2011-09-07 | ATOTECH Deutschland GmbH | Wässriges saures Bad und Verfahren zum elektrolytischen Abschneiden von Kupfer |
| US8262894B2 (en) * | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
| CN101899687A (zh) * | 2010-08-03 | 2010-12-01 | 济南德锡科技有限公司 | 单剂染料型光亮酸性镀铜添加剂及其制备方法和应用 |
| EP2465976B1 (en) | 2010-12-15 | 2013-04-03 | Rohm and Haas Electronic Materials LLC | Method of electroplating uniform copper layer on the edge and walls of though holes of a substrate. |
| CN103834972B (zh) * | 2014-02-10 | 2017-01-18 | 东莞华威铜箔科技有限公司 | 4微米无载体电解铜箔用添加剂、制备方法及其应用 |
| CN110295382B (zh) * | 2019-03-22 | 2021-07-13 | 苏州昕皓新材料科技有限公司 | 酸铜整平剂及其应用、铜电镀溶液及其制备方法 |
| CN110541179B (zh) * | 2019-09-23 | 2020-07-21 | 深圳市创智成功科技有限公司 | 用于晶圆级封装超级tsv铜互连材料的电镀铜溶液及电镀方法 |
| CN110846694B (zh) * | 2019-12-31 | 2020-12-08 | 天长市飞龙金属制品有限公司 | 一种镀锌液 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL291575A (https=) * | 1962-04-16 | |||
| DE1246347B (de) * | 1966-03-08 | 1967-08-03 | Schering Ag | Saures galvanisches Kupferbad |
| DE2028803C3 (de) * | 1970-06-06 | 1980-08-14 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Polymere Phenazoniumverbindungen |
| FR2096936A1 (en) * | 1970-07-17 | 1972-03-03 | Labolac | Tin plating bath additive - 2,4,6-substd phenol for strong bright dep |
| JPS4916176B1 (https=) * | 1970-11-16 | 1974-04-20 | ||
| US4000047A (en) * | 1972-11-17 | 1976-12-28 | Lea-Ronal, Inc. | Electrodeposition of tin, lead and tin-lead alloys |
| AU496780B2 (en) * | 1975-03-11 | 1978-10-26 | Oxy Metal Industries Corporation | Additives in baths forthe electrodeposition of copper |
| DE2746938C2 (de) * | 1977-10-17 | 1987-04-09 | Schering AG, 1000 Berlin und 4709 Bergkamen | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades |
| US4417956A (en) * | 1980-07-17 | 1983-11-29 | Electrochemical Products, Inc. | Alkaline plating baths and electroplating process |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| FR2510145B1 (fr) * | 1981-07-24 | 1986-02-07 | Rhone Poulenc Spec Chim | Additif pour bain de cuivrage electrolytique acide, son procede de preparation et son application au cuivrage des circuits imprimes |
| WO1984001393A1 (en) * | 1982-09-30 | 1984-04-12 | Learonal Inc | Electrolytic copper plating solutions |
| AU554236B2 (en) * | 1983-06-10 | 1986-08-14 | Omi International Corp. | Electrolyte composition and process for electrodepositing copper |
| US4601847A (en) * | 1983-08-22 | 1986-07-22 | Macdermid, Incorporated | Composition for use in electroplating of metals |
| DE4032864A1 (de) * | 1990-10-13 | 1992-04-16 | Schering Ag | Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination |
| JPH07316876A (ja) * | 1994-05-23 | 1995-12-05 | C Uyemura & Co Ltd | 電気銅めっき用添加剤及び電気銅めっき浴 |
| CA2320278C (en) * | 1998-02-12 | 2006-01-03 | Acm Research, Inc. | Plating apparatus and method |
| TW577938B (en) * | 1998-11-05 | 2004-03-01 | Uyemura C & Co Ltd | Tin-copper alloy electroplating bath and plating process therewith |
| US6911068B2 (en) * | 2001-10-02 | 2005-06-28 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| US6652731B2 (en) * | 2001-10-02 | 2003-11-25 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| US6773573B2 (en) * | 2001-10-02 | 2004-08-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| US6736954B2 (en) * | 2001-10-02 | 2004-05-18 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
-
2003
- 2003-08-08 DE DE10337669A patent/DE10337669B4/de not_active Expired - Fee Related
-
2004
- 2004-07-28 KR KR1020067002737A patent/KR101105938B1/ko not_active Expired - Fee Related
- 2004-07-28 AT AT04763597T patent/ATE384808T1/de active
- 2004-07-28 CN CN200480022211XA patent/CN1833054B/zh not_active Expired - Fee Related
- 2004-07-28 JP JP2006522934A patent/JP4586020B2/ja not_active Expired - Fee Related
- 2004-07-28 ES ES04763597T patent/ES2298799T3/es not_active Expired - Lifetime
- 2004-07-28 WO PCT/EP2004/008492 patent/WO2005014891A2/en not_active Ceased
- 2004-07-28 CA CA2532445A patent/CA2532445C/en not_active Expired - Fee Related
- 2004-07-28 DE DE602004011520T patent/DE602004011520T2/de not_active Expired - Lifetime
- 2004-07-28 BR BRPI0413376-5A patent/BRPI0413376A/pt not_active Application Discontinuation
- 2004-07-28 EP EP04763597A patent/EP1651801B1/en not_active Expired - Lifetime
- 2004-07-28 MX MXPA06001555A patent/MXPA06001555A/es active IP Right Grant
- 2004-07-28 US US10/566,913 patent/US20080142370A1/en not_active Abandoned
- 2004-08-05 TW TW093123517A patent/TW200512318A/zh unknown
- 2004-08-06 MY MYPI20043199A patent/MY138397A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN1833054A (zh) | 2006-09-13 |
| DE602004011520D1 (de) | 2008-03-13 |
| EP1651801B1 (en) | 2008-01-23 |
| MXPA06001555A (es) | 2006-05-15 |
| ES2298799T3 (es) | 2008-05-16 |
| CA2532445A1 (en) | 2005-02-17 |
| CA2532445C (en) | 2012-03-13 |
| EP1651801A2 (en) | 2006-05-03 |
| WO2005014891A3 (en) | 2005-05-26 |
| MY138397A (en) | 2009-05-29 |
| KR20060058109A (ko) | 2006-05-29 |
| US20080142370A1 (en) | 2008-06-19 |
| KR101105938B1 (ko) | 2012-01-18 |
| DE602004011520T2 (de) | 2009-02-05 |
| DE10337669B4 (de) | 2006-04-27 |
| BRPI0413376A (pt) | 2006-10-17 |
| CN1833054B (zh) | 2011-09-07 |
| JP2007501899A (ja) | 2007-02-01 |
| DE10337669A1 (de) | 2005-03-03 |
| ATE384808T1 (de) | 2008-02-15 |
| TW200512318A (en) | 2005-04-01 |
| WO2005014891A2 (en) | 2005-02-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2859326B2 (ja) | 光沢があり、亀裂を有さない銅被膜を電気的に析出させる酸性水浴及び印刷回路の導電路補強法 | |
| JP5380113B2 (ja) | 基体上に金属層を堆積させるためのメッキ浴および方法 | |
| JPH06228785A (ja) | 酸性銅電気めっき浴の機能的液体添加剤 | |
| JP2000500529A (ja) | 金属層の電解析出のための方法 | |
| JP6836016B2 (ja) | 電解銅析出用のめっき組成物、その使用、および基材の少なくとも１つの表面上に銅層または銅合金層を電解析出させる方法 | |
| GB2242200A (en) | Plating compositions and processes | |
| JPS6056085A (ja) | 亜鉛／鉄合金めつき浴及び方法 | |
| JP4586020B2 (ja) | 銅被膜を電解で析出するための酸性水溶液と方法に加えて上記水溶液の使用 | |
| JP5103372B2 (ja) | ポリビニルアンモニウム化合物、ポリビニルアンモニウム化合物の製造方法、ポリビニルアンモニウム化合物を含有する酸性溶液及び銅めっきを電気分解的に析出する方法 | |
| US20040074775A1 (en) | Pulse reverse electrolysis of acidic copper electroplating solutions | |
| US11174566B2 (en) | Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating | |
| US20090223827A1 (en) | Pulse Reverse Electrolysis of Acidic Copper Electroplating Solutions | |
| JP2006316328A (ja) | ２層フレキシブル銅張積層板の製造方法 | |
| EP1341951B1 (en) | Copper bath and method of depositing a matt copper coating | |
| JP4672309B2 (ja) | 鋳鉄へのアルカリ性亜鉛系めっき方法 | |
| WO2010101212A1 (ja) | 銅－亜鉛合金電気めっき浴およびこれを用いためっき方法 | |
| JPH07207487A (ja) | 電気鉄めっき液 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070605 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070605 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20091019 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100420 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20100716 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20100726 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100730 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100824 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100906 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4586020 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130910 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |