JP4578582B2 - 複合スパッタリングカソードを有するスパッタリング装置 - Google Patents
複合スパッタリングカソードを有するスパッタリング装置 Download PDFInfo
- Publication number
- JP4578582B2 JP4578582B2 JP27528397A JP27528397A JP4578582B2 JP 4578582 B2 JP4578582 B2 JP 4578582B2 JP 27528397 A JP27528397 A JP 27528397A JP 27528397 A JP27528397 A JP 27528397A JP 4578582 B2 JP4578582 B2 JP 4578582B2
- Authority
- JP
- Japan
- Prior art keywords
- sputtering
- target
- substrate
- cathode
- sputtering apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004544 sputter deposition Methods 0.000 title claims description 142
- 239000002131 composite material Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 claims description 104
- 239000002245 particle Substances 0.000 claims description 27
- 239000010409 thin film Substances 0.000 claims description 23
- 238000005477 sputtering target Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011553 magnetic fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
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- Physical Vapour Deposition (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27528397A JP4578582B2 (ja) | 1997-05-14 | 1997-09-22 | 複合スパッタリングカソードを有するスパッタリング装置 |
| EP97117978A EP0837491A3 (en) | 1996-10-21 | 1997-10-16 | Composite sputtering cathode assembly and sputtering apparatus with such composite sputtering cathode assembly |
| KR1019970053816A KR100531991B1 (ko) | 1996-10-21 | 1997-10-20 | 스퍼터링 장치 |
| US08/954,207 US6290826B1 (en) | 1996-10-21 | 1997-10-20 | Composite sputtering cathode assembly and sputtering apparatus with such composite sputtering cathode assembly |
| TW086115549A TW424113B (en) | 1996-10-21 | 1997-10-21 | Comopsite sputtering cathode assembly and sputtering apparatus with such composite sputtering cathode assembly |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9-139237 | 1997-05-14 | ||
| JP13923797 | 1997-05-14 | ||
| JP27528397A JP4578582B2 (ja) | 1997-05-14 | 1997-09-22 | 複合スパッタリングカソードを有するスパッタリング装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH1129859A JPH1129859A (ja) | 1999-02-02 |
| JPH1129859A5 JPH1129859A5 (enExample) | 2005-03-03 |
| JP4578582B2 true JP4578582B2 (ja) | 2010-11-10 |
Family
ID=26472108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27528397A Expired - Fee Related JP4578582B2 (ja) | 1996-10-21 | 1997-09-22 | 複合スパッタリングカソードを有するスパッタリング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4578582B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4516199B2 (ja) * | 2000-09-13 | 2010-08-04 | キヤノンアネルバ株式会社 | スパッタ装置及び電子デバイス製造方法 |
| JP2003073825A (ja) * | 2001-08-30 | 2003-03-12 | Anelva Corp | 薄膜作成装置 |
| JP4733990B2 (ja) * | 2005-02-01 | 2011-07-27 | 株式会社昭和真空 | スパッタ装置 |
-
1997
- 1997-09-22 JP JP27528397A patent/JP4578582B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1129859A (ja) | 1999-02-02 |
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