JPH1129859A5 - - Google Patents

Info

Publication number
JPH1129859A5
JPH1129859A5 JP1997275283A JP27528397A JPH1129859A5 JP H1129859 A5 JPH1129859 A5 JP H1129859A5 JP 1997275283 A JP1997275283 A JP 1997275283A JP 27528397 A JP27528397 A JP 27528397A JP H1129859 A5 JPH1129859 A5 JP H1129859A5
Authority
JP
Japan
Prior art keywords
sputtering
substrate
rotate
cathodes
sputtering cathodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997275283A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1129859A (ja
JP4578582B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP27528397A external-priority patent/JP4578582B2/ja
Priority to JP27528397A priority Critical patent/JP4578582B2/ja
Priority to EP97117978A priority patent/EP0837491A3/en
Priority to KR1019970053816A priority patent/KR100531991B1/ko
Priority to US08/954,207 priority patent/US6290826B1/en
Priority to TW086115549A priority patent/TW424113B/zh
Publication of JPH1129859A publication Critical patent/JPH1129859A/ja
Publication of JPH1129859A5 publication Critical patent/JPH1129859A5/ja
Publication of JP4578582B2 publication Critical patent/JP4578582B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP27528397A 1996-10-21 1997-09-22 複合スパッタリングカソードを有するスパッタリング装置 Expired - Fee Related JP4578582B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP27528397A JP4578582B2 (ja) 1997-05-14 1997-09-22 複合スパッタリングカソードを有するスパッタリング装置
EP97117978A EP0837491A3 (en) 1996-10-21 1997-10-16 Composite sputtering cathode assembly and sputtering apparatus with such composite sputtering cathode assembly
KR1019970053816A KR100531991B1 (ko) 1996-10-21 1997-10-20 스퍼터링 장치
US08/954,207 US6290826B1 (en) 1996-10-21 1997-10-20 Composite sputtering cathode assembly and sputtering apparatus with such composite sputtering cathode assembly
TW086115549A TW424113B (en) 1996-10-21 1997-10-21 Comopsite sputtering cathode assembly and sputtering apparatus with such composite sputtering cathode assembly

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9-139237 1997-05-14
JP13923797 1997-05-14
JP27528397A JP4578582B2 (ja) 1997-05-14 1997-09-22 複合スパッタリングカソードを有するスパッタリング装置

Publications (3)

Publication Number Publication Date
JPH1129859A JPH1129859A (ja) 1999-02-02
JPH1129859A5 true JPH1129859A5 (enExample) 2005-03-03
JP4578582B2 JP4578582B2 (ja) 2010-11-10

Family

ID=26472108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27528397A Expired - Fee Related JP4578582B2 (ja) 1996-10-21 1997-09-22 複合スパッタリングカソードを有するスパッタリング装置

Country Status (1)

Country Link
JP (1) JP4578582B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4516199B2 (ja) * 2000-09-13 2010-08-04 キヤノンアネルバ株式会社 スパッタ装置及び電子デバイス製造方法
JP2003073825A (ja) * 2001-08-30 2003-03-12 Anelva Corp 薄膜作成装置
JP4733990B2 (ja) * 2005-02-01 2011-07-27 株式会社昭和真空 スパッタ装置

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