JP4573863B2 - 窒化物系半導体素子の製造方法 - Google Patents
窒化物系半導体素子の製造方法 Download PDFInfo
- Publication number
- JP4573863B2 JP4573863B2 JP2007283225A JP2007283225A JP4573863B2 JP 4573863 B2 JP4573863 B2 JP 4573863B2 JP 2007283225 A JP2007283225 A JP 2007283225A JP 2007283225 A JP2007283225 A JP 2007283225A JP 4573863 B2 JP4573863 B2 JP 4573863B2
- Authority
- JP
- Japan
- Prior art keywords
- nitride
- semiconductor laser
- optical waveguide
- based semiconductor
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Semiconductor Lasers (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007283225A JP4573863B2 (ja) | 2006-11-30 | 2007-10-31 | 窒化物系半導体素子の製造方法 |
| US11/948,058 US20080130698A1 (en) | 2006-11-30 | 2007-11-30 | Nitride-based semiconductor device and method of fabricating the same |
| US13/193,431 US20110281382A1 (en) | 2006-11-30 | 2011-07-28 | Nitride-based semiconductor device and method of fabricating the same |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006323582 | 2006-11-30 | ||
| JP2007283225A JP4573863B2 (ja) | 2006-11-30 | 2007-10-31 | 窒化物系半導体素子の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008260179A Division JP2009004820A (ja) | 2006-11-30 | 2008-10-06 | 窒化物系半導体素子およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008160070A JP2008160070A (ja) | 2008-07-10 |
| JP4573863B2 true JP4573863B2 (ja) | 2010-11-04 |
Family
ID=39517443
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007283225A Expired - Fee Related JP4573863B2 (ja) | 2006-11-30 | 2007-10-31 | 窒化物系半導体素子の製造方法 |
| JP2008260179A Pending JP2009004820A (ja) | 2006-11-30 | 2008-10-06 | 窒化物系半導体素子およびその製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008260179A Pending JP2009004820A (ja) | 2006-11-30 | 2008-10-06 | 窒化物系半導体素子およびその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (2) | JP4573863B2 (enExample) |
| CN (1) | CN101202421A (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010045076A (ja) * | 2008-08-08 | 2010-02-25 | Sanyo Electric Co Ltd | 発光素子の形成方法 |
| JP5670040B2 (ja) * | 2009-10-09 | 2015-02-18 | 住友電気工業株式会社 | Iii族窒化物半導体レーザ素子 |
| JP5625355B2 (ja) * | 2010-01-07 | 2014-11-19 | 住友電気工業株式会社 | Iii族窒化物半導体レーザ素子、iii族窒化物半導体レーザ素子を作製する方法 |
| JP5961989B2 (ja) * | 2011-12-02 | 2016-08-03 | 日亜化学工業株式会社 | 半導体レーザ素子及びその製造方法 |
| US8867582B2 (en) | 2012-04-04 | 2014-10-21 | Osram Opto Semiconductors Gmbh | Laser diode assembly |
| DE102012102306B4 (de) * | 2012-03-19 | 2021-05-12 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Laserdiodenvorrichtung |
| DE102012103160A1 (de) | 2012-04-12 | 2013-10-17 | Osram Opto Semiconductors Gmbh | Laserdiodenvorrichtung |
| CN108305918B (zh) * | 2017-01-12 | 2019-07-16 | 中国科学院苏州纳米技术与纳米仿生研究所 | 氮化物半导体发光器件及其制作方法 |
| DE102017117135A1 (de) | 2017-07-28 | 2019-01-31 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Mehrzahl von Laserdioden und Laserdiode |
| CN113131331A (zh) * | 2019-12-31 | 2021-07-16 | 华星光通科技股份有限公司 | 不连续脊状结构的半导体激光元件的制造方法 |
| WO2021251191A1 (ja) * | 2020-06-12 | 2021-12-16 | 日亜化学工業株式会社 | レーザダイオード素子及びその製造方法 |
| JP2022044464A (ja) * | 2020-09-07 | 2022-03-17 | ソニーグループ株式会社 | 半導体レーザおよび半導体レーザ装置 |
| JP2023111096A (ja) * | 2022-01-31 | 2023-08-10 | ヌヴォトンテクノロジージャパン株式会社 | 半導体レーザ素子及び半導体レーザ素子の製造方法 |
| CN115832870B (zh) * | 2022-11-09 | 2025-05-30 | 中国科学院半导体研究所 | 半导体激光器 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60123086A (ja) * | 1983-12-08 | 1985-07-01 | Nec Corp | 半導体レ−ザの製造方法 |
| JPS60144985A (ja) * | 1983-12-30 | 1985-07-31 | Fujitsu Ltd | 半導体発光素子の製造方法 |
| JPS62190892A (ja) * | 1986-02-18 | 1987-08-21 | Matsushita Electric Ind Co Ltd | 半導体レ−ザ装置の製造方法 |
| JPH01280388A (ja) * | 1988-05-06 | 1989-11-10 | Sharp Corp | 半導体素子の製造方法 |
| US5629233A (en) * | 1996-04-04 | 1997-05-13 | Lucent Technologies Inc. | Method of making III/V semiconductor lasers |
| JP4169821B2 (ja) * | 1998-02-18 | 2008-10-22 | シャープ株式会社 | 発光ダイオード |
| EP0977276A1 (en) * | 1998-07-08 | 2000-02-02 | Hewlett-Packard Company | Semiconductor device cleave initiation |
| JP2002190635A (ja) * | 2000-12-20 | 2002-07-05 | Sharp Corp | 半導体レーザ素子およびその製造方法 |
| JP4703014B2 (ja) * | 2001-02-15 | 2011-06-15 | シャープ株式会社 | 窒化物半導体発光素子、光学装置、および半導体発光装置とその製造方法 |
| JP2003069152A (ja) * | 2001-06-15 | 2003-03-07 | Sony Corp | マルチビーム半導体レーザ素子 |
| JP2003017791A (ja) * | 2001-07-03 | 2003-01-17 | Sharp Corp | 窒化物半導体素子及びこの窒化物半導体素子の製造方法 |
| JP4518733B2 (ja) * | 2002-06-17 | 2010-08-04 | ソニー株式会社 | 窒化ガリウム系半導体レーザ素子の製造方法 |
| JP4385590B2 (ja) * | 2002-11-26 | 2009-12-16 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子及びその製造方法 |
| JP4539077B2 (ja) * | 2003-10-29 | 2010-09-08 | 日本電気株式会社 | 半導体素子の製造方法 |
| JP2006294975A (ja) * | 2005-04-13 | 2006-10-26 | Mitsubishi Electric Corp | 半導体レーザ |
-
2007
- 2007-10-31 JP JP2007283225A patent/JP4573863B2/ja not_active Expired - Fee Related
- 2007-11-30 CN CNA2007101861686A patent/CN101202421A/zh active Pending
-
2008
- 2008-10-06 JP JP2008260179A patent/JP2009004820A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009004820A (ja) | 2009-01-08 |
| JP2008160070A (ja) | 2008-07-10 |
| CN101202421A (zh) | 2008-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4573863B2 (ja) | 窒化物系半導体素子の製造方法 | |
| JP2009004820A5 (enExample) | ||
| JP4948307B2 (ja) | 半導体レーザ素子およびその製造方法 | |
| US7929587B2 (en) | Semiconductor laser diode element and method of manufacturing the same | |
| JP3822976B2 (ja) | 半導体装置およびその製造方法 | |
| JP5368957B2 (ja) | 半導体レーザチップの製造方法 | |
| US7098063B2 (en) | Semiconductor laser device and method of manufacturing the same | |
| US6711192B1 (en) | Nitride semiconductor laser and method of fabricating the same | |
| JP4671617B2 (ja) | 集積型半導体レーザ素子 | |
| JP2008252069A (ja) | 半導体レーザ素子の製造方法および半導体レーザ素子 | |
| KR20090080486A (ko) | 반도체 레이저 소자 및 그 제조 방법 | |
| US20110281382A1 (en) | Nitride-based semiconductor device and method of fabricating the same | |
| US9025633B2 (en) | Optical device, method of manufacturing the same, and laser module | |
| JP2009164233A (ja) | 窒化物半導体レーザ素子およびその製造方法 | |
| JP3659621B2 (ja) | 窒化物系半導体レーザ装置の製造方法 | |
| JP2009123939A (ja) | 窒化物系半導体素子およびその製造方法 | |
| US20110013659A1 (en) | Semiconductor laser device and method of manufacturing the same | |
| JP2010056105A (ja) | 半導体レーザ素子およびその製造方法 | |
| JP2008244121A (ja) | 窒化物半導体素子の製造方法 | |
| JP2007189075A (ja) | 半導体レーザ素子、半導体レーザ素子の実装構造、半導体レーザ素子の製造方法及び半導体レーザ素子の実装方法 | |
| WO2008047751A1 (en) | Nitride semiconductor laser device and its manufacturing method | |
| JP2009212179A (ja) | 半導体レーザ素子および半導体レーザ素子の製造方法 | |
| JP2007103460A (ja) | 半導体レーザ素子およびその製造方法 | |
| JP2007266575A (ja) | 半導体レーザ素子及び半導体レーザ装置 | |
| JP2010045076A (ja) | 発光素子の形成方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080522 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080805 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20081006 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090714 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090914 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100720 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100817 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130827 Year of fee payment: 3 |
|
| LAPS | Cancellation because of no payment of annual fees |