JP4572604B2 - 半導体発光素子及びそれを用いた発光装置 - Google Patents

半導体発光素子及びそれを用いた発光装置 Download PDF

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Publication number
JP4572604B2
JP4572604B2 JP2004195074A JP2004195074A JP4572604B2 JP 4572604 B2 JP4572604 B2 JP 4572604B2 JP 2004195074 A JP2004195074 A JP 2004195074A JP 2004195074 A JP2004195074 A JP 2004195074A JP 4572604 B2 JP4572604 B2 JP 4572604B2
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Prior art keywords
electrode
light emitting
layer
light
conductivity type
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Expired - Fee Related
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JP2004195074A
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Japanese (ja)
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JP2005039264A5 (enExample
JP2005039264A (ja
Inventor
大輔 三賀
善之 粟飯原
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Nichia Corp
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Nichia Corp
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Priority to JP2004195074A priority Critical patent/JP4572604B2/ja
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Publication of JP2005039264A5 publication Critical patent/JP2005039264A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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JP2004195074A 2003-06-30 2004-06-30 半導体発光素子及びそれを用いた発光装置 Expired - Fee Related JP4572604B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004195074A JP4572604B2 (ja) 2003-06-30 2004-06-30 半導体発光素子及びそれを用いた発光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003188121 2003-06-30
JP2004195074A JP4572604B2 (ja) 2003-06-30 2004-06-30 半導体発光素子及びそれを用いた発光装置

Publications (3)

Publication Number Publication Date
JP2005039264A JP2005039264A (ja) 2005-02-10
JP2005039264A5 JP2005039264A5 (enExample) 2007-07-19
JP4572604B2 true JP4572604B2 (ja) 2010-11-04

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JP2004195074A Expired - Fee Related JP4572604B2 (ja) 2003-06-30 2004-06-30 半導体発光素子及びそれを用いた発光装置

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JP (1) JP4572604B2 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006228855A (ja) * 2005-02-16 2006-08-31 Rohm Co Ltd 半導体発光素子およびその製法
JP2006237386A (ja) * 2005-02-25 2006-09-07 Sanyo Electric Co Ltd 窒化物系半導体発光ダイオード
JP4956902B2 (ja) * 2005-03-18 2012-06-20 三菱化学株式会社 ＧａＮ系発光ダイオードおよびそれを用いた発光装置
JP4787562B2 (ja) * 2005-07-29 2011-10-05 昭和電工株式会社 ｐｎ接合型発光ダイオード
JP4787561B2 (ja) * 2005-07-29 2011-10-05 昭和電工株式会社 ｐｎ接合型発光ダイオード
WO2007029859A1 (en) * 2005-09-08 2007-03-15 Showa Denko K.K. Electrode for semiconductor light emitting device
WO2007032520A1 (en) * 2005-09-13 2007-03-22 Showa Denko K.K. Light-emitting device
JP4918238B2 (ja) * 2005-09-13 2012-04-18 昭和電工株式会社 発光装置
JP4952884B2 (ja) 2006-01-24 2012-06-13 ソニー株式会社 半導体発光装置および半導体発光装置組立体
JP2007287851A (ja) * 2006-04-14 2007-11-01 Toyoda Gosei Co Ltd 光通信に用いる発光素子およびこれを用いた通信装置
JP5045001B2 (ja) * 2006-06-22 2012-10-10 日亜化学工業株式会社 半導体発光素子
JP5719496B2 (ja) * 2006-06-28 2015-05-20 日亜化学工業株式会社 半導体発光素子及び発光装置、及び半導体発光素子の製造方法
DE102007030129A1 (de) * 2007-06-29 2009-01-02 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente und optoelektronisches Bauelement
KR101518858B1 (ko) * 2008-12-03 2015-05-13 삼성전자주식회사 반도체 발광소자 및 그 제조방법
US8390021B2 (en) 2009-06-15 2013-03-05 Panasonic Corporation Semiconductor light-emitting device, light-emitting module, and illumination device
KR101081166B1 (ko) * 2009-09-23 2011-11-07 엘지이노텍 주식회사 발광소자, 발광소자의 제조방법 및 발광소자 패키지
US9324691B2 (en) 2009-10-20 2016-04-26 Epistar Corporation Optoelectronic device
JP5443286B2 (ja) 2009-12-24 2014-03-19 スタンレー電気株式会社 フェイスアップ型光半導体装置
TWI466284B (zh) * 2010-07-02 2014-12-21 晶元光電股份有限公司 光電元件
KR101740534B1 (ko) * 2010-08-09 2017-06-08 서울바이오시스 주식회사 전극 연장부를 갖는 발광 다이오드
WO2012057469A2 (ko) * 2010-10-25 2012-05-03 주식회사 세미콘라이트 반도체 발광소자
JP2012114329A (ja) * 2010-11-26 2012-06-14 Toshiba Corp 半導体発光素子及びその製造方法
JP2012186195A (ja) * 2011-03-03 2012-09-27 Toshiba Corp 半導体発光素子及びその製造方法
JP5433609B2 (ja) * 2011-03-03 2014-03-05 株式会社東芝 半導体発光素子及びその製造方法
JP5479391B2 (ja) 2011-03-08 2014-04-23 株式会社東芝 半導体発光素子及びその製造方法
JP5549629B2 (ja) * 2011-03-30 2014-07-16 サンケン電気株式会社 発光素子
JP5304855B2 (ja) * 2011-08-12 2013-10-02 三菱化学株式会社 ＧａＮ系発光ダイオードおよびそれを用いた発光装置
KR101883842B1 (ko) * 2011-12-26 2018-08-01 엘지이노텍 주식회사 발광소자 및 이를 포함하는 조명시스템
JP6307703B2 (ja) 2013-05-31 2018-04-11 パナソニックＩｐマネジメント株式会社 波長変換素子、波長変換素子を備えた発光装置、発光装置を備えた車両、および波長変換素子の製造方法
JP2015028984A (ja) 2013-07-30 2015-02-12 日亜化学工業株式会社 半導体発光素子
JP6149878B2 (ja) 2015-02-13 2017-06-21 日亜化学工業株式会社 発光素子
DE112016000731T5 (de) * 2015-02-13 2017-12-21 Seoul Viosys Co., Ltd. Lichtaussendeelement und leuchtdiode
KR102688853B1 (ko) 2018-07-18 2024-07-29 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자
KR102901121B1 (ko) 2020-12-17 2025-12-17 삼성전자주식회사 엘이디 칩 및 이를 포함하는 디스플레이 장치
JP7299515B2 (ja) * 2021-06-01 2023-06-28 日亜化学工業株式会社 発光素子

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4810746B2 (ja) * 2000-03-31 2011-11-09 豊田合成株式会社 Ｉｉｉ族窒化物系化合物半導体素子
JP3576963B2 (ja) * 2000-11-24 2004-10-13 三菱電線工業株式会社 半導体発光素子
TW541722B (en) * 2001-04-20 2003-07-11 Nichia Corp Light emitting device

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