JP4566667B2 - めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置 - Google Patents
めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置 Download PDFInfo
- Publication number
- JP4566667B2 JP4566667B2 JP2004271466A JP2004271466A JP4566667B2 JP 4566667 B2 JP4566667 B2 JP 4566667B2 JP 2004271466 A JP2004271466 A JP 2004271466A JP 2004271466 A JP2004271466 A JP 2004271466A JP 4566667 B2 JP4566667 B2 JP 4566667B2
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- plating
- fept
- mol
- ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/001—Magnets
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/858—Producing a magnetic layer by electro-plating or electroless plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
- H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
- H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
- H01F10/123—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys having a L10 crystallographic structure, e.g. [Co,Fe][Pt,Pd] thin films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/24—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids
- H01F41/26—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids using electric currents, e.g. electroplating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
- H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
- H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
- H01F10/14—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing iron or nickel
- H01F10/147—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing iron or nickel with lattice under strain, e.g. expanded by interstitial nitrogen
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Magnetic Record Carriers (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004271466A JP4566667B2 (ja) | 2004-01-16 | 2004-09-17 | めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置 |
| US10/566,949 US7641783B2 (en) | 2004-01-16 | 2005-01-14 | Plating solution, process for producing a structure with the plating solution, and apparatus employing the plating solution |
| PCT/JP2005/000732 WO2005068688A2 (en) | 2004-01-16 | 2005-01-14 | Plating solution, process for producing a structure with the plating solution, and apparatus employing the plating solution |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004009238 | 2004-01-16 | ||
| JP2004271466A JP4566667B2 (ja) | 2004-01-16 | 2004-09-17 | めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005226156A JP2005226156A (ja) | 2005-08-25 |
| JP2005226156A5 JP2005226156A5 (enExample) | 2007-11-01 |
| JP4566667B2 true JP4566667B2 (ja) | 2010-10-20 |
Family
ID=34797752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004271466A Expired - Fee Related JP4566667B2 (ja) | 2004-01-16 | 2004-09-17 | めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7641783B2 (enExample) |
| JP (1) | JP4566667B2 (enExample) |
| WO (1) | WO2005068688A2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7327540B2 (en) * | 2004-06-01 | 2008-02-05 | Headway Technologies, Inc. | Hard biased materials for recording head applications |
| JP2007154285A (ja) * | 2005-12-07 | 2007-06-21 | Electroplating Eng Of Japan Co | コバルト−白金合金磁性膜の製造方法 |
| JP4673735B2 (ja) * | 2005-12-09 | 2011-04-20 | 日立マクセル株式会社 | 磁気記録媒体及びその製造方法 |
| CH714243B1 (fr) * | 2006-10-03 | 2019-04-15 | Swatch Group Res & Dev Ltd | Procédé d'électroformage et pièce ou couche obtenue par ce procédé. |
| CH710184B1 (fr) | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques. |
| KR100947645B1 (ko) * | 2008-02-28 | 2010-03-12 | 창원대학교 산학협력단 | FePt 자성박막의 제조방법 |
| US9011706B2 (en) * | 2008-12-16 | 2015-04-21 | City University Of Hong Kong | Method of making foraminous microstructures |
| JP5334118B2 (ja) * | 2009-09-16 | 2013-11-06 | 国立大学法人信州大学 | Fe‐Pt合金めっき方法およびFe‐Pt合金めっき液 |
| EP2312021B1 (fr) * | 2009-10-15 | 2020-03-18 | The Swatch Group Research and Development Ltd. | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux toxiques |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL243931A (enExample) | 1958-10-01 | |||
| JPS52108341A (en) * | 1976-03-09 | 1977-09-10 | Kosaku Kk | Noble metal plating bath |
| GB8821005D0 (en) * | 1988-09-07 | 1988-10-05 | Johnson Matthey Plc | Improvements in plating |
| BR8805772A (pt) * | 1988-11-01 | 1990-06-12 | Metal Leve Sa | Processo de formacao de camada de deslizamento de mancal |
| JP3423440B2 (ja) * | 1994-09-17 | 2003-07-07 | 田中貴金属工業株式会社 | 白金−タングステン合金めっき浴 |
| US5435898A (en) * | 1994-10-25 | 1995-07-25 | Enthone-Omi Inc. | Alkaline zinc and zinc alloy electroplating baths and processes |
| JPH10212592A (ja) | 1997-01-28 | 1998-08-11 | Tanaka Kikinzoku Kogyo Kk | 白金合金メッキ浴 |
| JP3886082B2 (ja) | 1997-11-12 | 2007-02-28 | キヤノン株式会社 | ナノ構造体及びその製造方法 |
| JP2002180259A (ja) | 2000-12-12 | 2002-06-26 | Shipley Co Llc | めっき液における金属析出促進化合物および該化合物を含むめっき液 |
| JP3730518B2 (ja) * | 2001-01-19 | 2006-01-05 | 株式会社東芝 | 磁気記録媒体 |
| JP3693647B2 (ja) * | 2001-02-08 | 2005-09-07 | 日立マクセル株式会社 | 金属合金微粒子及びその製造方法 |
| JP3749845B2 (ja) * | 2001-09-14 | 2006-03-01 | 株式会社東芝 | 磁気記録媒体および磁気記録装置 |
| AU2003213353A1 (en) | 2002-03-15 | 2003-09-29 | Canon Kabushiki Kaisha | Porous material and process for producing the same |
| WO2003078685A1 (en) | 2002-03-15 | 2003-09-25 | Canon Kabushiki Kaisha | Functional device and method of manufacturing the device, vertical magnetic recording medium, magnetic recording and reproducing device, and information processing device |
| AU2003221365A1 (en) | 2002-03-15 | 2003-09-29 | Canon Kabushiki Kaisha | Porous material and process for producing the same |
| JP4035459B2 (ja) | 2002-03-15 | 2008-01-23 | キヤノン株式会社 | 酸化物多孔質体の製造方法 |
| JP2004323948A (ja) | 2003-04-28 | 2004-11-18 | Electroplating Eng Of Japan Co | 磁性膜形成用電析めっき浴及びそれを用いた電析めっき方法 |
| JP4865240B2 (ja) | 2004-03-23 | 2012-02-01 | キヤノン株式会社 | 構造体の製造方法、磁気記録媒体の製造方法、成型体の製造方法 |
-
2004
- 2004-09-17 JP JP2004271466A patent/JP4566667B2/ja not_active Expired - Fee Related
-
2005
- 2005-01-14 WO PCT/JP2005/000732 patent/WO2005068688A2/en not_active Ceased
- 2005-01-14 US US10/566,949 patent/US7641783B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2005068688A2 (en) | 2005-07-28 |
| JP2005226156A (ja) | 2005-08-25 |
| WO2005068688A3 (en) | 2006-03-02 |
| US20060254924A1 (en) | 2006-11-16 |
| US7641783B2 (en) | 2010-01-05 |
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