JP4559801B2 - ウエハチャック - Google Patents

ウエハチャック Download PDF

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Publication number
JP4559801B2
JP4559801B2 JP2004258955A JP2004258955A JP4559801B2 JP 4559801 B2 JP4559801 B2 JP 4559801B2 JP 2004258955 A JP2004258955 A JP 2004258955A JP 2004258955 A JP2004258955 A JP 2004258955A JP 4559801 B2 JP4559801 B2 JP 4559801B2
Authority
JP
Japan
Prior art keywords
locking
surface portion
pins
wafer
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004258955A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006073963A (ja
JP2006073963A5 (https=
Inventor
郁男 小笠原
儀保 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2004258955A priority Critical patent/JP4559801B2/ja
Priority to TW094121917A priority patent/TWI389242B/zh
Priority to CNB2005800298626A priority patent/CN100477143C/zh
Priority to KR1020077005337A priority patent/KR100854801B1/ko
Priority to PCT/JP2005/016234 priority patent/WO2006028040A1/ja
Publication of JP2006073963A publication Critical patent/JP2006073963A/ja
Priority to US11/682,703 priority patent/US7411384B2/en
Publication of JP2006073963A5 publication Critical patent/JP2006073963A5/ja
Application granted granted Critical
Publication of JP4559801B2 publication Critical patent/JP4559801B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2004258955A 2004-09-06 2004-09-06 ウエハチャック Expired - Lifetime JP4559801B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2004258955A JP4559801B2 (ja) 2004-09-06 2004-09-06 ウエハチャック
TW094121917A TWI389242B (zh) 2004-09-06 2005-06-29 Wafer sucker
KR1020077005337A KR100854801B1 (ko) 2004-09-06 2005-09-05 웨이퍼척
PCT/JP2005/016234 WO2006028040A1 (ja) 2004-09-06 2005-09-05 ウエハチャック
CNB2005800298626A CN100477143C (zh) 2004-09-06 2005-09-05 晶片夹具
US11/682,703 US7411384B2 (en) 2004-09-06 2007-03-06 Wafer chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004258955A JP4559801B2 (ja) 2004-09-06 2004-09-06 ウエハチャック

Publications (3)

Publication Number Publication Date
JP2006073963A JP2006073963A (ja) 2006-03-16
JP2006073963A5 JP2006073963A5 (https=) 2007-11-01
JP4559801B2 true JP4559801B2 (ja) 2010-10-13

Family

ID=36036321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004258955A Expired - Lifetime JP4559801B2 (ja) 2004-09-06 2004-09-06 ウエハチャック

Country Status (6)

Country Link
US (1) US7411384B2 (https=)
JP (1) JP4559801B2 (https=)
KR (1) KR100854801B1 (https=)
CN (1) CN100477143C (https=)
TW (1) TWI389242B (https=)
WO (1) WO2006028040A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2014787B1 (en) 2006-10-03 2017-09-06 JX Nippon Mining & Metals Corporation Cu-Mn ALLOY SPUTTERING TARGET
JP5074883B2 (ja) * 2007-10-25 2012-11-14 東京エレクトロン株式会社 プローブ装置に用いられる載置装置
JP5356769B2 (ja) * 2008-10-15 2013-12-04 東京エレクトロン株式会社 載置台
JP5356962B2 (ja) * 2009-09-21 2013-12-04 東京エレクトロン株式会社 載置機構、ダイシングフレーム付きウエハの搬送方法及びこの搬送方法に用いられるウエハ搬送用プログラム
US8946058B2 (en) 2011-03-14 2015-02-03 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US8802545B2 (en) 2011-03-14 2014-08-12 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US9070760B2 (en) 2011-03-14 2015-06-30 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
CN103576464B (zh) * 2012-07-20 2016-03-09 上海微电子装备有限公司 一种推顶机构及具有该推顶机构的光刻装置
US9236305B2 (en) 2013-01-25 2016-01-12 Applied Materials, Inc. Wafer dicing with etch chamber shield ring for film frame wafer applications
CN106338890B (zh) * 2015-07-15 2018-06-29 上海微电子装备（集团）股份有限公司 一种无源基底交接机构及方法
KR101800321B1 (ko) * 2016-04-18 2017-11-22 최상준 건식 에칭장치
US10522385B2 (en) 2017-09-26 2019-12-31 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer table with dynamic support pins
CN111613512B (zh) * 2020-06-22 2022-10-21 北京北方华创微电子装备有限公司 半导体设备及其工艺腔室
TWI854427B (zh) * 2023-01-04 2024-09-01 台灣茂矽電子股份有限公司 晶圓吸盤

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378173A (en) * 1976-12-22 1978-07-11 Toshiba Corp Manufacture of semiconductor device
JP3249765B2 (ja) * 1997-05-07 2002-01-21 東京エレクトロン株式会社 基板処理装置
JPH073833B2 (ja) * 1987-03-30 1995-01-18 東京エレクトロン株式会社 プローブ装置
JPH0728693Y2 (ja) * 1988-09-30 1995-06-28 株式会社島津製作所 ウェハ保持具
JP3182615B2 (ja) * 1991-04-15 2001-07-03 アネルバ株式会社 プラズマ処理方法および装置
JPH07302830A (ja) * 1994-05-09 1995-11-14 Hitachi Cable Ltd ウェハステージ及びウェハプロービング装置
KR0174773B1 (ko) * 1995-03-31 1999-04-01 모리시다 요이치 반도체장치의 검사방법
JP2837829B2 (ja) * 1995-03-31 1998-12-16 松下電器産業株式会社 半導体装置の検査方法
JP3535728B2 (ja) * 1998-02-23 2004-06-07 松下電器産業株式会社 半導体集積回路の検査装置
EP1073164B1 (en) * 1999-07-28 2003-05-14 Sumitomo Wiring Systems, Ltd. A probe, a wire insertion detection jig, a wire mount control apparatus and a wire mount control method
US6485248B1 (en) * 2000-10-10 2002-11-26 Applied Materials, Inc. Multiple wafer lift apparatus and associated method
JP2003066109A (ja) * 2001-08-28 2003-03-05 Fujitsu Ltd 半導体試験装置及び半導体試験方法
JP3892703B2 (ja) * 2001-10-19 2007-03-14 富士通株式会社 半導体基板用治具及びこれを用いた半導体装置の製造方法
JP4173309B2 (ja) * 2002-01-28 2008-10-29 東京エレクトロン株式会社 センタリング装置及び枚葉式検査装置
JP4860113B2 (ja) * 2003-12-26 2012-01-25 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法

Also Published As

Publication number Publication date
CN101010790A (zh) 2007-08-01
US7411384B2 (en) 2008-08-12
JP2006073963A (ja) 2006-03-16
US20070152691A1 (en) 2007-07-05
TW200614409A (en) 2006-05-01
KR100854801B1 (ko) 2008-08-27
WO2006028040A1 (ja) 2006-03-16
TWI389242B (zh) 2013-03-11
CN100477143C (zh) 2009-04-08
KR20070037514A (ko) 2007-04-04

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