CN100477143C - 晶片夹具 - Google Patents

晶片夹具 Download PDF

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Publication number
CN100477143C
CN100477143C CNB2005800298626A CN200580029862A CN100477143C CN 100477143 C CN100477143 C CN 100477143C CN B2005800298626 A CNB2005800298626 A CN B2005800298626A CN 200580029862 A CN200580029862 A CN 200580029862A CN 100477143 C CN100477143 C CN 100477143C
Authority
CN
China
Prior art keywords
pin
locking
pins
receiving surface
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2005800298626A
Other languages
English (en)
Chinese (zh)
Other versions
CN101010790A (zh
Inventor
小笠原郁男
加藤仪保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN101010790A publication Critical patent/CN101010790A/zh
Application granted granted Critical
Publication of CN100477143C publication Critical patent/CN100477143C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CNB2005800298626A 2004-09-06 2005-09-05 晶片夹具 Expired - Lifetime CN100477143C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004258955A JP4559801B2 (ja) 2004-09-06 2004-09-06 ウエハチャック
JP258955/2004 2004-09-06

Publications (2)

Publication Number Publication Date
CN101010790A CN101010790A (zh) 2007-08-01
CN100477143C true CN100477143C (zh) 2009-04-08

Family

ID=36036321

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800298626A Expired - Lifetime CN100477143C (zh) 2004-09-06 2005-09-05 晶片夹具

Country Status (6)

Country Link
US (1) US7411384B2 (https=)
JP (1) JP4559801B2 (https=)
KR (1) KR100854801B1 (https=)
CN (1) CN100477143C (https=)
TW (1) TWI389242B (https=)
WO (1) WO2006028040A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2014787B1 (en) 2006-10-03 2017-09-06 JX Nippon Mining & Metals Corporation Cu-Mn ALLOY SPUTTERING TARGET
JP5074883B2 (ja) * 2007-10-25 2012-11-14 東京エレクトロン株式会社 プローブ装置に用いられる載置装置
JP5356769B2 (ja) * 2008-10-15 2013-12-04 東京エレクトロン株式会社 載置台
JP5356962B2 (ja) * 2009-09-21 2013-12-04 東京エレクトロン株式会社 載置機構、ダイシングフレーム付きウエハの搬送方法及びこの搬送方法に用いられるウエハ搬送用プログラム
US8946058B2 (en) 2011-03-14 2015-02-03 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US8802545B2 (en) 2011-03-14 2014-08-12 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US9070760B2 (en) 2011-03-14 2015-06-30 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
CN103576464B (zh) * 2012-07-20 2016-03-09 上海微电子装备有限公司 一种推顶机构及具有该推顶机构的光刻装置
US9236305B2 (en) 2013-01-25 2016-01-12 Applied Materials, Inc. Wafer dicing with etch chamber shield ring for film frame wafer applications
CN106338890B (zh) * 2015-07-15 2018-06-29 上海微电子装备（集团）股份有限公司 一种无源基底交接机构及方法
KR101800321B1 (ko) * 2016-04-18 2017-11-22 최상준 건식 에칭장치
US10522385B2 (en) 2017-09-26 2019-12-31 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer table with dynamic support pins
CN111613512B (zh) * 2020-06-22 2022-10-21 北京北方华创微电子装备有限公司 半导体设备及其工艺腔室
TWI854427B (zh) * 2023-01-04 2024-09-01 台灣茂矽電子股份有限公司 晶圓吸盤

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002198418A (ja) * 2000-10-10 2002-07-12 Applied Materials Inc 複数ウエハリフト装置及び関連方法
CN1412830A (zh) * 2001-10-19 2003-04-23 富士通株式会社 半导体衬底夹具和半导体器件的制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378173A (en) * 1976-12-22 1978-07-11 Toshiba Corp Manufacture of semiconductor device
JP3249765B2 (ja) * 1997-05-07 2002-01-21 東京エレクトロン株式会社 基板処理装置
JPH073833B2 (ja) * 1987-03-30 1995-01-18 東京エレクトロン株式会社 プローブ装置
JPH0728693Y2 (ja) * 1988-09-30 1995-06-28 株式会社島津製作所 ウェハ保持具
JP3182615B2 (ja) * 1991-04-15 2001-07-03 アネルバ株式会社 プラズマ処理方法および装置
JPH07302830A (ja) * 1994-05-09 1995-11-14 Hitachi Cable Ltd ウェハステージ及びウェハプロービング装置
KR0174773B1 (ko) * 1995-03-31 1999-04-01 모리시다 요이치 반도체장치의 검사방법
JP2837829B2 (ja) * 1995-03-31 1998-12-16 松下電器産業株式会社 半導体装置の検査方法
JP3535728B2 (ja) * 1998-02-23 2004-06-07 松下電器産業株式会社 半導体集積回路の検査装置
EP1073164B1 (en) * 1999-07-28 2003-05-14 Sumitomo Wiring Systems, Ltd. A probe, a wire insertion detection jig, a wire mount control apparatus and a wire mount control method
JP2003066109A (ja) * 2001-08-28 2003-03-05 Fujitsu Ltd 半導体試験装置及び半導体試験方法
JP4173309B2 (ja) * 2002-01-28 2008-10-29 東京エレクトロン株式会社 センタリング装置及び枚葉式検査装置
JP4860113B2 (ja) * 2003-12-26 2012-01-25 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002198418A (ja) * 2000-10-10 2002-07-12 Applied Materials Inc 複数ウエハリフト装置及び関連方法
CN1412830A (zh) * 2001-10-19 2003-04-23 富士通株式会社 半导体衬底夹具和半导体器件的制造方法

Also Published As

Publication number Publication date
CN101010790A (zh) 2007-08-01
US7411384B2 (en) 2008-08-12
JP2006073963A (ja) 2006-03-16
US20070152691A1 (en) 2007-07-05
TW200614409A (en) 2006-05-01
KR100854801B1 (ko) 2008-08-27
WO2006028040A1 (ja) 2006-03-16
TWI389242B (zh) 2013-03-11
JP4559801B2 (ja) 2010-10-13
KR20070037514A (ko) 2007-04-04

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Granted publication date: 20090408