KR100854801B1 - 웨이퍼척 - Google Patents

웨이퍼척 Download PDF

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Publication number
KR100854801B1
KR100854801B1 KR1020077005337A KR20077005337A KR100854801B1 KR 100854801 B1 KR100854801 B1 KR 100854801B1 KR 1020077005337 A KR1020077005337 A KR 1020077005337A KR 20077005337 A KR20077005337 A KR 20077005337A KR 100854801 B1 KR100854801 B1 KR 100854801B1
Authority
KR
South Korea
Prior art keywords
pins
pin
wafer
surface portion
receiving surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020077005337A
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English (en)
Korean (ko)
Other versions
KR20070037514A (ko
Inventor
이쿠오 오가사와라
요시야스 가토
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20070037514A publication Critical patent/KR20070037514A/ko
Application granted granted Critical
Publication of KR100854801B1 publication Critical patent/KR100854801B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020077005337A 2004-09-06 2005-09-05 웨이퍼척 Expired - Lifetime KR100854801B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004258955A JP4559801B2 (ja) 2004-09-06 2004-09-06 ウエハチャック
JPJP-P-2004-00258955 2004-09-06

Publications (2)

Publication Number Publication Date
KR20070037514A KR20070037514A (ko) 2007-04-04
KR100854801B1 true KR100854801B1 (ko) 2008-08-27

Family

ID=36036321

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077005337A Expired - Lifetime KR100854801B1 (ko) 2004-09-06 2005-09-05 웨이퍼척

Country Status (6)

Country Link
US (1) US7411384B2 (https=)
JP (1) JP4559801B2 (https=)
KR (1) KR100854801B1 (https=)
CN (1) CN100477143C (https=)
TW (1) TWI389242B (https=)
WO (1) WO2006028040A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2014787B1 (en) 2006-10-03 2017-09-06 JX Nippon Mining & Metals Corporation Cu-Mn ALLOY SPUTTERING TARGET
JP5074883B2 (ja) * 2007-10-25 2012-11-14 東京エレクトロン株式会社 プローブ装置に用いられる載置装置
JP5356769B2 (ja) * 2008-10-15 2013-12-04 東京エレクトロン株式会社 載置台
JP5356962B2 (ja) * 2009-09-21 2013-12-04 東京エレクトロン株式会社 載置機構、ダイシングフレーム付きウエハの搬送方法及びこの搬送方法に用いられるウエハ搬送用プログラム
US8946058B2 (en) 2011-03-14 2015-02-03 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US8802545B2 (en) 2011-03-14 2014-08-12 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US9070760B2 (en) 2011-03-14 2015-06-30 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
CN103576464B (zh) * 2012-07-20 2016-03-09 上海微电子装备有限公司 一种推顶机构及具有该推顶机构的光刻装置
US9236305B2 (en) 2013-01-25 2016-01-12 Applied Materials, Inc. Wafer dicing with etch chamber shield ring for film frame wafer applications
CN106338890B (zh) * 2015-07-15 2018-06-29 上海微电子装备（集团）股份有限公司 一种无源基底交接机构及方法
KR101800321B1 (ko) * 2016-04-18 2017-11-22 최상준 건식 에칭장치
US10522385B2 (en) 2017-09-26 2019-12-31 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer table with dynamic support pins
CN111613512B (zh) * 2020-06-22 2022-10-21 北京北方华创微电子装备有限公司 半导体设备及其工艺腔室
TWI854427B (zh) * 2023-01-04 2024-09-01 台灣茂矽電子股份有限公司 晶圓吸盤

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330372A (ja) * 1995-03-31 1996-12-13 Matsushita Electric Ind Co Ltd 半導体装置の検査方法
JP2002198418A (ja) * 2000-10-10 2002-07-12 Applied Materials Inc 複数ウエハリフト装置及び関連方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378173A (en) * 1976-12-22 1978-07-11 Toshiba Corp Manufacture of semiconductor device
JP3249765B2 (ja) * 1997-05-07 2002-01-21 東京エレクトロン株式会社 基板処理装置
JPH073833B2 (ja) * 1987-03-30 1995-01-18 東京エレクトロン株式会社 プローブ装置
JPH0728693Y2 (ja) * 1988-09-30 1995-06-28 株式会社島津製作所 ウェハ保持具
JP3182615B2 (ja) * 1991-04-15 2001-07-03 アネルバ株式会社 プラズマ処理方法および装置
JPH07302830A (ja) * 1994-05-09 1995-11-14 Hitachi Cable Ltd ウェハステージ及びウェハプロービング装置
KR0174773B1 (ko) * 1995-03-31 1999-04-01 모리시다 요이치 반도체장치의 검사방법
JP3535728B2 (ja) * 1998-02-23 2004-06-07 松下電器産業株式会社 半導体集積回路の検査装置
EP1073164B1 (en) * 1999-07-28 2003-05-14 Sumitomo Wiring Systems, Ltd. A probe, a wire insertion detection jig, a wire mount control apparatus and a wire mount control method
JP2003066109A (ja) * 2001-08-28 2003-03-05 Fujitsu Ltd 半導体試験装置及び半導体試験方法
JP3892703B2 (ja) * 2001-10-19 2007-03-14 富士通株式会社 半導体基板用治具及びこれを用いた半導体装置の製造方法
JP4173309B2 (ja) * 2002-01-28 2008-10-29 東京エレクトロン株式会社 センタリング装置及び枚葉式検査装置
JP4860113B2 (ja) * 2003-12-26 2012-01-25 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330372A (ja) * 1995-03-31 1996-12-13 Matsushita Electric Ind Co Ltd 半導体装置の検査方法
JP2837829B2 (ja) * 1995-03-31 1998-12-16 松下電器産業株式会社 半導体装置の検査方法
JP2002198418A (ja) * 2000-10-10 2002-07-12 Applied Materials Inc 複数ウエハリフト装置及び関連方法

Also Published As

Publication number Publication date
CN101010790A (zh) 2007-08-01
US7411384B2 (en) 2008-08-12
JP2006073963A (ja) 2006-03-16
US20070152691A1 (en) 2007-07-05
TW200614409A (en) 2006-05-01
WO2006028040A1 (ja) 2006-03-16
TWI389242B (zh) 2013-03-11
CN100477143C (zh) 2009-04-08
JP4559801B2 (ja) 2010-10-13
KR20070037514A (ko) 2007-04-04

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