JP4544624B2 - 金属製端子板付きハイブリッド回路基板を製造するための素材基板及びハイブリッド回路基板を製造する方法 - Google Patents
金属製端子板付きハイブリッド回路基板を製造するための素材基板及びハイブリッド回路基板を製造する方法 Download PDFInfo
- Publication number
- JP4544624B2 JP4544624B2 JP2004282583A JP2004282583A JP4544624B2 JP 4544624 B2 JP4544624 B2 JP 4544624B2 JP 2004282583 A JP2004282583 A JP 2004282583A JP 2004282583 A JP2004282583 A JP 2004282583A JP 4544624 B2 JP4544624 B2 JP 4544624B2
- Authority
- JP
- Japan
- Prior art keywords
- hybrid circuit
- board
- circuit board
- terminal
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims description 24
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000002184 metal Substances 0.000 title claims description 11
- 239000000853 adhesive Substances 0.000 claims description 34
- 230000001070 adhesive effect Effects 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004819 Drying adhesive Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0169—Using a temporary frame during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
「周囲を切開溝で囲われたハイブリッド回路基板の複数枚と、前記切開溝の外側に位置した余白枠部とを有しており、隣り合ったハイブリッド回路基板と余白枠部とは前記切開溝の途中に設けた細幅片を介して繋がっており、更に、前記各ハイブリッド回路基板には、金属製の端子板が前記ハイブリッド回路基板の外側にはみ出る状態で固着されており、前記各端子板は前記余白枠部に接着剤で仮接着されている、
という構成であって、
前記余白枠部のうち前記各端子板が重なる各部分でかつ、前記切開溝に隣接した部位に、前記端子板のはみ出し方向を向いて前後に位置した抜き孔が、前記各端子板のはみ出し方向を向いて左右両側に一対ずつ形成されており、これら前後の抜き孔の対の間に前記接着剤が塗布されている」、
ことを特徴としている。
「電子部品を搭載すると共に周囲を切開溝で囲われたハイブリッド回路基板の複数枚と、前記切開溝の外側に位置した余白枠部とを有しており、隣り合ったハイブリッド回路基板と余白枠部とは前記切開溝の途中に設けた細幅片を介して繋がっており、更に、前記各ハイブリッド回路基板には、金属製の端子板が前記ハイブリッド回路基板の外側にはみ出る状態で固着されており、前記各端子板は前記余白枠部に接着剤で仮接着されている」という構成の素材基板を製造する工程、
及び、前記端子板の仮接着を剥離し且つ前記細幅片を切断することによって前記各ハイブリッド回路基板を素材基板から切り離す工程、
を備えているハイブリッド回路基板の製造方法であって、
前記素材基板を製造する工程は、前記各端子板を前記余白枠部に接着剤で仮接着する工程と、前記端子板をハイブリッド回路基板に半田付けで固着する工程とを含んでおり、
前記素材基板における余白枠部のうち前記各端子板が重なる各部分には、前記切開溝に隣接した部位でかつ前記各端子板のはみ出し方向を向いて左右両側の部位に、前記端子板のはみ出し方向を向いて前後に並んだ一対ずつの抜き孔が予め形成されており、前後の抜き孔の間に前記接着剤を塗布してから前記端子板を重ねて仮接着する、という工程を経ることを特徴としている。
2 電子部品
3 端子板
4 電極パッド
5 素材基板
6 余白枠部
7 切開溝孔
8 細幅片
9 接着剤
10,11 抜き孔
Claims (2)
- 周囲を切開溝で囲われたハイブリッド回路基板の複数枚と、前記切開溝の外側に位置した余白枠部とを有しており、隣り合ったハイブリッド回路基板と余白枠部とは前記切開溝の途中に設けた細幅片を介して繋がっており、更に、前記各ハイブリッド回路基板には、金属製の端子板が前記ハイブリッド回路基板の外側にはみ出る状態で固着されており、前記各端子板は前記余白枠部に接着剤で仮接着されている、
という構成であって、
前記余白枠部のうち前記各端子板が重なる各部分でかつ、前記切開溝に隣接した部位に、前記端子板のはみ出し方向を向いて前後に位置した抜き孔が、前記各端子板のはみ出し方向を向いて左右両側に一対ずつ形成されており、これら前後の抜き孔の対の間に前記接着剤が塗布されている、
金属製端子板付きハイブリッド回路基板を製造するための素材基板。 - 「電子部品を搭載すると共に周囲を切開溝で囲われたハイブリッド回路基板の複数枚と、前記切開溝の外側に位置した余白枠部とを有しており、隣り合ったハイブリッド回路基板と余白枠部とは前記切開溝の途中に設けた細幅片を介して繋がっており、更に、前記各ハイブリッド回路基板には、金属製の端子板が前記ハイブリッド回路基板の外側にはみ出る状態で固着されており、前記各端子板は前記余白枠部に接着剤で仮接着されている」という構成の素材基板を製造する工程、
及び、前記端子板の仮接着を剥離し且つ前記細幅片を切断することによって前記各ハイブリッド回路基板を素材基板から切り離す工程、
を備えているハイブリッド回路基板の製造方法であって、
前記素材基板を製造する工程は、前記各端子板を前記余白枠部に接着剤で仮接着する工程と、前記端子板をハイブリッド回路基板に半田付けで固着する工程とを含んでおり、
前記素材基板における余白枠部のうち前記各端子板が重なる各部分には、前記切開溝に隣接した部位でかつ前記各端子板のはみ出し方向を向いて左右両側の部位に、前記端子板のはみ出し方向を向いて前後に並んだ一対ずつの抜き孔が予め形成されており、前後の抜き孔の間に前記接着剤を塗布してから前記端子板を重ねて仮接着する、という工程を経ることを特徴とする、
金属製端子板付きハイブリッド回路基板を製造する方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004282583A JP4544624B2 (ja) | 2004-09-28 | 2004-09-28 | 金属製端子板付きハイブリッド回路基板を製造するための素材基板及びハイブリッド回路基板を製造する方法 |
CN200580001130.6A CN1860831A (zh) | 2004-09-28 | 2005-08-09 | 用于制造装有金属制端子板的混合型电路基板的素材基板和混合型电路基板的制造方法 |
US11/663,699 US7943860B2 (en) | 2004-09-28 | 2005-08-09 | Material board for producing hybrid circuit board with metallic terminal plate and method for producing hybrid circuit board |
PCT/JP2005/014564 WO2006035551A1 (ja) | 2004-09-28 | 2005-08-09 | 金属製端子板付きハイブリッド回路基板を製造するための素材基板及びハイブリッド回路基板を製造する方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004282583A JP4544624B2 (ja) | 2004-09-28 | 2004-09-28 | 金属製端子板付きハイブリッド回路基板を製造するための素材基板及びハイブリッド回路基板を製造する方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006100426A JP2006100426A (ja) | 2006-04-13 |
JP4544624B2 true JP4544624B2 (ja) | 2010-09-15 |
Family
ID=36118704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004282583A Expired - Fee Related JP4544624B2 (ja) | 2004-09-28 | 2004-09-28 | 金属製端子板付きハイブリッド回路基板を製造するための素材基板及びハイブリッド回路基板を製造する方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7943860B2 (ja) |
JP (1) | JP4544624B2 (ja) |
CN (1) | CN1860831A (ja) |
WO (1) | WO2006035551A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101252091B (zh) * | 2008-03-20 | 2010-10-13 | 日月光半导体制造股份有限公司 | 基板上长条孔的成型方法与基板结构 |
KR101585211B1 (ko) * | 2009-04-09 | 2016-01-13 | 삼성전자주식회사 | 전자 장치 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0569972U (ja) * | 1992-02-25 | 1993-09-21 | ミクロン電気株式会社 | 表面実装用電気素子 |
JPH11233927A (ja) * | 1998-02-09 | 1999-08-27 | Sanyo Electric Co Ltd | 基板製造方法 |
JP2000031611A (ja) * | 1998-07-10 | 2000-01-28 | Rohm Co Ltd | 電子装置用回路基板の構造 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4635354A (en) * | 1982-07-22 | 1987-01-13 | Texas Instruments Incorporated | Low cost electronic apparatus construction method |
DE3534502A1 (de) * | 1985-09-27 | 1987-04-09 | Licentia Gmbh | Verfahren zum herstellen einer klebekontaktierung |
JPH0744405Y2 (ja) * | 1989-03-07 | 1995-10-11 | ローム株式会社 | プリント基板の切断装置 |
US5150087A (en) * | 1989-11-30 | 1992-09-22 | Mitsumi Electric Co., Ltd. | Electrical signal filter and method for manufacture of electrical signal filter internal circuit board |
JPH0569972A (ja) | 1991-09-06 | 1993-03-23 | Murata Mach Ltd | 用紙給送装置 |
JPH09237848A (ja) | 1996-02-29 | 1997-09-09 | Sony Corp | フラット形パッケージ |
US5798638A (en) * | 1996-10-24 | 1998-08-25 | Ericsson, Inc. | Apparatus for testing of printed circuit boards |
US6528736B1 (en) * | 1997-01-21 | 2003-03-04 | Visteon Global Technologies, Inc. | Multi-layer printed circuit board and method of making same |
KR100214552B1 (ko) * | 1997-01-25 | 1999-08-02 | 구본준 | 캐리어프레임 및 서브스트레이트와 이들을 이용한 볼 그리드 어 레이 패키지의 제조방법 |
US6047470A (en) * | 1997-08-20 | 2000-04-11 | Micron Technology, Inc. | Singulation methods |
TW421980B (en) * | 1997-12-22 | 2001-02-11 | Citizen Watch Co Ltd | Electronic component device, its manufacturing process, and collective circuits |
US6028489A (en) * | 1998-12-18 | 2000-02-22 | Chung-Shan Institute Of Science And Technology | Modular high-frequency oscillator structure |
EP1031844A3 (fr) * | 1999-02-25 | 2009-03-11 | Liaisons Electroniques-Mecaniques Lem S.A. | Procédé de fabrication d'un capteur de courant électrique |
US7095922B2 (en) * | 2002-03-26 | 2006-08-22 | Ngk Insulators, Ltd. | Lensed fiber array and production method thereof |
US7279063B2 (en) * | 2004-01-16 | 2007-10-09 | Eastman Kodak Company | Method of making an OLED display device with enhanced optical and mechanical properties |
-
2004
- 2004-09-28 JP JP2004282583A patent/JP4544624B2/ja not_active Expired - Fee Related
-
2005
- 2005-08-09 WO PCT/JP2005/014564 patent/WO2006035551A1/ja active Application Filing
- 2005-08-09 US US11/663,699 patent/US7943860B2/en not_active Expired - Fee Related
- 2005-08-09 CN CN200580001130.6A patent/CN1860831A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0569972U (ja) * | 1992-02-25 | 1993-09-21 | ミクロン電気株式会社 | 表面実装用電気素子 |
JPH11233927A (ja) * | 1998-02-09 | 1999-08-27 | Sanyo Electric Co Ltd | 基板製造方法 |
JP2000031611A (ja) * | 1998-07-10 | 2000-01-28 | Rohm Co Ltd | 電子装置用回路基板の構造 |
Also Published As
Publication number | Publication date |
---|---|
WO2006035551A1 (ja) | 2006-04-06 |
JP2006100426A (ja) | 2006-04-13 |
CN1860831A (zh) | 2006-11-08 |
US7943860B2 (en) | 2011-05-17 |
US20080149380A1 (en) | 2008-06-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100422089B1 (ko) | 회로기판, 전지 팩 및 회로기판의 제조방법 | |
JP4524291B2 (ja) | 平型アース端子およびその表面実装方法 | |
JP4713590B2 (ja) | 表面実装型半導体装置、およびその製造方法 | |
JPH11224705A (ja) | コネクタチップ及びテーピングコネクタチップ | |
CN104347267A (zh) | 电子部件的制造方法以及基板型端子的制造方法 | |
JP2007081058A (ja) | 配線基板及びその製造方法、並びに半導体装置 | |
JP5479406B2 (ja) | コネクタ | |
JP4115805B2 (ja) | 回路体および回路体の形成方法 | |
JP4544624B2 (ja) | 金属製端子板付きハイブリッド回路基板を製造するための素材基板及びハイブリッド回路基板を製造する方法 | |
WO1997046060A1 (fr) | Procede de montage d'une borne sur une plaquette de circuit et plaquette de circuit | |
JP2001237585A (ja) | 電子部品及びその製造方法 | |
JP2012084795A (ja) | 実装部品仮固定用接着剤の供給方法、半導体装置の製造方法、部品実装用基板および半導体装置 | |
JP3184929B2 (ja) | 回路基板への端子の実装方法、および回路基板 | |
JP3321660B2 (ja) | 端子片付き基板構造 | |
JP2009238926A (ja) | Tabテープおよびその製造方法 | |
JP6570728B2 (ja) | 電子装置およびその製造方法 | |
JP3924073B2 (ja) | 回路基板と導体片との接続方法 | |
JP3352471B2 (ja) | フィルムキャリア | |
JP2002374060A (ja) | 電子回路板 | |
JP2000299556A (ja) | 複合配線基板実装方法 | |
JP2011044670A (ja) | 電子部品の裏面電極構造及びこれを備えた電子部品 | |
JP3317396B2 (ja) | サーマルヘッド及びその作製方法 | |
JP4388168B2 (ja) | 樹脂成形基板 | |
JPS6361796B2 (ja) | ||
JP5254374B2 (ja) | 電子部品およびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070413 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100113 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100311 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100623 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100628 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130709 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |