JP4529365B2 - 基板検査システムおよび基板検査方法 - Google Patents

基板検査システムおよび基板検査方法 Download PDF

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Publication number
JP4529365B2
JP4529365B2 JP2003084741A JP2003084741A JP4529365B2 JP 4529365 B2 JP4529365 B2 JP 4529365B2 JP 2003084741 A JP2003084741 A JP 2003084741A JP 2003084741 A JP2003084741 A JP 2003084741A JP 4529365 B2 JP4529365 B2 JP 4529365B2
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JP
Japan
Prior art keywords
inspection
substrate
inspected
defect
macro
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Expired - Fee Related
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JP2003084741A
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English (en)
Japanese (ja)
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JP2004294172A (ja
Inventor
和彦 深澤
泰登 川島
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Nikon Corp
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Nikon Corp
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Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP2003084741A priority Critical patent/JP4529365B2/ja
Priority to KR1020040019584A priority patent/KR101104665B1/ko
Priority to US10/807,262 priority patent/US7330042B2/en
Priority to TW093108290A priority patent/TW200504350A/zh
Publication of JP2004294172A publication Critical patent/JP2004294172A/ja
Application granted granted Critical
Publication of JP4529365B2 publication Critical patent/JP4529365B2/ja
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    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K61/00—Culture of aquatic animals
    • A01K61/10—Culture of aquatic animals of fish
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8867—Grading and classifying of flaws using sequentially two or more inspection runs, e.g. coarse and fine, or detecting then analysing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels

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  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Environmental Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Zoology (AREA)
  • Marine Sciences & Fisheries (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Animal Husbandry (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2003084741A 2003-03-26 2003-03-26 基板検査システムおよび基板検査方法 Expired - Fee Related JP4529365B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003084741A JP4529365B2 (ja) 2003-03-26 2003-03-26 基板検査システムおよび基板検査方法
KR1020040019584A KR101104665B1 (ko) 2003-03-26 2004-03-23 기판 검사 시스템, 기판 검사 방법 및 기판 검사 장치
US10/807,262 US7330042B2 (en) 2003-03-26 2004-03-24 Substrate inspection system, substrate inspection method, and substrate inspection apparatus
TW093108290A TW200504350A (en) 2003-03-26 2004-03-26 Substrate inspection system, substrate inspection method and substrate inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003084741A JP4529365B2 (ja) 2003-03-26 2003-03-26 基板検査システムおよび基板検査方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010099898A Division JP5359981B2 (ja) 2010-04-23 2010-04-23 基板検査システムおよび基板検査方法

Publications (2)

Publication Number Publication Date
JP2004294172A JP2004294172A (ja) 2004-10-21
JP4529365B2 true JP4529365B2 (ja) 2010-08-25

Family

ID=33399840

Family Applications (1)

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JP2003084741A Expired - Fee Related JP4529365B2 (ja) 2003-03-26 2003-03-26 基板検査システムおよび基板検査方法

Country Status (4)

Country Link
US (1) US7330042B2 (https=)
JP (1) JP4529365B2 (https=)
KR (1) KR101104665B1 (https=)
TW (1) TW200504350A (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10308258A1 (de) * 2003-02-25 2004-09-02 Leica Microsystems Jena Gmbh Vorrichtung und Verfahren zur Dünnschichtmetrologie
US7858404B2 (en) * 2007-03-14 2010-12-28 Taiwan Semiconductor Manufacturing Company, Ltd. Measurement of overlay offset in semiconductor processing
US8165706B2 (en) * 2009-12-29 2012-04-24 Memc Electronic Materials, Inc. Methods for generating representations of flatness defects on wafers
US8340801B2 (en) * 2009-12-29 2012-12-25 Memc Electronic Materials, Inc. Systems for generating representations of flatness defects on wafers
JP5625935B2 (ja) * 2011-01-18 2014-11-19 オムロン株式会社 判定基準値の適否判定方法およびその適正値の特定方法ならびに適正値への変更方法、部品実装基板の検査システム、生産現場におけるシミュレーション方法およびシミュレーションシステム
JP5782782B2 (ja) * 2011-03-30 2015-09-24 株式会社Sumco 特定欠陥の検出方法、特定欠陥の検出システムおよびプログラム
US20130335743A1 (en) * 2012-06-19 2013-12-19 Shenzhen China Star Optoelectronics Technology Co. Ltd. Inspection Device for Glass Substrate Cassette
CN103247550B (zh) * 2013-05-07 2016-04-13 上海华力微电子有限公司 监控制程稳定性的测试模块和方法
US9262821B2 (en) 2014-05-12 2016-02-16 Kla-Tencor Corp. Inspection recipe setup from reference image variation
US10438340B2 (en) * 2017-03-21 2019-10-08 Test Research, Inc. Automatic optical inspection system and operating method thereof
JP6819451B2 (ja) * 2017-05-08 2021-01-27 信越化学工業株式会社 大型合成石英ガラス基板並びにその評価方法及び製造方法
WO2018229709A1 (en) * 2017-06-14 2018-12-20 Camtek Ltd. Automatic defect classification
US12189375B2 (en) * 2020-09-21 2025-01-07 Applied Materials, Inc. Dynamic scheduling based on task dependencies

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944778B2 (ja) * 1980-11-29 1984-11-01 日本電気ホームエレクトロニクス株式会社 半導体ペレツト外観検査方法
JPS5910231A (ja) * 1982-07-09 1984-01-19 Mitsubishi Electric Corp パタ−ン欠陥解析装置
US4644172A (en) * 1984-02-22 1987-02-17 Kla Instruments Corporation Electronic control of an automatic wafer inspection system
JPS62173731A (ja) * 1986-01-28 1987-07-30 Toshiba Corp 被検査物の表面検査装置
IL99823A0 (en) * 1990-11-16 1992-08-18 Orbot Instr Ltd Optical inspection method and apparatus
JPH07321174A (ja) * 1994-05-25 1995-12-08 Sony Corp 半導体検査装置
JP2847351B2 (ja) * 1994-12-29 1999-01-20 名古屋電機工業株式会社 実装済印刷配線板自動検査装置
JP3361945B2 (ja) * 1996-12-19 2003-01-07 株式会社日立製作所 平面ディスプレイパネルの製造方法およびプラズマディスプレイパネルの製造方法
JP3981895B2 (ja) 1997-08-29 2007-09-26 株式会社ニコン 自動マクロ検査装置
JP3333148B2 (ja) 1999-05-31 2002-10-07 オリンパス光学工業株式会社 外観検査装置
JP2001099788A (ja) 1999-09-28 2001-04-13 Sharp Corp 自動マクロ外観検査装置
JP2001141657A (ja) * 1999-10-29 2001-05-25 Internatl Business Mach Corp <Ibm> マクロ検査用照明装置、マクロ検査装置及び該方法
JP3801849B2 (ja) * 2000-08-07 2006-07-26 東京エレクトロン株式会社 基板処理装置及びその方法
JP2002076077A (ja) * 2000-08-31 2002-03-15 Nikon Corp 検査装置
JP4004248B2 (ja) * 2000-09-01 2007-11-07 大日本スクリーン製造株式会社 基板処理装置および基板検査方法
JP4733252B2 (ja) * 2000-09-05 2011-07-27 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 ウエハの表面検査装置及び検査方法
US6891627B1 (en) * 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US6673637B2 (en) * 2000-09-20 2004-01-06 Kla-Tencor Technologies Methods and systems for determining a presence of macro defects and overlay of a specimen

Also Published As

Publication number Publication date
TW200504350A (en) 2005-02-01
KR101104665B1 (ko) 2012-01-13
US7330042B2 (en) 2008-02-12
US20050072945A1 (en) 2005-04-07
KR20040084710A (ko) 2004-10-06
JP2004294172A (ja) 2004-10-21
TWI307408B (https=) 2009-03-11

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