TW200504350A - Substrate inspection system, substrate inspection method and substrate inspection device - Google Patents

Substrate inspection system, substrate inspection method and substrate inspection device

Info

Publication number
TW200504350A
TW200504350A TW093108290A TW93108290A TW200504350A TW 200504350 A TW200504350 A TW 200504350A TW 093108290 A TW093108290 A TW 093108290A TW 93108290 A TW93108290 A TW 93108290A TW 200504350 A TW200504350 A TW 200504350A
Authority
TW
Taiwan
Prior art keywords
substrate inspection
substrate
inspected
inspection
defect
Prior art date
Application number
TW093108290A
Other languages
English (en)
Other versions
TWI307408B (zh
Inventor
Kazuhiko Fukazawa
Yasuto Kawashima
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200504350A publication Critical patent/TW200504350A/zh
Application granted granted Critical
Publication of TWI307408B publication Critical patent/TWI307408B/zh

Links

Classifications

    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; CARE OF BIRDS, FISHES, INSECTS; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K61/00—Culture of aquatic animals
    • A01K61/10—Culture of aquatic animals of fish
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8867—Grading and classifying of flaws using sequentially two or more inspection runs, e.g. coarse and fine, or detecting then analysing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Environmental Sciences (AREA)
  • Biochemistry (AREA)
  • Zoology (AREA)
  • Marine Sciences & Fisheries (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Animal Husbandry (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW093108290A 2003-03-26 2004-03-26 Substrate inspection system, substrate inspection method and substrate inspection device TW200504350A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003084741A JP4529365B2 (ja) 2003-03-26 2003-03-26 基板検査システムおよび基板検査方法

Publications (2)

Publication Number Publication Date
TW200504350A true TW200504350A (en) 2005-02-01
TWI307408B TWI307408B (zh) 2009-03-11

Family

ID=33399840

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093108290A TW200504350A (en) 2003-03-26 2004-03-26 Substrate inspection system, substrate inspection method and substrate inspection device

Country Status (4)

Country Link
US (1) US7330042B2 (zh)
JP (1) JP4529365B2 (zh)
KR (1) KR101104665B1 (zh)
TW (1) TW200504350A (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10308258A1 (de) * 2003-02-25 2004-09-02 Leica Microsystems Jena Gmbh Vorrichtung und Verfahren zur Dünnschichtmetrologie
US7858404B2 (en) 2007-03-14 2010-12-28 Taiwan Semiconductor Manufacturing Company, Ltd. Measurement of overlay offset in semiconductor processing
US8340801B2 (en) * 2009-12-29 2012-12-25 Memc Electronic Materials, Inc. Systems for generating representations of flatness defects on wafers
US8165706B2 (en) * 2009-12-29 2012-04-24 Memc Electronic Materials, Inc. Methods for generating representations of flatness defects on wafers
JP5625935B2 (ja) * 2011-01-18 2014-11-19 オムロン株式会社 判定基準値の適否判定方法およびその適正値の特定方法ならびに適正値への変更方法、部品実装基板の検査システム、生産現場におけるシミュレーション方法およびシミュレーションシステム
JP5782782B2 (ja) * 2011-03-30 2015-09-24 株式会社Sumco 特定欠陥の検出方法、特定欠陥の検出システムおよびプログラム
US20130335743A1 (en) * 2012-06-19 2013-12-19 Shenzhen China Star Optoelectronics Technology Co. Ltd. Inspection Device for Glass Substrate Cassette
CN103247550B (zh) * 2013-05-07 2016-04-13 上海华力微电子有限公司 监控制程稳定性的测试模块和方法
US9262821B2 (en) 2014-05-12 2016-02-16 Kla-Tencor Corp. Inspection recipe setup from reference image variation
US10438340B2 (en) * 2017-03-21 2019-10-08 Test Research, Inc. Automatic optical inspection system and operating method thereof
JP6819451B2 (ja) * 2017-05-08 2021-01-27 信越化学工業株式会社 大型合成石英ガラス基板並びにその評価方法及び製造方法
US11300521B2 (en) * 2017-06-14 2022-04-12 Camtek Ltd. Automatic defect classification

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944778B2 (ja) * 1980-11-29 1984-11-01 日本電気ホームエレクトロニクス株式会社 半導体ペレツト外観検査方法
JPS5910231A (ja) * 1982-07-09 1984-01-19 Mitsubishi Electric Corp パタ−ン欠陥解析装置
US4644172A (en) * 1984-02-22 1987-02-17 Kla Instruments Corporation Electronic control of an automatic wafer inspection system
JPS62173731A (ja) * 1986-01-28 1987-07-30 Toshiba Corp 被検査物の表面検査装置
IL99823A0 (en) * 1990-11-16 1992-08-18 Orbot Instr Ltd Optical inspection method and apparatus
JPH07321174A (ja) * 1994-05-25 1995-12-08 Sony Corp 半導体検査装置
JP2847351B2 (ja) * 1994-12-29 1999-01-20 名古屋電機工業株式会社 実装済印刷配線板自動検査装置
JP3361945B2 (ja) * 1996-12-19 2003-01-07 株式会社日立製作所 平面ディスプレイパネルの製造方法およびプラズマディスプレイパネルの製造方法
JP3981895B2 (ja) 1997-08-29 2007-09-26 株式会社ニコン 自動マクロ検査装置
JP3333148B2 (ja) 1999-05-31 2002-10-07 オリンパス光学工業株式会社 外観検査装置
JP2001099788A (ja) 1999-09-28 2001-04-13 Sharp Corp 自動マクロ外観検査装置
JP2001141657A (ja) * 1999-10-29 2001-05-25 Internatl Business Mach Corp <Ibm> マクロ検査用照明装置、マクロ検査装置及び該方法
JP3801849B2 (ja) * 2000-08-07 2006-07-26 東京エレクトロン株式会社 基板処理装置及びその方法
JP2002076077A (ja) * 2000-08-31 2002-03-15 Nikon Corp 検査装置
JP4004248B2 (ja) * 2000-09-01 2007-11-07 大日本スクリーン製造株式会社 基板処理装置および基板検査方法
JP4733252B2 (ja) * 2000-09-05 2011-07-27 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 ウエハの表面検査装置及び検査方法
US6673637B2 (en) * 2000-09-20 2004-01-06 Kla-Tencor Technologies Methods and systems for determining a presence of macro defects and overlay of a specimen
US6891627B1 (en) * 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen

Also Published As

Publication number Publication date
TWI307408B (zh) 2009-03-11
KR20040084710A (ko) 2004-10-06
US7330042B2 (en) 2008-02-12
JP4529365B2 (ja) 2010-08-25
JP2004294172A (ja) 2004-10-21
KR101104665B1 (ko) 2012-01-13
US20050072945A1 (en) 2005-04-07

Similar Documents

Publication Publication Date Title
TW200504350A (en) Substrate inspection system, substrate inspection method and substrate inspection device
TW200504349A (en) Automatic optical inspection system and method
EP2026209A3 (en) System and method for using a memory mapping function to map memory defects
TW200725778A (en) An inspection system and a method for inspecting a diced wafer
WO2007143449A3 (en) Determining information about defects or binning defects detected on a wafer after an immersion lithography process is performed on the wafer
EA200802021A1 (ru) Система для обработки многоразовых перчаток
WO2003078976A3 (en) Excimer laser inspection system
TW369692B (en) Test and burn-in apparatus, in-line system using the apparatus, and test method using the system
WO2004008245A3 (en) Method and system for context-specific mask inspection
GB0800492D0 (en) Block analyser
GB2456698A (en) Remote nondestructive inspection systems and methods
MY141679A (en) Method for facilitating shale shaker operation
WO2008070722A3 (en) Methods and systems for identifying defect types on a wafer
TW200604787A (en) Method for testing and programming memory devices and system for same
ATE440064T1 (de) Verfahren und anlage zur automatischen gepäckhandhabung
TW200629284A (en) Semiconductor memory device and method of testing the same
ATE444556T1 (de) Informationsträger sowie system und verfahren zum lesen eines derartigen informationsträgers
TW200636521A (en) All surface data for use in substrate inspection
TW363131B (en) Test device, test assembly, method for testing and method for calibrating a test device
GB2430058A (en) A system and method for retrieving information and a system and method for storing information
EP1394560A3 (en) Semiconductor chip test system and test method thereof
TW200641376A (en) In-line electron beam test system
AU2003296703A1 (en) Transport device for transporting test strips in an analysis system
TW200602712A (en) Array substrate inspecting method and array substrate manufacturing method
TW200633106A (en) Method and apparatus for inspecting semiconductor wafer