JP4514754B2 - 毛管作用によるインプリント技術 - Google Patents
毛管作用によるインプリント技術 Download PDFInfo
- Publication number
- JP4514754B2 JP4514754B2 JP2006523943A JP2006523943A JP4514754B2 JP 4514754 B2 JP4514754 B2 JP 4514754B2 JP 2006523943 A JP2006523943 A JP 2006523943A JP 2006523943 A JP2006523943 A JP 2006523943A JP 4514754 B2 JP4514754 B2 JP 4514754B2
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- JP
- Japan
- Prior art keywords
- moldable material
- mold
- substrate
- region
- sub
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005516 engineering process Methods 0.000 title description 2
- 239000000463 material Substances 0.000 claims abstract description 191
- 239000000758 substrate Substances 0.000 claims abstract description 124
- 238000000034 method Methods 0.000 claims abstract description 94
- 238000000059 patterning Methods 0.000 claims abstract description 14
- 238000003825 pressing Methods 0.000 claims description 28
- 230000005855 radiation Effects 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims 7
- 238000009736 wetting Methods 0.000 claims 7
- 239000000203 mixture Substances 0.000 description 12
- 239000012530 fluid Substances 0.000 description 10
- 239000002861 polymer material Substances 0.000 description 10
- 238000009826 distribution Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000005459 micromachining Methods 0.000 description 4
- 239000003607 modifier Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- KUDUQBURMYMBIJ-UHFFFAOYSA-N ethylene glycol diacrylate Substances C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000005499 meniscus Effects 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 206010073306 Exposure to radiation Diseases 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 229920006037 cross link polymer Polymers 0.000 description 2
- 238000002348 laser-assisted direct imprint lithography Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- -1 n -Hexyl Chemical group 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- VCEXCCILEWFFBG-UHFFFAOYSA-N mercury telluride Chemical compound [Hg]=[Te] VCEXCCILEWFFBG-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Micromachines (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Printing Methods (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/645,306 US7442336B2 (en) | 2003-08-21 | 2003-08-21 | Capillary imprinting technique |
| PCT/US2004/026337 WO2005021156A2 (en) | 2003-08-21 | 2004-08-13 | Capillary imprinting technique |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007502715A JP2007502715A (ja) | 2007-02-15 |
| JP2007502715A5 JP2007502715A5 (enExample) | 2010-05-06 |
| JP4514754B2 true JP4514754B2 (ja) | 2010-07-28 |
Family
ID=34273282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006523943A Expired - Fee Related JP4514754B2 (ja) | 2003-08-21 | 2004-08-13 | 毛管作用によるインプリント技術 |
Country Status (9)
| Country | Link |
|---|---|
| US (4) | US7442336B2 (enExample) |
| EP (1) | EP1656242B1 (enExample) |
| JP (1) | JP4514754B2 (enExample) |
| KR (2) | KR101108496B1 (enExample) |
| CN (1) | CN100532055C (enExample) |
| AT (1) | ATE529237T1 (enExample) |
| MY (1) | MY138554A (enExample) |
| TW (1) | TWI319746B (enExample) |
| WO (1) | WO2005021156A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9505165B2 (en) | 2011-09-30 | 2016-11-29 | Fujifilm Corporation | Nanoimprinting mold, method for producing the nanoimprinting mold, nanoimprinting method using the nanoimprinting mold, and method for producing patterned substrates |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1262883C (zh) * | 2000-07-17 | 2006-07-05 | 得克萨斯州大学系统董事会 | 影印用于平版印刷工艺中的自动化液体分配的方法和系统 |
| US20060005657A1 (en) * | 2004-06-01 | 2006-01-12 | Molecular Imprints, Inc. | Method and system to control movement of a body for nano-scale manufacturing |
| US7077992B2 (en) * | 2002-07-11 | 2006-07-18 | Molecular Imprints, Inc. | Step and repeat imprint lithography processes |
| US7019819B2 (en) | 2002-11-13 | 2006-03-28 | Molecular Imprints, Inc. | Chucking system for modulating shapes of substrates |
| US7442336B2 (en) * | 2003-08-21 | 2008-10-28 | Molecular Imprints, Inc. | Capillary imprinting technique |
| US7641840B2 (en) * | 2002-11-13 | 2010-01-05 | Molecular Imprints, Inc. | Method for expelling gas positioned between a substrate and a mold |
| US8268446B2 (en) | 2003-09-23 | 2012-09-18 | The University Of North Carolina At Chapel Hill | Photocurable perfluoropolyethers for use as novel materials in microfluidic devices |
| US8211214B2 (en) * | 2003-10-02 | 2012-07-03 | Molecular Imprints, Inc. | Single phase fluid imprint lithography method |
| EP1542074A1 (en) * | 2003-12-11 | 2005-06-15 | Heptagon OY | Manufacturing a replication tool, sub-master or replica |
| US9040090B2 (en) * | 2003-12-19 | 2015-05-26 | The University Of North Carolina At Chapel Hill | Isolated and fixed micro and nano structures and methods thereof |
| US8263129B2 (en) | 2003-12-19 | 2012-09-11 | The University Of North Carolina At Chapel Hill | Methods for fabricating isolated micro-and nano-structures using soft or imprint lithography |
| US8158728B2 (en) | 2004-02-13 | 2012-04-17 | The University Of North Carolina At Chapel Hill | Methods and materials for fabricating microfluidic devices |
| US20070275193A1 (en) * | 2004-02-13 | 2007-11-29 | Desimone Joseph M | Functional Materials and Novel Methods for the Fabrication of Microfluidic Devices |
| US20060062922A1 (en) | 2004-09-23 | 2006-03-23 | Molecular Imprints, Inc. | Polymerization technique to attenuate oxygen inhibition of solidification of liquids and composition therefor |
| KR20070119624A (ko) * | 2005-02-03 | 2007-12-20 | 유니버시티 오브 노스캐롤라이나 앳 채플 힐 | 액정 디스플레이에서 사용되는 낮은 표면 에너지 고분자물질 |
| WO2007133235A2 (en) * | 2005-08-08 | 2007-11-22 | Liquidia Technologies, Inc. | Micro and nano-structure metrology |
| US8142703B2 (en) * | 2005-10-05 | 2012-03-27 | Molecular Imprints, Inc. | Imprint lithography method |
| JP4533358B2 (ja) * | 2005-10-18 | 2010-09-01 | キヤノン株式会社 | インプリント方法、インプリント装置およびチップの製造方法 |
| US7906058B2 (en) * | 2005-12-01 | 2011-03-15 | Molecular Imprints, Inc. | Bifurcated contact printing technique |
| US7670530B2 (en) * | 2006-01-20 | 2010-03-02 | Molecular Imprints, Inc. | Patterning substrates employing multiple chucks |
| EP1957249B1 (en) * | 2005-12-08 | 2014-11-12 | Canon Nanotechnologies, Inc. | Method and system for double-sided patterning of substrates |
| US7943080B2 (en) * | 2005-12-23 | 2011-05-17 | Asml Netherlands B.V. | Alignment for imprint lithography |
| US7459669B2 (en) * | 2005-12-30 | 2008-12-02 | Asml Netherlands B.V. | Sensor and lithographic apparatus |
| JP4814682B2 (ja) * | 2006-04-18 | 2011-11-16 | 株式会社日立ハイテクノロジーズ | 微細構造パターンの転写方法及び転写装置 |
| US8012395B2 (en) * | 2006-04-18 | 2011-09-06 | Molecular Imprints, Inc. | Template having alignment marks formed of contrast material |
| US8215946B2 (en) | 2006-05-18 | 2012-07-10 | Molecular Imprints, Inc. | Imprint lithography system and method |
| US20080181958A1 (en) * | 2006-06-19 | 2008-07-31 | Rothrock Ginger D | Nanoparticle fabrication methods, systems, and materials |
| CN100444027C (zh) * | 2006-07-07 | 2008-12-17 | 中国科学院长春应用化学研究所 | 互补结构微图案化制作倒梯形结构的方法 |
| WO2008097278A2 (en) | 2006-09-19 | 2008-08-14 | Molecular Imprints, Inc. | Etch-enhanced technique for lift-off patterning |
| TW200842934A (en) * | 2006-12-29 | 2008-11-01 | Molecular Imprints Inc | Imprint fluid control |
| US20100151031A1 (en) * | 2007-03-23 | 2010-06-17 | Desimone Joseph M | Discrete size and shape specific organic nanoparticles designed to elicit an immune response |
| US8142702B2 (en) * | 2007-06-18 | 2012-03-27 | Molecular Imprints, Inc. | Solvent-assisted layer formation for imprint lithography |
| US20090014917A1 (en) * | 2007-07-10 | 2009-01-15 | Molecular Imprints, Inc. | Drop Pattern Generation for Imprint Lithography |
| US8119052B2 (en) * | 2007-11-02 | 2012-02-21 | Molecular Imprints, Inc. | Drop pattern generation for imprint lithography |
| US8945444B2 (en) * | 2007-12-04 | 2015-02-03 | Canon Nanotechnologies, Inc. | High throughput imprint based on contact line motion tracking control |
| US20090148619A1 (en) * | 2007-12-05 | 2009-06-11 | Molecular Imprints, Inc. | Controlling Thickness of Residual Layer |
| US8361371B2 (en) * | 2008-02-08 | 2013-01-29 | Molecular Imprints, Inc. | Extrusion reduction in imprint lithography |
| US8187515B2 (en) * | 2008-04-01 | 2012-05-29 | Molecular Imprints, Inc. | Large area roll-to-roll imprint lithography |
| US20100096764A1 (en) * | 2008-10-20 | 2010-04-22 | Molecular Imprints, Inc. | Gas Environment for Imprint Lithography |
| US8586126B2 (en) | 2008-10-21 | 2013-11-19 | Molecular Imprints, Inc. | Robust optimization to generate drop patterns in imprint lithography which are tolerant of variations in drop volume and drop placement |
| US8512797B2 (en) * | 2008-10-21 | 2013-08-20 | Molecular Imprints, Inc. | Drop pattern generation with edge weighting |
| US8652393B2 (en) | 2008-10-24 | 2014-02-18 | Molecular Imprints, Inc. | Strain and kinetics control during separation phase of imprint process |
| US20100112220A1 (en) * | 2008-11-03 | 2010-05-06 | Molecular Imprints, Inc. | Dispense system set-up and characterization |
| US8464838B2 (en) * | 2009-01-26 | 2013-06-18 | Kenneth C. Brooks | System and method for generating mechanical movement |
| US20100187834A1 (en) * | 2009-01-27 | 2010-07-29 | Brooks Kenneth C | System and method for generating electrical energy |
| NL2003875A (en) * | 2009-02-04 | 2010-08-05 | Asml Netherlands Bv | Imprint lithography method and apparatus. |
| JP2012522327A (ja) * | 2009-03-23 | 2012-09-20 | インテバック・インコーポレイテッド | パターニングされた媒体の溝と島の比率の最適化のための方法 |
| US20110030770A1 (en) | 2009-08-04 | 2011-02-10 | Molecular Imprints, Inc. | Nanostructured organic solar cells |
| US20110084417A1 (en) | 2009-10-08 | 2011-04-14 | Molecular Imprints, Inc. | Large area linear array nanoimprinting |
| JP2015088667A (ja) * | 2013-10-31 | 2015-05-07 | 株式会社東芝 | 微細加工システム、微細加工装置、および微細加工方法 |
| US10527494B2 (en) * | 2014-09-26 | 2020-01-07 | Korea Intitute of Machinery & Materials | Substrate on which multiple nanogaps are formed, and manufacturing method therefor |
| EP3215895B1 (de) * | 2014-11-03 | 2022-02-23 | Universität Osnabrück | Verfahren zur durchführung eines kapillar-nanodrucks, feld von tintentropfen und feld von drähten erhältlich nach dem verfahren |
| JP6938024B2 (ja) * | 2015-10-22 | 2021-09-22 | 国立研究開発法人産業技術総合研究所 | 被印刷基材の表面構造及びその製造方法 |
| JP2017152673A (ja) * | 2015-11-05 | 2017-08-31 | ボード・オブ・リージェンツ, ジ・ユニバーシティー・オブ・テキサス・システム | ジェット・アンド・フラッシュ・インプリントリソグラフィにおけるマルチフィールドオーバーレイ制御 |
| US11294277B2 (en) * | 2018-07-25 | 2022-04-05 | Canon Kabushiki Kaisha | Process of imprinting a substrate with fluid control features |
| JP7649334B2 (ja) * | 2020-07-06 | 2025-03-19 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | マイクロ構造および/またはナノ構造を作製する方法および装置 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9505165B2 (en) | 2011-09-30 | 2016-11-29 | Fujifilm Corporation | Nanoimprinting mold, method for producing the nanoimprinting mold, nanoimprinting method using the nanoimprinting mold, and method for producing patterned substrates |
Also Published As
| Publication number | Publication date |
|---|---|
| US7442336B2 (en) | 2008-10-28 |
| MY138554A (en) | 2009-06-30 |
| EP1656242B1 (en) | 2011-10-19 |
| US20110140302A1 (en) | 2011-06-16 |
| US7708926B2 (en) | 2010-05-04 |
| TWI319746B (en) | 2010-01-21 |
| US20050061773A1 (en) | 2005-03-24 |
| ATE529237T1 (de) | 2011-11-15 |
| KR101121015B1 (ko) | 2012-03-16 |
| KR20070048129A (ko) | 2007-05-08 |
| EP1656242A4 (en) | 2008-01-02 |
| EP1656242A2 (en) | 2006-05-17 |
| US8057725B2 (en) | 2011-11-15 |
| KR101108496B1 (ko) | 2012-01-31 |
| KR20110105880A (ko) | 2011-09-27 |
| JP2007502715A (ja) | 2007-02-15 |
| TW200518913A (en) | 2005-06-16 |
| WO2005021156A2 (en) | 2005-03-10 |
| CN1839023A (zh) | 2006-09-27 |
| WO2005021156A3 (en) | 2005-11-03 |
| US7910042B2 (en) | 2011-03-22 |
| US20080174046A1 (en) | 2008-07-24 |
| CN100532055C (zh) | 2009-08-26 |
| US20100140841A1 (en) | 2010-06-10 |
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