JP4481698B2 - 加工装置 - Google Patents

加工装置 Download PDF

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Publication number
JP4481698B2
JP4481698B2 JP2004096992A JP2004096992A JP4481698B2 JP 4481698 B2 JP4481698 B2 JP 4481698B2 JP 2004096992 A JP2004096992 A JP 2004096992A JP 2004096992 A JP2004096992 A JP 2004096992A JP 4481698 B2 JP4481698 B2 JP 4481698B2
Authority
JP
Japan
Prior art keywords
resist
mold
wafer
aperture
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004096992A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005286062A5 (cg-RX-API-DMAC7.html
JP2005286062A (ja
Inventor
俊伸 時田
裕久 太田
英悟 川上
卓 中村
和之 春見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2004096992A priority Critical patent/JP4481698B2/ja
Priority to US11/093,067 priority patent/US7815425B2/en
Priority to EP05006759A priority patent/EP1582923B1/en
Publication of JP2005286062A publication Critical patent/JP2005286062A/ja
Publication of JP2005286062A5 publication Critical patent/JP2005286062A5/ja
Application granted granted Critical
Publication of JP4481698B2 publication Critical patent/JP4481698B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/14—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles in several steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/14—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles in several steps
    • B29C2043/141—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles in several steps for making single layer articles
    • B29C2043/142—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles in several steps for making single layer articles by moving a single mould or the article progressively, i.e. portionwise
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
    • B29C2043/3615—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices
    • B29C2043/3634—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices having specific surface shape, e.g. grooves, projections, corrugations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
JP2004096992A 2004-03-29 2004-03-29 加工装置 Expired - Fee Related JP4481698B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004096992A JP4481698B2 (ja) 2004-03-29 2004-03-29 加工装置
US11/093,067 US7815425B2 (en) 2004-03-29 2005-03-28 Processing apparatus
EP05006759A EP1582923B1 (en) 2004-03-29 2005-03-29 Processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004096992A JP4481698B2 (ja) 2004-03-29 2004-03-29 加工装置

Publications (3)

Publication Number Publication Date
JP2005286062A JP2005286062A (ja) 2005-10-13
JP2005286062A5 JP2005286062A5 (cg-RX-API-DMAC7.html) 2007-06-07
JP4481698B2 true JP4481698B2 (ja) 2010-06-16

Family

ID=34879935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004096992A Expired - Fee Related JP4481698B2 (ja) 2004-03-29 2004-03-29 加工装置

Country Status (3)

Country Link
US (1) US7815425B2 (cg-RX-API-DMAC7.html)
EP (1) EP1582923B1 (cg-RX-API-DMAC7.html)
JP (1) JP4481698B2 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8826847B2 (en) 2011-02-15 2014-09-09 Kabushiki Kaisha Toshiba Imprinting apparatus, imprinting method, and manufacturing method of uneven plate

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US8999218B2 (en) * 2005-06-06 2015-04-07 Canon Kabushiki Kaisha Process for producing member having pattern, pattern transfer apparatus, and mold
JP2007128952A (ja) * 2005-11-01 2007-05-24 Hst Kk ３次元構造のコイル体及びその製造方法、並びに磁気センサ及びその製造方法
US20070138699A1 (en) * 2005-12-21 2007-06-21 Asml Netherlands B.V. Imprint lithography
EP1832933B1 (en) * 2006-03-08 2008-10-01 Erich Thallner Device manufacturing method and substrate processing apparatus, and substrate support structure
JP5007091B2 (ja) * 2006-09-21 2012-08-22 東芝機械株式会社 転写装置
JP4928963B2 (ja) * 2007-01-30 2012-05-09 東芝機械株式会社 転写方法及び装置
US8361371B2 (en) * 2008-02-08 2013-01-29 Molecular Imprints, Inc. Extrusion reduction in imprint lithography
JP4799575B2 (ja) * 2008-03-06 2011-10-26 株式会社東芝 インプリント方法
WO2009139448A1 (ja) * 2008-05-16 2009-11-19 昭和電工株式会社 パターン形成方法
JP2010080631A (ja) * 2008-09-25 2010-04-08 Canon Inc 押印装置および物品の製造方法
US8237133B2 (en) * 2008-10-10 2012-08-07 Molecular Imprints, Inc. Energy sources for curing in an imprint lithography system
JP5376930B2 (ja) 2008-12-19 2013-12-25 キヤノン株式会社 液体吐出ヘッドの製造方法
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US20120153518A1 (en) * 2009-08-31 2012-06-21 Yuiti Fujii Apparatus for Manufacturing Wafer Lens, Molding Die, And Method for Manufacturing Wafer Lens
US20110084417A1 (en) * 2009-10-08 2011-04-14 Molecular Imprints, Inc. Large area linear array nanoimprinting
JP5379636B2 (ja) * 2009-10-14 2013-12-25 キヤノン株式会社 インプリント装置及び物品の製造方法
JP5809409B2 (ja) 2009-12-17 2015-11-10 キヤノン株式会社 インプリント装置及びパターン転写方法
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JP5392145B2 (ja) * 2010-02-26 2014-01-22 大日本印刷株式会社 インプリント方法およびインプリント装置
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US9216539B2 (en) 2011-02-15 2015-12-22 Kabushiki Kaisha Toshiba Imprinting apparatus, imprinting method, and manufacturing method of uneven plate

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EP1582923B1 (en) 2012-10-10
US7815425B2 (en) 2010-10-19

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