JP4475159B2 - 光照射装置 - Google Patents

光照射装置 Download PDF

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Publication number
JP4475159B2
JP4475159B2 JP2005114858A JP2005114858A JP4475159B2 JP 4475159 B2 JP4475159 B2 JP 4475159B2 JP 2005114858 A JP2005114858 A JP 2005114858A JP 2005114858 A JP2005114858 A JP 2005114858A JP 4475159 B2 JP4475159 B2 JP 4475159B2
Authority
JP
Japan
Prior art keywords
light
optical
laser
optical member
light irradiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005114858A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006293092A (ja
Inventor
英雄 川部
直司 名田
亮 輿石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2005114858A priority Critical patent/JP4475159B2/ja
Priority to KR1020060031922A priority patent/KR20060108219A/ko
Priority to US11/279,362 priority patent/US7952819B2/en
Priority to TW095113019A priority patent/TW200643468A/zh
Priority to CNB2006100820720A priority patent/CN100443951C/zh
Publication of JP2006293092A publication Critical patent/JP2006293092A/ja
Application granted granted Critical
Publication of JP4475159B2 publication Critical patent/JP4475159B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0933—Systems for active beam shaping by rapid movement of an element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Laser Beam Processing (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
JP2005114858A 2005-04-12 2005-04-12 光照射装置 Expired - Fee Related JP4475159B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005114858A JP4475159B2 (ja) 2005-04-12 2005-04-12 光照射装置
KR1020060031922A KR20060108219A (ko) 2005-04-12 2006-04-07 광학 장치, 광조사 장치 및 광조사 방법
US11/279,362 US7952819B2 (en) 2005-04-12 2006-04-11 Optical device, light irradiation apparatus and light irradiation method
TW095113019A TW200643468A (en) 2005-04-12 2006-04-12 Optical device, light irradiation apparatus and light irradiation method
CNB2006100820720A CN100443951C (zh) 2005-04-12 2006-04-12 光学器件、光辐射装置以及光辐射方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005114858A JP4475159B2 (ja) 2005-04-12 2005-04-12 光照射装置

Publications (2)

Publication Number Publication Date
JP2006293092A JP2006293092A (ja) 2006-10-26
JP4475159B2 true JP4475159B2 (ja) 2010-06-09

Family

ID=37077540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005114858A Expired - Fee Related JP4475159B2 (ja) 2005-04-12 2005-04-12 光照射装置

Country Status (5)

Country Link
US (1) US7952819B2 (enExample)
JP (1) JP4475159B2 (enExample)
KR (1) KR20060108219A (enExample)
CN (1) CN100443951C (enExample)
TW (1) TW200643468A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110094778A1 (en) * 2009-10-27 2011-04-28 Cheng-Po Yu Circuit board and fabrication method thereof
JP5853331B2 (ja) * 2011-03-11 2016-02-09 株式会社ブイ・テクノロジー レーザ照射装置及びそれを使用した液晶表示パネルの輝点修正方法
JP2013193110A (ja) * 2012-03-21 2013-09-30 Sumitomo Heavy Ind Ltd レーザ加工装置及びレーザ加工方法
CN120786811A (zh) * 2024-04-09 2025-10-14 泓瀚科技股份有限公司 电路板上调整助焊剂分布位置的方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4767293A (en) 1986-08-22 1988-08-30 Copeland Corporation Scroll-type machine with axially compliant mounting
CN1030865C (zh) * 1992-05-15 1996-01-31 中国科学院上海光学精密机械研究所 全方位光束检验仪
JPH0669928A (ja) 1992-08-17 1994-03-11 Fuji Xerox Co Ltd ルーティング方式
JP3091075B2 (ja) * 1994-03-30 2000-09-25 ローム株式会社 重力感応型映像装置
US5525810A (en) * 1994-05-09 1996-06-11 Vixel Corporation Self calibrating solid state scanner
JPH08338962A (ja) 1995-06-13 1996-12-24 Toshiba Corp ビームホモジナイザ及びレーザ加工装置
JP3894509B2 (ja) * 1995-08-07 2007-03-22 キヤノン株式会社 光学装置、露光装置およびデバイス製造方法
JPH11156579A (ja) 1996-11-15 1999-06-15 Amada Co Ltd レーザー切断方法、レーザーピアス方法、レーザー溶接方法、およびレーザー加飾方法並びに前記各方法に使用するレーザー加工ヘッド
AU752405B2 (en) * 1998-03-27 2002-09-19 Hideyoshi Horimai Three-dimensional image display
JP3437088B2 (ja) 1998-06-04 2003-08-18 住友重機械工業株式会社 ビーム回転機能付ホモジナイザ装置及びこれを用いたレーザ加工装置
JP2000167682A (ja) 1998-12-03 2000-06-20 Amada Eng Center Co Ltd レーザ加工ヘッド
JP2001350117A (ja) 2000-06-09 2001-12-21 Hamamatsu Kagaku Gijutsu Kenkyu Shinkokai レーザ光強度分布平坦化マスクおよびそれを用いたレーザメッキ装置ならびにレーザメッキ方法
DE10049557B4 (de) * 2000-10-06 2004-09-02 Microlas Lasersystem Gmbh Vorrichtung zum Umwandeln der Intensitätsverteilung eines Laserstrahls
CN2454077Y (zh) * 2000-12-12 2001-10-17 魏学惠 激光加工机光学装置
CN1205490C (zh) * 2001-12-31 2005-06-08 深圳朗光科技有限公司 可调谐光纤衰减器

Also Published As

Publication number Publication date
JP2006293092A (ja) 2006-10-26
TW200643468A (en) 2006-12-16
US20060226381A1 (en) 2006-10-12
TWI325066B (enExample) 2010-05-21
CN1847921A (zh) 2006-10-18
US7952819B2 (en) 2011-05-31
CN100443951C (zh) 2008-12-17
KR20060108219A (ko) 2006-10-17

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