TWI325066B - - Google Patents

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Publication number
TWI325066B
TWI325066B TW095113019A TW95113019A TWI325066B TW I325066 B TWI325066 B TW I325066B TW 095113019 A TW095113019 A TW 095113019A TW 95113019 A TW95113019 A TW 95113019A TW I325066 B TWI325066 B TW I325066B
Authority
TW
Taiwan
Prior art keywords
light
optical
light source
main faces
directional
Prior art date
Application number
TW095113019A
Other languages
English (en)
Chinese (zh)
Other versions
TW200643468A (en
Inventor
Hideo Kawabe
Naoji Nada
Ryo Koshiishi
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200643468A publication Critical patent/TW200643468A/zh
Application granted granted Critical
Publication of TWI325066B publication Critical patent/TWI325066B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0933—Systems for active beam shaping by rapid movement of an element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
TW095113019A 2005-04-12 2006-04-12 Optical device, light irradiation apparatus and light irradiation method TW200643468A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005114858A JP4475159B2 (ja) 2005-04-12 2005-04-12 光照射装置

Publications (2)

Publication Number Publication Date
TW200643468A TW200643468A (en) 2006-12-16
TWI325066B true TWI325066B (enExample) 2010-05-21

Family

ID=37077540

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113019A TW200643468A (en) 2005-04-12 2006-04-12 Optical device, light irradiation apparatus and light irradiation method

Country Status (5)

Country Link
US (1) US7952819B2 (enExample)
JP (1) JP4475159B2 (enExample)
KR (1) KR20060108219A (enExample)
CN (1) CN100443951C (enExample)
TW (1) TW200643468A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110094778A1 (en) * 2009-10-27 2011-04-28 Cheng-Po Yu Circuit board and fabrication method thereof
JP5853331B2 (ja) * 2011-03-11 2016-02-09 株式会社ブイ・テクノロジー レーザ照射装置及びそれを使用した液晶表示パネルの輝点修正方法
JP2013193110A (ja) * 2012-03-21 2013-09-30 Sumitomo Heavy Ind Ltd レーザ加工装置及びレーザ加工方法
CN120786811A (zh) * 2024-04-09 2025-10-14 泓瀚科技股份有限公司 电路板上调整助焊剂分布位置的方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4767293A (en) 1986-08-22 1988-08-30 Copeland Corporation Scroll-type machine with axially compliant mounting
CN1030865C (zh) * 1992-05-15 1996-01-31 中国科学院上海光学精密机械研究所 全方位光束检验仪
JPH0669928A (ja) 1992-08-17 1994-03-11 Fuji Xerox Co Ltd ルーティング方式
JP3091075B2 (ja) * 1994-03-30 2000-09-25 ローム株式会社 重力感応型映像装置
US5525810A (en) * 1994-05-09 1996-06-11 Vixel Corporation Self calibrating solid state scanner
JPH08338962A (ja) 1995-06-13 1996-12-24 Toshiba Corp ビームホモジナイザ及びレーザ加工装置
JP3894509B2 (ja) * 1995-08-07 2007-03-22 キヤノン株式会社 光学装置、露光装置およびデバイス製造方法
JPH11156579A (ja) 1996-11-15 1999-06-15 Amada Co Ltd レーザー切断方法、レーザーピアス方法、レーザー溶接方法、およびレーザー加飾方法並びに前記各方法に使用するレーザー加工ヘッド
EA003175B1 (ru) * 1998-03-27 2003-02-27 Оптуэр Корпорейшн Дисплей для создания трехмерного изображения
JP3437088B2 (ja) 1998-06-04 2003-08-18 住友重機械工業株式会社 ビーム回転機能付ホモジナイザ装置及びこれを用いたレーザ加工装置
JP2000167682A (ja) 1998-12-03 2000-06-20 Amada Eng Center Co Ltd レーザ加工ヘッド
JP2001350117A (ja) 2000-06-09 2001-12-21 Hamamatsu Kagaku Gijutsu Kenkyu Shinkokai レーザ光強度分布平坦化マスクおよびそれを用いたレーザメッキ装置ならびにレーザメッキ方法
DE10049557B4 (de) * 2000-10-06 2004-09-02 Microlas Lasersystem Gmbh Vorrichtung zum Umwandeln der Intensitätsverteilung eines Laserstrahls
CN2454077Y (zh) * 2000-12-12 2001-10-17 魏学惠 激光加工机光学装置
CN1205490C (zh) * 2001-12-31 2005-06-08 深圳朗光科技有限公司 可调谐光纤衰减器

Also Published As

Publication number Publication date
CN100443951C (zh) 2008-12-17
KR20060108219A (ko) 2006-10-17
TW200643468A (en) 2006-12-16
US20060226381A1 (en) 2006-10-12
JP2006293092A (ja) 2006-10-26
US7952819B2 (en) 2011-05-31
JP4475159B2 (ja) 2010-06-09
CN1847921A (zh) 2006-10-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees